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Nano copper-tin alloy conductive ink and preparation method and usage of nano copper-tin alloy conductive ink

A conductive ink and tin alloy technology, applied in the field of material chemistry, to avoid the migration of silver ions, improve oxidation resistance, improve mechanical properties and solderability

Active Publication Date: 2012-09-19
深圳市尊业纳米材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the above-mentioned technical problems, the present invention proposes a new nano-copper-tin alloy conductive ink and its preparation method and use method. The sintering temperature of the nano-copper-tin alloy conductive ink proposed by the present invention is reduced to below 150 ° C. At the same time, the Compared with nano-copper, nano-silver and nano-copper-silver alloy, the anti-oxidation ability, mechanical properties and solderability of this nano-copper-tin alloy have been significantly improved, and the problem of silver ion migration will not occur.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A nano-copper-tin alloy conductive ink is prepared by the following method: in parts by weight, 8 parts of nano-copper-tin alloy powders with an average particle diameter of 50nm, 90 parts of solvent and 2 parts of auxiliary agents are weighed. The mass percentages of copper and tin contained in the nano-copper-tin alloy powder are 70% and 30% respectively, and 15 parts of water, 50 parts of isopropanol, 13 parts of ethylene glycol ether and 12 parts of methyl ethyl ketone are included in the 90 parts of solvent , The 2 parts of auxiliary agents include 0.5 part of surfactant-lauric acid, 0.5 part of dispersant-alkyl mercaptan and 1 part of adhesion promoter-modified phenolic resin. Mix 15 parts of water, 50 parts of isopropanol, 13 parts of ethylene glycol ether, and 12 parts of butanone to obtain 90 parts of solvent, add 8 parts of nano-copper-tin alloy powder to 90 parts of solvent, and add 0.5 1 part of lauric acid and 0.5 part of alkyl mercaptan, vibrate, grind and...

Embodiment 2

[0050] A nano-copper-tin alloy conductive ink is prepared by the following method: in parts by weight, 60 parts of nano-copper-tin alloy powders with an average particle diameter of 10nm, 20 parts of solvent and 20 parts of auxiliary agents are weighed. The mass percentages of copper and tin contained in the nano-copper-tin alloy powder are 99.5% and 0.5% respectively, and the 20 parts of solvents include 5 parts of water, 13 parts of isopropanol and 2 parts of butyl acetate, and the 20 parts of additives Including 3 parts of surfactant-sodium dodecylbenzenesulfonate, 5 parts of dispersant-alkyl acid, 5 parts of coupling agent-KH550 coupling agent produced by Shin-Etsu Corporation, 3 parts of reducing agent-formic acid and 4 parts Adhesion Promoter - Modified Epoxy Resin. Mix 5 parts of water, 13 parts of isopropanol and 2 parts of butyl acetate to prepare 20 parts of solvent, add 60 parts of nano-copper-tin alloy powder to 20 parts of solvent, and add 3 parts of surfactant-12...

Embodiment 3

[0053] A nano-copper-tin alloy conductive ink is prepared by the following method: in parts by weight, 60 parts of nano-copper-tin alloy powders with an average particle diameter of 20nm, 38 parts of solvent and 2 parts of auxiliary agents are weighed. The nano-copper-tin alloy powder contains 99.4% and 0.59% by mass of copper and tin, respectively, and 0.01% by mass of rare earth lanthanum. The 38 parts of solvent contain 10 parts of water, 23 parts of ethanol and 5 Parts of diethylene glycol ether, the 2 parts of auxiliary agent is dispersant-alkanoic acid. Mix 10 parts of water, 23 parts of ethanol and 5 parts of diethylene glycol ether to obtain 38 parts of solvent, add 60 parts of nano-copper-tin alloy powder to 38 parts of solvent, and add 2 parts of dispersant-alkyl acid, vibrate, grind and disperse for 10 minutes in an ultrasonic environment. After the dispersion is completed, a nano-copper-tin alloy conductive ink is prepared.

[0054] The nano-copper-tin alloy condu...

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Abstract

The invention belongs to the technical field of material chemistry, relates to conductive ink, and particularly relates to nano copper-tin alloy conductive ink and a preparation method and usage of the nano copper-tin alloy conductive ink. Nano copper-silver alloy is replaced by nano copper-tin alloy to be used as conductive filler in the conductive ink, sintering temperature of the conductive ink is lowered, and when the nano copper-tin alloy conductive ink is compared with nano copper-silver alloy conductive ink, antioxidant capacity of the conductive ink during sintering is improved, mechanical property and solderability of a conductive circuit formed after sintering of the conductive ink are improved, and the problem of silver ion migration is avoided. Further, since rare earth metal elements are doped in the nano copper-tin alloy, grain boundary of the nano copper-tin alloy is increased, electron scattering power is increased, and conductivity is improved as compared with that of nano copper alloy. On the other hand, tin is much cheaper than silver, so that raw material cost of the nano copper-tin alloy conductive ink is reduced.

Description

【Technical field】 [0001] The invention belongs to the technical field of material chemistry and relates to a conductive ink, in particular to a nano-copper-tin alloy conductive ink and a preparation method and application method thereof. 【Background technique】 [0002] Conductive inks are widely used in printed circuit and electronic packaging industries. Conductivity According to the different conductive fillers, it can be divided into carbon paste and metal. From the comparison of conductivity, the conductive filler of metal has the best conductivity, followed by carbon paste. Metals include gold-based conductive, silver-based conductive and copper-based conductive. Gold-based conductive inks have the best oxidation resistance, but the price is relatively high. Silver-based conductive inks are cheaper than gold-based conductive inks, and their conductivity is higher than copper-based and gold-based conductive inks. Both systems are higher, but silver-based conductive inks...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/02H05K1/09C09D11/52
Inventor 胡木林龙集贤
Owner 深圳市尊业纳米材料有限公司
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