10 results about "Silver ion transport" patented technology

The invention relates to the technical field of material detection, in particular to a silver coating adhesive force detection method based on multi-frequency impedance imaging, which comprises the following steps: applying a dual-mode multi-frequency excitation signal to the surface of a silver coating through an attached microelectrode array, synchronously acquiring voltage-current response data, and generating a dual-mode multi-frequency impedance original data set; performing time-varying impedance phase-locked separation on the dual-mode multi-frequency impedance original data set, extracting a dynamic impedance component of a coating-matrix interface region, and reconstructing a three-dimensional sub-interface impedance distribution diagram; and outputting an adhesive force quantized value through an oscillation frequency-adhesive force conversion model according to the spatial oscillation frequency characteristics of the impedance phase in the three-dimensional sub-interface impedance distribution diagram. According to the invention, a double-phase-locked loop system is adopted to realize the time-varying component demodulation of the impedance response of the silver coating-matrix interface, the low-frequency dynamic impedance signal modulated by silver ion migration is effectively extracted, and the weak change of the interface bonding state is sensitively reflected.

The invention relates to the field of material science and surface engineering, particularly discloses a preparation method of an antibacterial coating on the surface of a sanitary product, and aims to solve the technical problem that an existing antibacterial coating is difficult to synergistically realize high adhesive force, long-acting broad-spectrum antibacterial property and cleaning and wear resistance on multiple types of substrates. The method comprises the following steps: carrying out acid-base etching and plasma composite pretreatment on a ceramic, stainless steel or engineering plastic base material; preparing a multifunctional composite sol containing a silane coupling agent, nano titanium dioxide, a silver-zinc composite oxide and fluorinated acrylate; a wet film is formed through gradient dip-coating, and a three-dimensional cross-linked network is constructed through segmented thermocuring; and surface hydrophobic enrichment and silver ion migration are induced through low-energy electron beam irradiation, so that a double-function gradient structure with hydrophobic outside and slow release inside is formed. According to the technical scheme, strong adhesion, super-hydrophobicity, broad-spectrum antibacterial performance and excellent durability of coatings on various bathroom base materials are achieved, the process is compatible with normal-pressure continuous production, and the industrial applicability is remarkably improved.

The invention provides transparent conductive ink for a touch display screen and a preparation method and application of the transparent conductive ink, and belongs to the technical field of ink, the transparent conductive ink comprises conductive filler, and the conductive filler comprises silver nanowires and a conductive metal organic framework layer coating the surfaces of the silver nanowires; a polymer binder, wherein the polymer binder comprises a furan functionalized polyurethane prepolymer and a bismaleimide cross-linking agent; and an organic solvent; wherein the conductive metal organic framework layer comprises a hexaaminotriphenyl-nickel coordination polymer. According to the invention, the silver nanowire is coated in situ by adopting the hexaaminotriphenyl-nickel coordination polymer, so that the problems of micro short circuit caused by silver ion migration and haze increase caused by high contact resistance are effectively avoided, the conductivity of the display module is improved, and the service life of the display module is prolonged.

This application provides a graphene-bonded silver alloy wire and its preparation process, belonging to the field of bonding wire technology for packaging. The preparation process of this graphene-bonded silver alloy wire comprises the following components by weight percentage: graphene content 1000-4500 ppm; Pd content 10000-20000 ppm; the balance being Ag and impurities. With the addition of low gold and palladium content, the graphene-bonded silver alloy wire effectively improves the susceptibility of bonded silver alloy wire to moisture and sulfur / chlorine corrosion, thus migrating silver ions. It achieves the corrosion resistance and silver ion migration inhibition effects of traditional bonded silver alloy wires, significantly reducing material costs and possessing significant scientific research value and application prospects. Furthermore, the circular limiting ring seat, positioning groove, and conical pressure block of the high-tension wire drawing machine in the preparation process enable the high-tension wire drawing machine to quickly fix the I-beam and the wire, greatly improving production efficiency.

The embodiment of the invention provides a graphene bonding silver alloy wire and a preparation process thereof, and belongs to the technical field of bonding wires for packaging. The graphene bonded silver alloy wire is composed of the following components in percentage by weight: 1000 to 4500 ppm of graphene; the content of Pd is in a range of 10000 to 20000 ppm; and the balance of Ag and impurities. According to the graphene bonded silver alloy wire, under the condition of adding low-content gold and palladium, the situation that the bonded silver alloy wire is prone to being corroded by moisture and sulfur and chlorine to cause silver ion migration is effectively improved, the effects of corrosion resistance and silver ion migration inhibition of a traditional bonded silver alloy wire are achieved, the material cost is remarkably reduced, and the service life of the bonded silver alloy wire is prolonged. Important scientific research values and application prospects are realized; and a circular limiting ring seat, a positioning groove and a conical wire pressing block of the large-tension wire drawing machine in the preparation process are matched, so that the large-tension wire drawing machine can quickly fix the spool and the wire, and the production efficiency is greatly improved.

This application discloses a Schottky diode and its fabrication method, relating to the field of semiconductor chip manufacturing technology. The Schottky diode fabrication method first provides a Schottky diode chip with a barrier layer. Then, a front electrode is formed on the side of the Schottky diode chip with the barrier layer, the front electrode comprising a first metal layer, a nickel metal layer, and a gold metal layer; a second metal layer is formed on the side of the Schottky diode chip without the barrier layer as a back electrode. The first metal layer does not include silver. Thus, the front electrode of the fabricated Schottky diode does not contain silver ions, thereby avoiding the problem of silver ion migration and extending the lifespan of the Schottky diode.

The invention provides conductive paste for a solar cell, a preparation method of the conductive paste and the solar cell. The preparation method of the conductive slurry comprises the steps that conductive particles are provided, each conductive particle comprises a copper core, a compact silver layer covering the copper core, a loose middle silver layer covering the compact silver layer and a reinforced outer silver layer covering the loose middle silver layer, and the silver grain size of the loose middle silver layer is larger than that of the reinforced outer silver layer; providing glass powder and an organic carrier; and mixing and stirring the conductive particles, the glass powder and the organic carrier to obtain the conductive paste. Through mutual cooperation of the compact silver layer, the loose middle silver layer and the reinforced outer silver layer, the bonding force of the conductive particles and the silicon wafer is improved, the silver ion mobility is reduced, the reliability of the solar cell is improved, and the service life of the solar cell is prolonged.

The application relates to the technical field of conductive paste, and discloses a lead-free environment-friendly silver paste suitable for high-temperature co-fired ceramic and a preparation method, aiming to solve the technical problem that the components introduced for inhibiting silver ion migration of the lead-free silver paste in the prior art can easily cause the interface electric contact performance and weldability of the lead-free silver paste and a ceramic substrate to be deteriorated, a composite glass phase containing a specific interface buffer unit and a migration inhibition unit is designed, the mass ratio of the two is controlled, the buffer unit preferentially forms a benign interface layer, a stable working environment is provided for the inhibition unit, the silver paste can realize excellent silver ion migration resistance reliability, low resistance ohmic contact between the silver paste and the ceramic substrate and good welding wettability under the premise of being lead-free and environment-friendly, and the comprehensive performance meets the application requirements of the high-temperature co-fired ceramic.

This application discloses an optical adhesive, its preparation method, and a display screen. The optical adhesive includes a resin matrix and a dehumidifying additive. The dehumidifying additive includes a modified porous material. The modified porous material includes a porous material matrix, an aminosilane coupling agent linked to hydroxyl groups on the surface of the porous material matrix, and an acrylate grafted with amino groups of the aminosilane coupling agent. On one hand, the hydroxyl and amino groups on the surface of the modified porous material chemically adsorb water molecules through hydrogen bonds. On the other hand, the porous structure of the modified porous material can undergo capillary condensation to form multilayer adsorption, trapping water molecules within the modified porous material. This allows the optical adhesive to maintain structural stability under hygroscopic conditions, thereby reducing the moisture content around the silver paste lines and fundamentally reducing silver ion migration caused by moisture intrusion into the silver paste lines, thus improving the long-term operational reliability of the display screen.

This invention discloses a semiconductor device and its fabrication method. The semiconductor device includes an active region and a passive region surrounding the active region. The semiconductor device also includes a substrate, an epitaxial structure, a bonding structure, and at least one shielding structure. The shielding structure provides shielding protection for the bonding structure and forms an ohmic contact with the two-dimensional electron gas located in the passive region. By adding a shielding structure and forming an ohmic contact with the two-dimensional electron gas in the passive region, the migration of silver ions from the surface mount silver paste to the bonding structure during the packaging process can be effectively prevented. This ensures the stability of the bonding structure and the electrodes connected to the bonding structure, avoids short circuits between the bonding structure, the electrodes connected to the bonding structure, and the source electrode. Furthermore, the ohmic contact between the shielding structure and the two-dimensional electron gas enhances the shielding effect and ensures the normal operation of the semiconductor device.