The embodiment of the invention provides a
chip packaging structure and a preparation method of the
chip packaging structure, and relates to the technical field of
chip packaging, and the chip packaging structure comprises a
dielectric layer and a chip packaging module arranged on the
dielectric layer. The chip packaging module comprises a plurality of first storage chips, a logic chip, at least one first heat dissipation block, at least one second heat dissipation block and a
plastic packaging layer. The first storage chips are arranged on a
dielectric layer in a stacked mode, the first heat dissipation blocks are arranged on the
dielectric layer, the logic chip is arranged on the first heat dissipation blocks, the second heat dissipation blocks are arranged on the logic chip, and extend to the surface of the
plastic packaging layer. Compared with the prior art, by arranging the first heat dissipation block and the second heat dissipation block, the good heat dissipation effect of the logic chip can be guaranteed, meanwhile, through the stacking structure of the first storage chip, stacking of multiple chips is achieved, the stacking number is increased, and meanwhile the good heat dissipation effect is guaranteed.