40results about How to "Reduce stack thickness" patented technology

A touch sensing film structure including a touch-sensitive device layer, a barrier layer and a flexible substrate is provided. The touch-sensitive device layer has a first surface and a second surface opposite to the first surface. The barrier layer is formed on the first surface or the second surface or integrated with the touch-sensitive device layer to form a multi-function layer. The flexible substrate can stack with the barrier layer and the touch-sensitive device layer, or stack with the multi-function layer.

A touch display apparatus with a transparent antenna and a touch display apparatus using same are disclosed. The touch display apparatus including a cover glass, a display module, and a touch module. The touch module is disposed between the cover glass and the display module. The touch module includes a transparent substrate, a metal mesh touch sensor, and an antenna. The metal mesh touch sensor is disposed on at least one surface of the transparent substrate and configured to form a viewable area, wherein the viewable area comprises at least an overlapping dummy area free of a vertical projection of the metal mesh touch sensor. The antenna is disposed on the at least one surface of the transparent substrate, and at least portion of the antenna being located in the overlapping dummy area, wherein the antenna and the metal mesh touch sensor are insulated from each other.

A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an interposer; forming a first encapsulant on the interposer for encapsulating the first semiconductor elements; disposing a plurality of second semiconductor elements on the first semiconductor elements; forming a second encapsulant on the first semiconductor elements and the first encapsulant for encapsulating the second semiconductor elements; and thinning the interposer, thereby reducing the overall stack thickness and preventing warpage of the interposer.

The invention relates to an interconnecting wire structure and a forming method thereof. A semiconductor substrate is provided; the forming method of the interconnecting wire structure comprises the steps of forming multiple independent interconnecting wires on the semiconductor substrate, wherein grooves are formed between adjacent interconnecting wires; forming a first interlayer dielectric layer to cover the interconnecting wires, and filling a groove in part of the first interlayer dielectric layer until an opening is formed; forming a second interlayer dielectric layer to cover the first interlayer dielectric layer, wherein the opening is sealed by the second interlayer dielectric layer to form an air gap; flattening the second interlayer dielectric layer. The interconnecting wire structure formed by the forming method is improved in quality, and the forming method is simple in process and low in process cost.

The invention discloses a thin 3D fan-out packaging structure and a wafer-level packaging method. Grooves and blind holes whose depths are smaller than those of the grooves are made in a carrier plate; a lining is deposited on the inner wall of the blind hole; a dielectric layer is deposited on at least the bottom of the groove; the blind hole is filled with a metal material; a chip is buried in the groove; a chip welding pad or the blind hole metal material is connected through metal rewiring; the second surface of the carrier plate is thinned, and the metal material in the blind hole is exposed; an electrical derivation point is made on the metal rewiring or the metal material, a stacking chip or a printed circuit board is electrically connected with the chip welding pad through the electrical derivation points on the first surface and the second surface of the carrier plate, and 3D fan-out packaging is realized. The TSV and the lining are firstly made, the TSV and lining depositionquality problem can be solved, and ultra-high density interconnection is better realized; and the dielectric layer is deposited on the bottom part of the groove, the chip can be protected from being etched, and after the carrier plate is thinned, the height difference between the dielectric layer and the TSV hole can accommodate part of second electrical derivation points, and the stacking thickness is reduced.

The invention provides a terminal device, comprising the following parts: a display module, comprising a display structure and a flexible circuit board; a metal structure, arranged between the displaystructure and the flexible circuit board and respectively attached to the display structure and the flexible circuit board, wherein the area of the attaching end surface of the metal structure the islarger than the area of the attaching end surface of the preset area of the flexible circuit board, and is smaller than the area of the attaching end surface of the display structure; a metal middleframe, comprising a groove and ends disposed on both sides of the groove, wherein the predetermined area of the flexible circuit board and the metal structure are disposed in the groove, and the endsare in contact with the display structure. The terminal device provided by the embodiment of the invention can reduce the stack thickness of the whole machine, provide a ground return path and excellent shielding performance, and can improve the temperature rise problem of the terminal device and improve the heat dissipation effect of the terminal device.

A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an interposer; forming a first encapsulant on the interposer for encapsulating the first semiconductor elements; disposing a plurality of second semiconductor elements on the first semiconductor elements; forming a second encapsulant on the first semiconductor elements and the first encapsulant for encapsulating the second semiconductor elements; and thinning the interposer, thereby reducing the overall stack thickness and preventing warpage of the interposer.

The invention discloses a touch display panel. The touch display panel comprises a display module, a linear polarizer and a composite film, wherein the linear polarizer is formed at one side of the display module; the composite film is arranged between the linear polarizer and the display module and comprises a 1 / 2 lambda wave plate, a 1 / 4 lambda wave plate, a first touch electrode layer and a second touch electrode layer; the 1 / 4 lambda wave plate is formed at the side, far from the linear polarizer, of the 1 / 2 lambda wave plate; the first touch electrode layer is formed at any side of the 1 / 4 lambda wave plate; the second touch electrode layer is formed at any side of the 1 / 2 lambda wave plate; the first touch electrode layer and the second touch electrode layer are insulated from each other. The touch display panel has the beneficial effects that touch film layers are internally arranged between the linear polarizer and the display module and are respectively bonded and fixed with the 1 / 2 lambda wave plate and the 1 / 4 lambda wave plate to form the integrated composite film, so that the lamination thickness of the panel is reduced, thus increasing the bending resistance and optical transmittance of the panel, meeting the lightening and thinning requirements of products and being applicable to flexible display panels.

The invention discloses a constructed wetland microbial fuel cell coupling device based on a novel three-dimensional electrode, and belongs to the technical field of sewage treatment, the device comprises a shell, and a bottom layer, an anode layer, a middle layer and a cathode layer are sequentially arranged in the shell from bottom to top. Wherein the bottom layer is filled with coarse gravels, and the middle layer is filled with fine gravels; the anode layer consists of a plurality of titanium tubes which are horizontally arranged and a titanium mesh for connecting the titanium tubes in parallel; openings are formed in the two ends of the titanium tube, through holes are formed in the titanium tube in an array mode, and the titanium tube is filled with a graphite felt core formed in a curled mode. The graphite felt core body can be used for a conductive material strengthening process and can also be used as a supporting material, and compared with an anode cage structure formed by a stainless steel net, the bearing strength is higher; the resistance of the metallic titanium is lower than that of the stainless steel mesh, so that electron transmission and improvement of electron transfer efficiency are facilitated, and the energy recovery efficiency and pollutant removal efficiency of the constructed wetland microbial fuel cell coupling device can be effectively improved.

The present invention discloses an all-in-one card holder comprising an upper housing assembly and a lower housing assembly that are buckled together, wherein the upper housing assembly includes an upper metal housing and an upper terminal module disposed on the upper metal housing; the lower housing assembly includes a lower metal housing and a lower terminal module disposed on the lower metal housing. When the all-in-one card holder is mounted on a circuit board, a portion of the upper metal housing extending rearwards beyond the lower metal housing is located above the circuit board to mount an electronic component on the circuit board. At least a part of the structure of the lower housing assembly is installed in a gap of the circuit board in a sink manner, thereby decreasing the stacking thickness of the all-in-one card holder and the circuit board, and further assisting the ultrathin feature of an electronic device equipped with the all-in-one card holder.

The invention relates to a shellfish freeze drying processing device and a method thereof. According to the invention, the problem that dried shellfish quality is affected when shellfish is heated during the traditional shellfish drying processing is solved. The device successively comprises a freeing chamber, a slicer, a vacuum freeze-drying chamber, a temperature returning chamber and a packing machine. After standing and sand-spitting of shellfish, meat and shell are separated; after separation and cleaning of shellfish meat, the cleaned shellfish meat is put into the freezing chamber and frozen in the environment of minus 4 to 0 DEG C; frozen shellfish meat is sliced; after slicing of shellfish meat, the shellfish meat slices are put in layers in a stock rack and then sent into the vacuum freeze-drying chamber to be freeze-dried in a vacuum environment of minus 45 to minus 35 DEG C; after drying, shellfish meat is put into the temperature returning chamber to return to the temperature of minus 10 DEG C; and packaging is carried out finally. After drying processing, original flavor of shellfish can be better maintained. Before vacuum freeze-drying, the multi-layer stock rack is adopted for layered stock preparation, vibration and flattening, thus reducing stacking thickness of shellfish meat during the vacuum freeze-drying process, enhancing drying efficiency and guaranteeing the drying effect.

The invention relates to a shellfish slicing processing device, and aims to solve the problem that the quality of dried shellfish is influenced since heating is adopted in the traditional shellfish drying processing process. The device sequentially comprises a slicing machine, a vacuum freeze-drying chamber, a temperature returning chamber and a packaging machine, wherein a vacuum environment at a temperature of minus 45-35 DEG C is arranged in the vacuum freeze-drying chamber; natural temperature returning is adopted in the temperature returning chamber, and a noble gas is adopted as a protective gas in the temperature returning chamber. According to the device, the shellfish slicing and drying processing is completed in a mode of slicing, vacuum freeze-drying and temperature-returning package in sequence, so that the original flavor of the shellfish can be well maintained after drying; before vacuum freeze-drying, materials are prepared on a multi-layer preparation shelf layer by layer and are flattened by vibration, so that the stacking thickness of shellfish in the vacuum freeze-drying process can be reduced, the drying efficiency can be improved, and the drying effect can be guaranteed.

The present invention discloses a fully automatic ejector waste cleaning device, comprising a waste cleaning conveyor belt, a paper feeding conveyor belt, an upper ejector mechanism, a lower ejector mechanism, and a paper inserting conveyor mechanism, wherein a plurality of through holes are arranged in a matrix on the surface of the waste cleaning conveyor belt; the paper feeding conveyor belt is arranged at the head end of the waste cleaning conveyor belt; the upper ejector mechanism can be raised and lowered above the waste cleaning conveyor belt, and the lower ejector mechanism can be raised and lowered below the waste cleaning conveyor belt, and the upper ejector mechanism and the lower ejector mechanism cooperate to separate the printed product from the waste edge; the paper inserting conveyor mechanism is slidably arranged at the end of the waste cleaning conveyor belt, and the paper inserting conveyor mechanism is driven by a paper receiving driving device to move toward the direction of the waste cleaning conveyor belt to extend between the printed product and the waste edge to hold the printed product, and the printed product is sent to the second stacking device by the paper inserting conveyor mechanism, and the waste edge is sent to the waste frame by the waste cleaning conveyor belt. The present invention realizes fully automatic paper feeding, waste cleaning, and paper collection, speeds up the waste cleaning speed, and improves production efficiency.

The invention provides a pressure-sensitive key and electronic equipment. The pressure-sensitive key comprises a first circuit board, a second circuit board, a first capacitor, a second capacitor and a first connecting piece, the first surface of the first circuit board is opposite to the second surface of the second circuit board; the first surface is provided with a first capacitor, the second surface is provided with a second capacitor, and the first capacitor and the second capacitor are oppositely arranged; the first end of the first connecting piece is connected with the first surface, and the second end of the first connecting piece is connected with the second surface; and the first connecting piece is used for limiting the first surface and the second surface to be parallel to each other. According to the embodiment of the invention, the pressure-sensitive key does not need to be arranged on the surface of the electronic equipment, so that the overall stacking thickness of the electronic equipment is reduced, and the electronic equipment is lighter and thinner.

The invention relates to a camera module and electronic equipment. The camera module comprises a base, a lens, an image acquisition module, a prism and a first anti-shake module. The lens is connected with the base, the image acquisition module comprises a mounting seat, a circuit board and an image sensor, the mounting seat is fixed with the base, the image sensor is provided with a light-sensitive surface, one side of the image sensor opposite to the light-sensitive surface is attached to the circuit board and is electrically connected with the circuit board, and the prism is connected with the base. The prism comprises a first reflective surface, a second reflective surface and a light-transmitting surface, the lens and the image acquisition module are opposite to the light-transmitting surface, the first reflective surface is inclined to the optical axis of the lens, the second reflective surface is inclined to the axis of the image sensor, and the first anti-shake module is arranged in the mounting base and used for driving the image sensor to do translational motion on the side where the light-transmitting surface is located. Therefore, the projection area of the photosensitive surface on the second reflective surface along the axis direction of the image sensor is adjusted, so that the anti-shake effect is improved while the long-focus shooting effect is considered.

The invention discloses a motor and a washing machine. The motor comprises a stator iron core, wherein the stator iron core is provided with an axial through hole, the inner wall of the stator iron core is provided with a plurality of open slots along the circumferential direction, a stator tooth is formed between two adjacent open slots, and the stator tooth at least comprises an equal-width partwith equal tooth width; a rotor core which is arranged in the through hole, wherein a plurality of mounting grooves used for arranging the permanent magnets are formed in the rotor core in the circumferential direction, and a magnetic isolation area used for magnetic isolation and a magnetic conduction area used for magnetic conduction are arranged in the area, outside the mounting grooves, of the rotor core; the magnetic conductive area comprises a first area adjacent to the mounting groove, a second area adjacent to the outer periphery of the rotor core, and a third area connecting the first area and the second area, the width of the third area is equal, and the value range of the width of the third area is + / -0.5 mm of the width of the equal-width part. The power density of the motor can be improved on the premise of reducing the use amount of permanent magnet materials, so that the stack thickness and the axial size of the motor are reduced.

An embodiment of the invention provides a substrate and a preparation method thereof and a display device, relates to the technical field of display, and can solve the problem of substrate deformationcaused by overlarge superimposition stress of a line recognition unit and an insulating layer. The substrate comprises a substrate body, the insulating layer and the line recognition unit, wherein the insulating layer and the line recognition unit are arranged on the substrate body. The insulating layer is provided with a groove; and at least one part of the line recognition unit is located in the groove.

The present invention relates to a drying and processing device of shellfish and solves the problem that during the traditional drying and processing processes of the shellfish, the heating affects the quality of the dried shellfish. The device successively comprises a freezing room, a slicing machine, a vacuum freeze-drying room, a temperature returning room and a packaging machine. The freezing temperature in the freezing room is kept to be -4 to 0 DEG C, the vacuum environment of the vacuum freezing-drying room is at the temperature of -45 to -35 DEG C, and the temperature returning room uses natural temperature returning and rare gas as a protective gas. The shellfish slicing and drying processes are finished in the forms of first freezing, then slicing, then vacuum freeze-drying, and then temperature returning and packaging, so that the dried and processed shellfish can keep the original flavor better. Before the vacuum freeze-drying, multi-layered material preparing racks are used to conduct layered material preparing and the shellfish is vibrated to be spread to be flat, the stacking thickness of the shellfish meat in the vacuum freeze-drying processes is reduced, the drying efficiency is omproved and the drying effects are ensured.

The invention discloses a high-frequency covering film with a high electromagnetic shielding function and a preparation method thereof. The high-frequency covering film sequentially comprises an insulating layer, a bonding layer, a copper foil layer, a first high-frequency bonding layer, a high-frequency insulating layer and a second high-frequency bonding layer from top to bottom, the high-frequency insulating layer is an insulating layer of which the dielectric coefficient is lower than 4.0 and the dielectric loss is lower than 0.015 (@ 10GHz); and the first high-frequency bonding layer andthe second high-frequency bonding layer are both resin adhesive layers with the dielectric coefficient being lower than 4.0, the dielectric loss being 0.002-0.010 (@ 10 GHz) and the water absorption being 0.001-0.5%. According to the invention, the shielding rate can be up to more than 100dB; the dielectric property is good, the dielectric loss is 0.003-0.010 at 10 GHz, and the dielectric coefficient is lower than 4.0; the mechanical property is good, and machining processes such as drilling and hole filling can be coped with; a thick dielectric layer can be designed within a large thickness range, so that signal transmission loss under high frequency is reduced; and soldering tin is good in heat resistance, plate explosion is avoided in the FPC and PCB assembling process, and gas escape is facilitated and plate explosion is avoided through drilling, hole filling and other process designs.

The utility model relates to the technical field of batteries, and discloses a secondary battery monomer roll core structure, a secondary battery monomer and an energy storage device. The secondary battery monomer roll core structure comprises two or more roll windings which are bundled and fixed; the winding groups are formed by winding materials, and each winding group comprises two winding cores; the material comprises an isolating membrane, a negative pole piece and a positive pole piece in the stacking direction, the material comprises two winding areas and a pole piece interruption area arranged between the two winding areas in the length direction, and the negative pole piece and the positive pole piece are both disconnected in the pole piece interruption area; the two winding cores are respectively formed by winding two winding areas towards a pole piece interruption area, the two winding cores are connected into a whole through an isolating membrane of the pole piece interruption area, the two winding cores of the winding groups are arranged in parallel along a first direction, and the adjacent winding groups are arranged in parallel along a second direction. According to the utility model, at least one of the technical problems of easy wrinkling, non-uniform tension control and poor heat dissipation during winding of the pole piece can be solved.

The invention relates to a shellfish cold-processing device, and solves the problem that the quality of dry shellfish is influenced by the fact that heating exists in the traditional shellfish drying and processing process. The shellfish cold-processing device comprises a freezing chamber, a slicing machine, a vacuum freeze-drying chamber and a packaging machine in sequence, wherein the freezing temperature of the freezing chamber maintains between -4 DEG C and 0 DEG C; the vacuum freeze-drying chamber is a vacuum environment with the temperature between -45 DEG C and -35 DEG C; a material preparing chamber is arranged on the inlet side of the vacuum freeze-drying chamber; a vacuum-pumping valve is arranged between the vacuum freeze-drying chamber and the material preparing chamber; the vacuum-pumping valve exhausts air from the vacuum freeze-drying chamber to the material preparing chamber. The shellfish cold-processing device finishes slicing cold processing on the shell fish by the forms of freezing, slicing, performing vacuum freeze-drying and packaging, so the original flavor of the shellfish can be maintained well; the materials are prepared layer by layer by multiple layers of material preparing frames and are vibrated and flattened, so that the stacking thickness of the shellfish meat in the vacuum freeze-drying process is reduced; air is exhausted from the vacuum freeze-drying chamber to the material preparing chamber to conduct precooling, so that the drying efficiency is improved and the drying effect is guaranteed.

The utility model discloses a novel ultrathin folding charging head structure comprising a housing, and a PCBA board is fixedly installed in the housing. The number of the elastic sheets is two, and the elastic sheets are respectively installed on the PCBA board; the AC electric insertion piece is fixedly installed on a rotating shaft, rotating buckles are arranged on the two sides of the rotating shaft respectively, and the AC electric insertion piece is in conductive contact with the elastic piece; the mounting seat is arranged corresponding to each AC electric insertion piece, a rotating shaft mounting position is arranged on one surface of the mounting seat, an insertion piece groove is formed in the other surface of the mounting seat, one end of each AC electric insertion piece is rotationally mounted in the insertion piece groove, and the other end of each AC electric insertion piece extends into the rotating shaft mounting position. According to the utility model, a buckling fixing mode of the AC electric plug piece and the rotating shaft is adopted, and the use of a pressing plate and a screw in a traditional folding plug pin structure is avoided, so that the stacking thickness of the assembly is reduced, and the whole charging head is lighter and thinner.

The invention relates to a shellfish cold-processing device, and solves the problem that the quality of dry shellfish is influenced by the fact that heating exists in the traditional shellfish drying and processing process. The shellfish cold-processing device comprises a freezing chamber, a slicing machine, a vacuum freeze-drying chamber and a packaging machine in sequence, wherein the freezing temperature of the freezing chamber maintains between -4 DEG C and 0 DEG C; the vacuum freeze-drying chamber is a vacuum environment with the temperature between -45 DEG C and -35 DEG C; a material preparing chamber is arranged on the inlet side of the vacuum freeze-drying chamber; a vacuum-pumping valve is arranged between the vacuum freeze-drying chamber and the material preparing chamber; the vacuum-pumping valve exhausts air from the vacuum freeze-drying chamber to the material preparing chamber. The shellfish cold-processing device finishes slicing cold processing on the shell fish by the forms of freezing, slicing, performing vacuum freeze-drying and packaging, so the original flavor of the shellfish can be maintained well; the materials are prepared layer by layer by multiple layers of material preparing frames and are vibrated and flattened, so that the stacking thickness of the shellfish meat in the vacuum freeze-drying process is reduced; air is exhausted from the vacuum freeze-drying chamber to the material preparing chamber to conduct precooling, so that the drying efficiency is improved and the drying effect is guaranteed.

The invention relates to a flexible display panel, a folding screen and a folding electronic device, the flexible display panel comprises a panel layer and a substrate layer, the panel layer is provided with a display surface used for light emitting display, the substrate layer is connected with one side, back to the display surface, of the panel layer, the substrate layer is made of a glass material or a metal material, and the substrate layer is made of a metal material. The substrate layer can be bent along with the panel layer in a set direction, and the substrate layer is used for supporting the panel layer so that the display surface can be kept smooth. According to the flexible display panel, the folding screen and the folding type electronic equipment, the overall stacking thickness of the folding screen can be reduced, then the bending stress between the layer structures in the folding process of the folding screen is reduced, the probability of poor dislocation between the layer structures is reduced, the damage probability of the folding screen is reduced, and the service life of the folding screen is prolonged. And the effect of improving the folding performance is achieved.

The invention discloses electronic equipment. The electronic equipment comprises a first shell (100) which is provided with a through hole, a temperature sensor module (200) which is arranged in the through hole and is provided with a first electric connection part (210) and afirst circuit board (300). The first circuit board (300) is provided with a second electric connection part (400), the second electric connection part (400) is electrically connected with the first electric connection part (210), and the temperature sensor module (200) is connected with the first shell (100) in an injection molding mode. According to the scheme, the problems that the shell structure of the electronic equipment is low in strength and the electronic equipment is thick can be solved.

The invention provides a flexible board and hard board connection structure and a manufacturing method thereof. The flexible board and hard board connection structure comprises an FPC and a PCB. The PCB is provided with a welding interconnection area, a plurality of PCB pads are arranged in the welding interconnection area of the PCB, the FPC is provided with a plurality of FPC pads, and the FPC pads are connected with the PCB pads through a hot-pressing reflow process hotbar. The size of a welding interconnection area of the PCB is greater than or equal to the boundary dimension of the FPC at the bonding pad side of the FPC, a local recess is formed in the welding interconnection area of the PCB, and the bottom of the local recess does not exceed the upper surface of a copper foil layer at the bottommost layer of the PCB; and the FPC at the FPC bonding pad side is embedded into the local recess. According to the invention, the stacking thickness of the soft board and the hard board when the hotbar technology is adopted for interconnection can be reduced.

The invention relates to an interconnecting wire structure and a forming method thereof. A semiconductor substrate is provided; the forming method of the interconnecting wire structure comprises the steps of forming multiple independent interconnecting wires on the semiconductor substrate, wherein grooves are formed between adjacent interconnecting wires; forming a first interlayer dielectric layer to cover the interconnecting wires, and filling a groove in part of the first interlayer dielectric layer until an opening is formed; forming a second interlayer dielectric layer to cover the first interlayer dielectric layer, wherein the opening is sealed by the second interlayer dielectric layer to form an air gap; flattening the second interlayer dielectric layer. The interconnecting wire structure formed by the forming method is improved in quality, and the forming method is simple in process and low in process cost.