30results about How to "Reduce stack thickness" patented technology

The invention provides a multi-wafer stack structure and a forming method thereof. The first dielectric layer and the second dielectric layer are bonded with each other, and the first interconnectionlayer is electrically connected with the second metal layer and the first metal layer through the first opening. The third dielectric layer and the insulating layer are bonded to each other, and the second interconnect layer is electrically connected to the third metal layer and the first interconnect layer through the second opening. The invention eliminates the need for reserving bonding lead space between wafers, eliminates silicon substrate, realizes multi-wafer interconnection and reduces the thickness of multi-wafer stack, thereby reducing the thickness of the whole device after multi-wafer stack packaging, increasing the packaging density and meeting the requirement of increasingly lightweight semiconductor products. Moreover, the semiconductor device no longer needs leads, and thedesign and processing of the silicon substrate and several common pads on the silicon substrate are omitted, which is favorable for reducing the cost and simplifying the process.

The invention provides a terminal device shell and a terminal device.The terminal device shell comprises a side frame with a button area, and a touch button formed on the button area of the side frame of a cover plate.According to the terminal device shell, a physical button in the prior art is replaced with the touch button designed on the side frame, the designed stacking thickness of an existing terminal device frame can be effectively decreased, and the extremely-narrow design of the terminal device frame is achieved.

The present invention provides a terminal device, including: a display module, the display module includes a display structure and a flexible circuit board; a metal structure, the metal structure is arranged between the display structure and the flexible circuit board, and the metal structure is connected to the display structure and the flexible circuit board respectively. The flexible circuit board is attached, and the area of ​​the attached end surface of the metal structure is larger than the area of ​​the attached end surface of the preset area of ​​the flexible circuit board, and smaller than the area of ​​the attached end surface of the display structure; the metal middle frame, the metal middle frame includes: grooves and At the ends located on both sides of the groove, the predetermined area of ​​the flexible circuit board and the metal structure are all arranged in the groove, and the ends are in contact with the display structure. The terminal equipment provided by the embodiments of the present invention can reduce the stacking thickness of the whole machine, provide a grounding return path and excellent shielding performance, and can improve the temperature rise problem of the terminal equipment and improve the heat dissipation effect of the terminal equipment.

The invention relates to a shellfish freeze drying processing device and a method thereof. According to the invention, the problem that dried shellfish quality is affected when shellfish is heated during the traditional shellfish drying processing is solved. The device successively comprises a freeing chamber, a slicer, a vacuum freeze-drying chamber, a temperature returning chamber and a packing machine. After standing and sand-spitting of shellfish, meat and shell are separated; after separation and cleaning of shellfish meat, the cleaned shellfish meat is put into the freezing chamber and frozen in the environment of minus 4 to 0 DEG C; frozen shellfish meat is sliced; after slicing of shellfish meat, the shellfish meat slices are put in layers in a stock rack and then sent into the vacuum freeze-drying chamber to be freeze-dried in a vacuum environment of minus 45 to minus 35 DEG C; after drying, shellfish meat is put into the temperature returning chamber to return to the temperature of minus 10 DEG C; and packaging is carried out finally. After drying processing, original flavor of shellfish can be better maintained. Before vacuum freeze-drying, the multi-layer stock rack is adopted for layered stock preparation, vibration and flattening, thus reducing stacking thickness of shellfish meat during the vacuum freeze-drying process, enhancing drying efficiency and guaranteeing the drying effect.

The invention provides a touch film structure, which includes a touch element layer, a barrier layer and a flexible substrate. The touch element layer has opposite first surface and second surface. The barrier layer is formed on the first surface or the second surface or integrated with the touch element layer to form a multifunctional film layer. The flexible substrate is stacked with the touch element layer, barrier layer or multifunctional film layer.

The invention discloses a touch display panel. The touch display panel comprises a display module, a linear polarizer and a composite film, wherein the linear polarizer is formed at one side of the display module; the composite film is arranged between the linear polarizer and the display module and comprises a 1 / 2 lambda wave plate, a 1 / 4 lambda wave plate, a first touch electrode layer and a second touch electrode layer; the 1 / 4 lambda wave plate is formed at the side, far from the linear polarizer, of the 1 / 2 lambda wave plate; the first touch electrode layer is formed at any side of the 1 / 4 lambda wave plate; the second touch electrode layer is formed at any side of the 1 / 2 lambda wave plate; the first touch electrode layer and the second touch electrode layer are insulated from each other. The touch display panel has the beneficial effects that touch film layers are internally arranged between the linear polarizer and the display module and are respectively bonded and fixed with the 1 / 2 lambda wave plate and the 1 / 4 lambda wave plate to form the integrated composite film, so that the lamination thickness of the panel is reduced, thus increasing the bending resistance and optical transmittance of the panel, meeting the lightening and thinning requirements of products and being applicable to flexible display panels.