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446results about How to "Reduced assembly steps" patented technology

Terahertz frequency tripler based on coplanar waveguide transmission wires

The invention discloses a terahertz frequency tripler based on coplanar waveguide transmission wires. The terahertz frequency tripler based on the coplanar waveguide transmission wires comprises three waveguides, including a fundamental wave input wave guide, an output waveguide and a main body waveguide, a dielectric substrate inside the main body waveguide, and electrical structures arranged on the dielectric substrate through the coplanar waveguide transmission wires in an integrated mode, wherein the electrical structures are composed of a DC (direct current) bias low-pass filter, an input matching transmission wire, a fundamental wave low-pass filter, a fundamental wave matching transmission wire, a triple-harmonic matching transmission wire, a three-stage matching transmission wire, a four-stage matching transmission wire and an output matching transmission wire from left to right and takes the coplanar waveguide transmission wires as a ground wire. The coplanar waveguide transmission wires substitute traditional microstrip wires and traditional suspended microstrip wires for designing the peripheral passive circuit of the frequency tripler; the inside of the circuit is directly connected with a cavity wall to achieve a radio frequency grounding and DC circuit; by means of a fundamental wave input duplexer, DC bias and other circuits can be designed simultaneously, subsequent assembling steps can be reduced, and the circuit structure is easy to process and assemble.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Ceramic double-side three-dimensional integrated structure and packaging method of ultra-wideband radio frequency micro-system

ActiveCN108428672ARealize ceramic double-sided three-dimensional integrated packagingReduce volume occupancySemiconductor/solid-state device detailsSolid-state devicesUltra-widebandOccupancy rate
The invention provides a ceramic double-sided three-dimensional integrated structure of an ultra-wideband radio frequency micro-system and belongs to the technical field of ultra-wideband radio frequency packaging. The structure comprises a ceramic substrate, a metal micro frame, a front cover plate, a back cover plate and a BGA solder ball. Both sides of the ceramic substrate are provided with cavity grooves for mounting chips. The metal micro frame is welded on the front surface of the ceramic substrate. The front cover plate is welded on the metal micro frame. The back cover plate is weldedon the back cavity groove of the ceramic substrate. The back surface of the ceramic substrate except the back cover plate is provided with a BGA solder pad. The BGA solder ball is welded on the backsurface of the ceramic substrate through the BGA solder pad. The invention also provides a packaging method of the integrated structure. According to the invention, the internal integration density nearly is doubled. The volume occupancy rate of external interconnection interface and airtight package is greatly reduced. The structure has the advantages of simple structure and less procedure and isan effective method for realizing the three-dimensional stacking of the ultra-wideband radio frequency micro-system.
Owner:SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP

400 Gbps hot-plug high-speed optical transceiver module

The invention provides a 400 Gbps hot-plug high-speed optical transceiver module which is suitable for the optical communication technical field. The 400 Gbps hot-plug high-speed optical transceiver module comprises an optical interface unit, a photoelectric transceiver unit and an electrical interface unit; the photoelectric transceiver unit is used for achieving the functions of photoelectric conversion and high-speed electrical signal processing through a photoelectric transceiver chip; the internal working process of the photoelectric transceiver chip comprises receiving an electrical signal input through the electrical interface unit by a transmitting terminal data clock recovery circuit, loading the electrical signal to a laser after the pretreatment through a driving circuit, converting the high-speed electrical signal into a high-speed optical signal through the laser, reusing the high-speed optical signal through a wavelength division multiplexer to be output, reusing the received optical signal into a 16-channel optical signal through a wavelength division demultiplexer to be transmitted to an optical detector and transmitting the 16-channel optical signal to a trans-impedance amplifier and a receiving terminal data clock recovery circuit after photoelectric conversion to be processed. According to the 400 Gbps hot-plug high-speed optical transceiver module, the factors such as the cost, the transmission loss, the chromatic dispersion and the size are considered to select different optical transceiver modules and accordingly the long-distance single-mode optical fiber transmission or the short-distance multimode transmission is implemented.
Owner:WUHAN TELECOMM DEVICES

Paste preparing method of soybean milk machine

The present invention discloses a paste preparing method of a soybean milk machine. The method comprises: 1, an initialization step: adding water and a soybean material in a soybean milk machine, and detecting whether a water level inside the soybean milk machine is within a specified range, wherein the soybean milk machine performs a preheating step if the water level is within the specified range, and the soybean milk machine sends an alarm signal if the water level is not within the specified range; 2, a preheating step: heating for 1-3 minutes, starting a motor for 16 seconds to carry out crushing, and then continuously heating for 10 minutes; 3, a high temperature holding step: stopping heating after a specified heating time is achieved, cycling a plurality of times, and starting the motor for 25 seconds to carry out crushing; 4, a high temperature paste beating step: stopping heating after a specified heating time is achieved, cycling a plurality of times, starting the motor for 25 seconds to carry out crushing, and cycling 2 times; 5, a high temperature stirring step: starting the motor for a specified time to carry out stirring, stopping heating after a specified heating time is achieved, and cycling a plurality of times; and 6, a high temperature boiling steps: stopping heating after a specified heating time is achieved, cycling 24 times, and stopping working. With the method, problems of overflow, charring, insufficient cooking and the like during the paste preparing process can be solved.
Owner:GREE ELECTRIC APPLIANCES ZHONGSHAN SMALL HOUSEHOLD APPLIANCES MFG +1

Terahertz frequency doubler using coplanar transmission line

ActiveCN104617880AReduced assembly stepsMinimize the impact of machining and assembly on resultsOscillations generatorsCross connectionPhysics
The invention discloses a terahertz frequency doubler using coplanar transmission line; the terahertz frequency doubler comprises a fundamental wave input waveguide and a main waveguide; the fundamental wave input waveguide is communicated with the main waveguide; a medium substrate is arranged on the bottom surface of an internal chamber of the main waveguide; the left end of the medium substrate stretches out from the main waveguide and then stretches into the fundamental wave input waveguide; the coplanar transmission lines, the lower surfaces of which are flush with the upper surface of the medium substrate, are arranged on the medium substrate; the coplanar transmission line comprises a short-circuit transmission line, a primary connection transmission line, a matching transmission line, an output waveguide matching transmission line and a DC bias low-pass filter connected to one another from left to right and further comprises an output waveguide; the output waveguide is in crossed connection with the main waveguide; the overlapped area of the output waveguide and the main waveguide is an area M; the output waveguide matching transmission line is arranged in the area M; two grounded transmission lines of the coplanar transmission line are arranged at the left side of the output waveguide; and the coplanar transmission line further comprises an upside-down four-core frequency-doubling diode.
Owner:UNIV OF ELECTRONIC SCI & TECH OF CHINA
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