Ceramic double-side three-dimensional integrated structure and packaging method of ultra-wideband radio frequency micro-system

Abstract

The invention provides a ceramic double-sided three-dimensional integrated structure of an ultra-wideband radio frequency micro-system and belongs to the technical field of ultra-wideband radio frequency packaging. The structure comprises a ceramic substrate, a metal micro frame, a front cover plate, a back cover plate and a BGA solder ball. Both sides of the ceramic substrate are provided with cavity grooves for mounting chips. The metal micro frame is welded on the front surface of the ceramic substrate. The front cover plate is welded on the metal micro frame. The back cover plate is weldedon the back cavity groove of the ceramic substrate. The back surface of the ceramic substrate except the back cover plate is provided with a BGA solder pad. The BGA solder ball is welded on the backsurface of the ceramic substrate through the BGA solder pad. The invention also provides a packaging method of the integrated structure. According to the invention, the internal integration density nearly is doubled. The volume occupancy rate of external interconnection interface and airtight package is greatly reduced. The structure has the advantages of simple structure and less procedure and isan effective method for realizing the three-dimensional stacking of the ultra-wideband radio frequency micro-system.

Description

technical field [0001] The invention belongs to the technical field of ultra-wideband radio frequency packaging, and specifically relates to a ceramic double-sided three-dimensional integrated structure and a packaging method of an ultra-wideband radio frequency microsystem. Background technique [0002] With the urgent need for miniaturization of military electronic equipment, broadband radio frequency packaging is developing towards higher density, higher frequency, and smaller interconnection interfaces. Most of the existing RF packages based on multilayer ceramic substrates are integrated on one side. Even if organic substrates are used for double-sided integration, metal shells need to be used for airtightness. There is a limited integration density, and hermetic packaging and interconnection ports will occupy a large area. Due to the volume problem, it is difficult to adapt to the development needs of electronic equipment microsystem integration. Contents of the inve...

AI Technical Summary

Problems solved by technology

Most of the existing RF packages based on multilayer ceramic substrates are single-sided integration. Even if organic substrates are used for double-sided integration, metal casings are required for airtightness. There is a limited integration density, and hermetic packaging and interconnection ports will occupy a large area. The volume problem makes it difficult to adapt to the development needs of electronic equipment microsystem integration

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