The invention discloses a Ku
wave band transceiving SiP module which comprises a multilayer
ceramic substrate, solder balls on the multilayer
ceramic substrate, via holes penetrating through the multilayer
ceramic substrate, keys and gold wires, the keys and the gold wires are arranged between the via holes and a transceiving
chip, and the transceiving
chip comprises four bidirectional amplifiers and a four-channel amplitude-phase multifunctional
chip. The four bidirectional amplifiers are respectively connected with the four-channel amplitude-phase multifunctional chip and comprise a transmitting-receiving switch, a transmitting power
amplifier of a transmitting channel, a receiving low-
noise amplifier of a receiving channel and an amplitude
limiter, and in a transmitting state, the four-channel amplitude-phase multifunctional chip controls the transmitting-receiving switch to work in the transmitting channel and controls the receiving low-
noise amplifier of the receiving channel to work in the receiving channel; the transmitting power amplifier amplifies the
radio frequency signal and outputs the amplified
radio frequency signal; in a receiving state, the four-channel amplitude-phase multifunctional chip controls the transceiving switch to work in a receiving channel, the amplitude
limiter limits the amplitude of the
radio frequency signal, and the
radio frequency signal is output after being amplified by the receiving low-
noise amplifier. According to the invention,
electromagnetic interference in the module can be reduced, and high efficiency, high reliability and high integration level of the module are realized.