128 results about "Transceiver chip" patented technology

The invention relates to a CAN bus control type PS I5 transceiver module which comprises a main control module, a communication interface is composed of a CAN communication module and a serial port, the CAN communication module is used for communicating with other equipment, and the main control module is connected with an upper computer through the serial port for communication; the power supply module reduces the direct-current 12V voltage to the working voltage of the single chip microcomputer to supply power to the main control module; the PS I 5 transceiver chip is respectively connected with the sensor and the main control module, and is used for receiving a Manchester encoding electric signal of a PS I 5 bus and sending an electric signal conforming to the PS I 5 standard to the sensor; the master control module is used for receiving and storing sensor data corresponding to different states and events. Compared with the prior art, CAN and serial communication are combined with a power-down storage state flag bit, so that the equipment can be compatible with a plurality of pieces of equipment for coordinating work. The non-PS I5 production equipment can be refitted into PS I5 sensor production equipment as long as the non-PS I5 production equipment is provided with a CAN communication interface, reading, configuration, analysis and diagnosis of a PS I5 sensor can be carried out, and the production link of the PS I5 sensor is effectively supported.

This disclosure provides an optical interconnect module, an optical interconnect device, and a computing system. The optical interconnect module includes a photonic integrated circuit chip and a transceiver chip. The photonic integrated circuit chip includes a first optical switching section and a second optical switching section. The first optical switching section includes a plurality of first optical switching input ports, a plurality of first optical switching output ports, a plurality of second optical switching output ports, and a plurality of third optical switching output ports. An optical signal input from each first optical switching input port is selectively output from a corresponding one of the plurality of first optical switching output ports, a corresponding one of the plurality of second optical switching output ports, or a corresponding one of the plurality of third optical switching output ports. The second optical switching section includes a plurality of second optical switching input ports and a plurality of fourth optical switching output ports, each of the plurality of second optical switching input ports being connected to a corresponding one of the plurality of first optical switching output ports.

The invention relates to the field of explosion-proof electrical technology, and discloses an intrinsically safe output Ethernet transmission circuit, which comprises an Ethernet physical layer transceiver chip U6, a network transformer U7, an electrostatic protection diode D17, an electrostatic protection diode D18, voltage stabilizing diodes D13-16, capacitors C46-62, resistors R42-45, resistors R59-65, thick film resistors R74-77, fuses F1-4, a safety Y capacitor CY1, an inductor L2, a gas discharge tube TV1, a gas discharge tube TV2 and an RJ45 connector RJ1. The intrinsically safe output Ethernet transmission circuit provided by the invention realizes 3000V voltage isolation, has the characteristics of low cost and easiness in implementation, not only has strong anti-interference and lightning surge protection capabilities and stable transmission performance, but also is easy to calculate and check intrinsically safe parameters through multi-stage isolation and current-limiting and voltage-limiting protection, and has a wide application prospect. And multiple key problems in intrinsic safety Ethernet transmission are effectively solved.

A receiver of the chip includes an analog-to-digital converter and an electrical-optical digital signal processing module. The analog-to-digital converter can convert a serial analog signal sent by the optical module into a parallel digital signal. The electrical-optical digital signal processing module can perform optical algorithm and electrical algorithm equalization processing on the parallel digital signal, and send a processed parallel digital signal to a processing unit of the chip.

The invention discloses a Ka wave band four-channel transceiving SiP module based on silicon-based packaging and a manufacturing method thereof, the SiP module adopts a silicon-based packaging material and comprises an upper layer sub-packaging and a lower layer sub-packaging, and the upper layer sub-packaging and the lower layer sub-packaging are vertically interconnected through a ball grid array (BGA); the lower-layer sub-package comprises three layers of silicon adapter plates with a first thickness, a cavity for mounting a three-port transceiver chip is etched on the middle-layer silicon adapter plate, and a TSV with a first diameter is manufactured on each layer of silicon adapter plate; the upper layer sub-package comprises three layers of silicon adapter plates, the upper layer silicon adapter plate and the lower layer silicon adapter plate have a first thickness and are provided with TSVs with a first diameter, the middle layer silicon adapter plate is etched with a cavity used for mounting a silicon-based amplitude-phase multifunctional chip and a power supply modulation chip, the middle layer silicon adapter plate has a second thickness and is provided with TSVs with a second diameter, and the middle layer silicon adapter plate is etched with a cavity used for mounting a silicon-based amplitude-phase multifunctional chip and a power supply modulation chip. Wherein the second thickness is greater than the first thickness and the second diameter is greater than the first diameter. According to the invention, the requirements of miniaturization, integration and high performance of a radar system can be met.

The utility model belongs to the technical field of communication low-speed interface signal processing, and discloses a ZYNQ-based low-speed signal test measurement control device. The ZYNQ-based low-speed signal test measurement control device comprises a ZYNQ main control chip, an RS485 driver, a transmitter, a receiver, a CAN driver, an Ethernet PHY transceiver chip, a single-pole three-throw switch and a power interface. According to the utility model, the test, measurement, operation and configuration requirements of low-speed signals in a digital signal processing system are integrated and unified, the test and measurement requirements of various low-speed signals are met through special equipment, the test process is simplified, and the test efficiency is improved.

The invention relates to the technical field of optical transceivers, and discloses a high-extinction-ratio coherent optical silicon optical transceiver chip and a transmitting method and a receiving method thereof. The transmitting end of the chip comprises a structure formed by cascading a modulator (102) and an optical switch (103); the receiving end comprises a simplified receiving structure consisting of a 2 * 2 coupler (104) and a single photoelectric detector (105); and all devices are integrated on a single silicon optical chip. According to the invention, the cascade architecture of the modulator and the optical switch is introduced at the transmitting end, so that the transmitting extinction ratio is remarkably improved, the direct-current leakage interference caused by the non-working ONU is effectively suppressed, and the signal-to-noise ratio and the receiving sensitivity of the system are improved. Meanwhile, the combination of the simplified receiving architecture and the silicon photon platform realizes the transceiving function with low power consumption, low cost and small volume, and can meet the requirements of a high-speed optical access scene.

An optical fiber array assembly, a signal receiving structure and an optical module. The optical fiber array assembly comprises an optical fiber array module (1) and a lens module (2) adapted to the optical fiber array module (1), wherein the optical fiber array module (1) comprises a base (11) and at least two optical fibers (14) arranged in an array on one side of the base (11), an end part of each optical fiber (14) is formed as a bevel (141), the lens module (2) is arranged on the other side of the base (11) and corresponds to the end parts of the optical fibers (14), optical signals transmitted by the optical fibers (14) are reflected into the base (11) via the bevels (141), the optical signals pass through the base (11) and then are emitted into the lens module (2), and the lens module (2) is used for converging the optical signals on a transceiver chip (4). On the one hand, a light spot of a smaller size can be obtained, such that not only high coupling efficiency is achieved, but also a position window of the optical fiber array module in which all of channels achieve high coupling efficiency is broader, thereby effectively reducing the process difficulty; on the other hand, the probability of a collision between the optical fiber array module and the transceiver chip is greatly reduced, thereby effectively improving the product yield.

Provided is a cascaded FMCW radar, and more particularly, to a cascaded FMCW radar with a synchronized PLL. The cascaded FMCW radar includes a crystal oscillator generating a reference frequency signal having low-frequency characteristics, a cascade-array transceiver chip generating an output signal having high-frequency characteristics using the reference frequency signal through a signal generator provided therein, and an antenna transmitting the generated output signal to the outside in the form of an electromagnetic wave or receiving the electromagnetic wave from the outside.

This invention discloses a bidirectional continuous-variable quantum key distribution method and system based on frequency division duplexing in a single-transceiver ring network. The method is based on a monolithically integrated silicon photonics transceiver chip. By pre-setting optical carrier frequency offsets for the forward and reverse links, it isolates the quantum signal from Rayleigh backscattering noise in the fiber in the frequency domain. The transmitting end generates a broadband waveform containing quantum signals and pilot signals, which is transmitted bidirectionally through a single optical fiber. The receiving end uses a laser source from the same chip as the local oscillator for coherent heterodyne detection. A digital signal processing module performs orthogonalization correction, phase recovery, and matched filtering to suppress noise and extract the quantum signal to generate a secure key. This invention solves the problems of inflexible networking, low fiber utilization, and severe scattering noise interference in bidirectional transmission over a single fiber caused by the separation of the transmitting and receiving ends in integrated continuous-variable quantum key distribution systems. It provides a low-cost and highly flexible solution for metropolitan quantum ring networks.

The utility model relates to a W-band low-cost TR assembly, and the assembly comprises a TR assembly structural body, two waveguide cover plates, and two radio frequency PCBs. The TR assembly structural body is of a square plate-shaped structure, and the upper surface and the lower surface of the square plate-shaped structure are provided with grooves of the same shape. The two radio frequency PCBs are arranged in the grooves in the upper surface and the lower surface of the TR assembly structural body respectively. The two radio frequency PCBs are buckled on the upper surface and the lower surface of the TR assembly structural body; the radio frequency PCB comprises a common end waveguide port, a packaging multifunctional chip, a plurality of branch end waveguide ports and a plurality of packaging transceiving chips; the branch end waveguide ports are connected with the packaging transceiving chips in a one-to-one correspondence manner; all the packaging transceiver chips are connected with the packaging multifunctional chip; the packaged multifunctional chip is connected with the common end waveguide port; the common end waveguide port and the branch end waveguide port are exposed out of the TR assembly structural body and used for being connected with external equipment.

The utility model discloses a direct insertion type radar sensor, which comprises a dielectric substrate, a transceiver chip, a bridge, a set square antenna, a feed port and a plurality of golden finger pins, a plugboard is arranged on one side of the dielectric substrate, the transceiver chip is arranged on the dielectric substrate, the bridge is arranged on the dielectric substrate and is electrically connected with the transceiver chip, and the feed port is arranged on the plugboard. The triangular plate antenna is installed in the dielectric substrate, a feed point is arranged on the triangular plate antenna, the feed port is arranged on the dielectric substrate and electrically connected with the transceiving chip and the feed point, and the plurality of golden finger pins are arranged on the upper surface and the lower surface of the plugboard and electrically connected with the transceiving chip. The triangular antenna is adopted as a signal transmitting and receiving antenna, and due to the structural characteristics of the triangular antenna, the direct-insertion type radar sensor is integrally of a long and thin structure and can easily extend out of a small hole formed in an applied illuminating lamp panel, so that the use performance is not influenced, and meanwhile, light rays of lamp beads on the lamp panel can be prevented from being shielded.

The application discloses a reconfigurable phased array chip and antenna interconnection structure and belongs to the technical field of phased array antenna interconnection.The application comprises a plurality of phased array transceiver chips, a plurality of antenna units, a reconfigurable radio frequency switch matrix, a control unit and a storage unit.The reconfigurable radio frequency switch matrix is connected between the chips and the antenna units, comprises a plurality of independently controllable radio frequency switch nodes, realizes programmable connection of any transceiver channel to any antenna unit, the control unit dynamically configures the switch matrix according to instructions, and the storage unit stores a configuration table.The application realizes flexible pairing of channels and antennas, improves hardware resource utilization, when individual channels or antennas are faulty, can automatically reconfigure to bypass the faulty units, and the system reliability is improved, can dynamically select optimal antenna subarrays according to beam pointing, and optimizes beam performance.The application is suitable for large-scale phased array systems and can significantly enhance the flexibility and fault tolerance of the system.

A distributed radar transceiver system, relating to the technical field of radars. The distributed radar transceiver system comprises: a reference signal generation unit, configured to generate a plurality of identical reference signals; and a plurality of transceiver chips, wherein the plurality of transceiver chips are in one-to-one correspondence to the plurality of reference signals, each transceiver chip among the plurality of transceiver chips is configured to generate a local oscillator signal on the basis of the corresponding reference signal, and the local oscillator signals generated by the transceiver chips are the same. The local oscillator signals are generated by the transceiver chips, eliminating reliance on centralized distribution from a central station and thereby avoiding losses and errors of the local oscillator signals generated during transmission. In addition, because reference signals received by the transceiver chips are identical, the local oscillator signals generated by the transceiver chips are identical, so that the transceiver chips can locally process echoes of radar signals sent by the transceiver chips.

The invention discloses a communication circuit and a communication system. The communication circuit comprises a controller, a serial transceiver chip, a signal conversion circuit, a unidirectional conductive circuit, a delay circuit and a bias circuit. The signal conversion circuit outputs an inversion signal of the serial sending pin. And the delay circuit is used for delaying the signal and the inversion signal of the serial sending pin. The rising time of the signal for receiving the enable pin is earlier than the rising time of the signal for transmitting the enable pin, the rising time of the signal for transmitting the enable pin is earlier than the falling time of the signal for transmitting the data input pin, and the falling time of the signal for transmitting the enable pin is later than the rising time of the signal for transmitting the data input pin. The falling time of the signal receiving the enable pin is later than the falling time of the signal transmitting the enable pin. The biasing circuit pulls up the first differential signal pin and pulls down the second differential signal pin. Through the above mode, serial communication can be realized based on the two pins of the controller so as to save I / O resources.

The invention provides a distance zero value self-correcting method based on a radio frequency agile transceiver chip. The distance zero value self-correcting method comprises the following steps: configuring the radio frequency agile transceiver chip into a dual-channel mode; a manual gain control mode is selected as a receiving channel gain control mode of a radio frequency agile transceiver chip, and gain values of a working branch receiving channel and a self-correcting branch receiving channel are manually set to be the same; a radio frequency output signal of a transmitting channel Tx2 of the self-correcting branch is connected to a radio frequency receiving end of a receiving channel Rx2 after being subjected to down-conversion and solid attenuation processing; tone-FM single tone frequency modulation is adopted for signal modulation of the transmitting end of the self-correcting branch; single-tone frequency modulation signal demodulation is carried out at the receiving end of the self-correction branch, a single-tone signal is recovered from the received signal through a frequency discrimination technology, phase comparison is carried out on the recovered single-tone signal and an original single-tone signal output by the transmitting end of the self-correction branch, and a distance zero value of the self-correction branch is obtained; and compensating a radio frequency output signal of a transmitting channel Tx1 and a radio frequency signal of a receiving channel Rx1 of the working branch according to a ranging zero value obtained by the self-calibration branch.

A system includes a base station with one or more antennas; and a processor to beamform or to control a directionality of the antennas in communication with a predetermined target. A mobile device communicates with the base station and has an RF part including RF Transceiver chip, baseband part comprising of DSP and CPU for controlling the data / control messages. ADC / DAC chips are used for interfacing both RF and baseband parts. The other basic cell phone components include touchscreen display, battery, RAM, ROM, RF antenna, MIC, Speaker, camera, and others.

This application discloses a hardware and software co-verification system, method, device, and medium for radio frequency (RF) chip algorithms, relating to the field of RF chip algorithm verification technology. The system includes: a host computer software module for calculating the RF chip algorithm to be verified and generating or processing baseband IQ signals; an RF transceiver chip for generating or processing RF signals; and an FPGA hardware module for communication connections with both the host computer software module and the RF transceiver chip. The FPGA hardware module internally includes a first storage unit and a second storage unit, and is configured with a first communication interface and a second communication interface. The first communication interface is used to establish a serial communication link with the host computer software module via a universal asynchronous transceiver interface, and the second communication interface is used to establish a high-speed data communication link with the RF transceiver chip via a high-speed data interface. The serial communication link is configured to use time-division multiplexing to alternately transmit I and Q data of the RF signal on a single data line.

The invention relates to the field of imaging detection, in particular to a terahertz transmitting-receiving front end based on PCB integration, which comprises an industrial personal computer used for receiving returned data, performing phase compensation optimization on the data in combination with a motion track and realizing terahertz imaging of a to-be-detected sample; the multi-channel terahertz receiving and transmitting array module comprises a terahertz receiving and transmitting array unit used for receiving / transmitting terahertz signals; the array control unit board communicates with the terahertz transceiving array unit; the interconnection and interface board supplies power to the terahertz transceiving array unit and the array control unit board and ensures that the array unit is compatible with external equipment; and the robot structure is used for receiving the control instruction sent by the industrial personal computer and the return information of the mechanical arm and controlling the mechanical arm to operate. The integrated imaging array front end of the terahertz transceiver chip is packaged by the PCB, so that the integrated imaging array front end has obvious volume and cost advantages, and the volume scale and the cost of the system can be effectively reduced.

The invention relates to a Ka frequency band broadband multi-beam communication system based on a 5GNTN system, which can work under the 5GNTN system through the cooperative work of a 4T4R radio frequency transceiver chip, a signal processing FPGA, a monitoring FPGA, a clock PLL, an optical module and a power supply module, and the Ka frequency band broadband multi-beam communication system can work under the 5GNTN system through the cooperation of the 4T4R radio frequency transceiver chip, the signal processing FPGA and the optical module. And the maximum support bandwidth of the system is greatly improved while the number of supported beams is greatly improved, so that the uplink and downlink rates reach the level of 5Gbps.

The invention discloses an optical device riveting jig based on an optical fiber transceiver chip and a control method of the optical device riveting jig based on the optical fiber transceiver chip, and the optical device riveting jig comprises a workbench, a protective cover, a control box, a mounting plate, a feeding mechanism, a riveting mold, a material storage box, a riveting mechanism and a material taking mechanism, the safety protection device is used for safety protection in the riveting operation process. By adopting the multi-station design that the rotary table drives the multiple riveting dies to flow and cooperating with cooperative operation of the feeding mechanism, the riveting mechanism and the material taking mechanism, continuous and automatic machining of the optical device is achieved, the manual intervention link is reduced, the production efficiency is remarkably improved, cooperative control over all functional components is achieved through the control box, and the production efficiency is improved. Flexible setting of machining parameters is supported, machining requirements of optical devices of different specifications can be met, universality is high, the automation degree of the operation process is high, and operation is convenient and fast.

The utility model discloses a kind of optical module test equipment, it is related to optical communication technical field.Optical module test equipment in:first electric test interface is electrically connected with signal transceiver chip;Control chip is electrically connected with optical test device and optical test interface by light testing device;Control chip and signal transceiver chip are electrically connected;Control chip sends first test control signal to signal transceiver chip, and sends second test control signal to optical test device;Optical test device will be converted into second optical signal by first optical signal received through optical test interface, and second optical signal is sent to second to-be-tested optical module by optical test interface;Signal transceiver chip sends test electric signal to first to-be-tested optical module group by first electric test interface;And target electric signal sent by second to-be-tested optical module group is received by first electric test interface.The optical module test equipment provided by the utility model occupies smaller space and area, and failure is easy to troubleshoot, and cost is lower.

The application discloses a processing method and system of a radio frequency signal of a radio frequency transceiver chip, and relates to the technical field of radio frequency communication and microelectronic signal processing, and comprises the following steps: S1, performing a slow sweep frequency operation and applying a thermal disturbance in a waveguide, guiding energy distribution to form a bright-dark fluctuation trajectory through frequency change, and extracting a standing wave shadow line from a continuous bright-dark rhythm to locate an energy gathering area; S2, attaching a tearable micro-absorption layer on a waveguide cavity wall corresponding to the standing wave shadow line, and using the selective adsorption effect of the micro-absorption layer surface on high-frequency energy to form a stable adsorption mark at an energy retention position to establish a drainage anchoring point. The application constructs an energy regulation path of recognition, marking, traction, forwarding and release, disperses the standing wave focal point through periodic micro-disturbance, realizes uniform release of high-frequency energy and dispersion of heat, and significantly improves the stability and service life of the chip.

A free-space optical communication system includes an optical phased array (OPA) photonic integrated chip (114), a transceiver photonic integrated chip (112), and one or more processors (104). The OPA chip includes a plurality of array elements (120) and a plurality of phase shifters (121). The transceiver chip includes one or more transmitter components (116) and one or more receiver components (118). The one or more processors are configured to transmit a first signal (402) via the OPA chip and the transceiver chip, and to receive a second signal (410) via the OPA chip and the transceiver chip.

The invention discloses a distributed multi-parameter sensing system and method combined with an optical transceiving integrated chip, and relates to the field of distributed optical fiber sensing, and the system comprises a temperature control optical transceiving assembly, an arbitrary waveform function generator, an upper computer, a multi-channel data acquisition instrument, an erbium-doped optical fiber amplifier, a circulator and a sensing optical fiber. The temperature control light transmitting-receiving assembly comprises a semiconductor temperature controller and a light transmitting-receiving integrated chip; the optical transceiver integrated chip comprises a tungsten copper substrate, a thin film circuit, an output single-mode fiber, a semiconductor amplifier chip, a semiconductor laser chip, an avalanche photoelectric detector chip, a photon lead waveguide structure and an input single-mode fiber. Through optical transceiver chip integration, a cooperative control structure and a related signal processing algorithm, distributed sensing with compact structure, multi-parameter synchronous decoupling and high precision coexistence is realized.

The invention discloses an MEMS switch high-voltage driving control circuit based on RS485 communication, and belongs to the technical field of micro electro mechanical system driving control. The circuit comprises a power supply unit which is used for converting externally input VCC1 and VCC2 voltages into multipath working voltages; the communication unit adopts an RS485 transceiver chip U13 and is used for receiving an external instruction through an RS485 bus; the control core unit adopts a microcontroller U6 and is used for analyzing the instruction and generating an SPI (Serial Peripheral Interface) driving signal; the high-voltage driving module adopts at least one high-voltage driving chip capable of being cascaded and is used for converting the SPI signals into multiple paths of high-voltage driving signals; and the MEMS switch interface module is used for connecting an external MEMS switch array. Through the integrated design, remote control, large-scale channel expansion and reliable protection of the high-voltage driving circuit are achieved, the problems that in the prior art, a system is complex, the reliability is poor and centralized control is difficult are solved, and the high-voltage driving circuit is particularly suitable for driving a large-scale MEMS switch array.

The utility model belongs to the technical field of embedded computing, and relates to an embedded computing module based on SS928V100, which comprises the SS928V100, an I2C communication device, a synchronous Buck converter, a switching regulator chip, a DC-DC step-down converter, a PCIe switch, an Ethernet transceiver, a USBHUB chip and a step-down switching regulator, the I2C communication device, the synchronous Buck converter, the switching regulator chip, the DC-DC step-down converter, the PCIe switch, the Ethernet transceiver, the USBHUB chip and the step-down switching regulator are all connected with the SS928V100, and the I2C communication device is used for configuring and controlling other I2C devices. The synchronous Buck converter is used for dynamically adjusting output voltage according to the power supply management requirement of the SS928V100, and the switching regulator chip is used for providing stable power supply voltage for the SS928V100. The system is high in integration level, flexible in configuration, efficient in power management and strong in network communication capability, provides a brand new solution for the design of an embedded system, and meets the diversified requirements in a complex application scene.

The invention relates to a control device with serial port communication, and belongs to the technical field of computer communication. The serial communication circuit is expanded through the main control module and the serial transceiver chip. The n IO pins in the main control module are used for serial port receiving, and the other n IO pins are used for transmitting and receiving enabling and are respectively connected with the enabling pins of the serial port transmitting and receiving chip, so that the main control module can switch the transmitting / receiving state of the serial port transmitting and receiving chip, and the switching is more convenient. DI pins of the serial port transceiving chips are connected with TXD pins of the main control module, in the process that the main control module receives data, RO pins of the serial port transceiving chips are connected with serial port receiving IO pins and timer channel pins of the main control module, and the received data are stored in corresponding registers; the main control module uses a TXD pin to send data to the outside, the process operation is simple and convenient, and based on the reliability of the main control module and the serial port transceiver chip, the data receiving and sending process is safe.

The application provides a control circuit of a communication transceiver chip and a vehicle driving device. The control circuit comprises a signal generation module generating a control signal based on the running state of an electronic control unit in a vehicle and a power supply control module controlling a power supply loop of the communication transceiver chip. The signal generation module is arranged between the state output end of the electronic control unit and the control end of the power supply control module. The input end of the power supply control module is connected to a power supply. The output end of the power supply control module is connected to the power supply end of the communication transceiver chip. The power supply loop is cut off when the electronic control unit is abnormal. The control circuit provided by the application is provided with the signal generation module and the power supply control module in the electronic control unit and the communication transceiver chip. The signal generation module generates the control signal based on the running state of the electronic control unit. When the electronic control unit is faulty, the power supply of the communication transceiver chip is disconnected through the power supply control module.

The invention relates to the technical field of on-chip self-calibration of chips, in particular to an on-chip self-calibration method and system for a high-disturbance-rejection CAN transceiver chip. The noise level of the environment where the chip is located is monitored in real time; determining an adjustment value of the driving parameter based on the noise level; and the driving parameters are adaptively adjusted according to the adjustment values so as to optimize the signal integrity and the anti-interference capability. The system comprises a noise monitoring module, a parameter calculation module and a parameter adjustment module which are integrated in a chip. The innovation point of the invention lies in that on-chip real-time self-calibration is realized, no external equipment is required to participate, and the signal quality is dynamically optimized in a complex electromagnetic environment in a mode of combining periodicity and event triggering. According to the method, the anti-interference capability and the signal integrity of the CAN bus can be remarkably improved, the communication error rate is effectively reduced, meanwhile, the method has the advantages of low power consumption, fast response, high integration level and the like, and the method is particularly suitable for occasions such as automotive electronics with strict requirements on reliability.