Flexible board and hard board connection structure and manufacturing method thereof

A technology of connecting structure and manufacturing method, which is applied in the direction of electrical connection of printed components, printed circuit manufacturing, printed circuit components, etc., can solve the problems of increasing the stack thickness, and achieve the effect of reducing the stack thickness and realizing the thinning of the whole product.

Pending Publication Date: 2021-09-24
DONGGUAN ELF EDUCATIONAL SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] One of the objectives of the present invention is to provide a connection structure between a soft board and a hard board and its manufacturing method, which is used to solve the problem that the current connection method between a soft board and a hard board increases the stacking thickness

Method used

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  • Flexible board and hard board connection structure and manufacturing method thereof
  • Flexible board and hard board connection structure and manufacturing method thereof
  • Flexible board and hard board connection structure and manufacturing method thereof

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Embodiment Construction

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0040] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically drawn, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0041] An embodim...

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Abstract

The invention provides a flexible board and hard board connection structure and a manufacturing method thereof. The flexible board and hard board connection structure comprises an FPC and a PCB. The PCB is provided with a welding interconnection area, a plurality of PCB pads are arranged in the welding interconnection area of the PCB, the FPC is provided with a plurality of FPC pads, and the FPC pads are connected with the PCB pads through a hot-pressing reflow process hotbar. The size of a welding interconnection area of the PCB is greater than or equal to the boundary dimension of the FPC at the bonding pad side of the FPC, a local recess is formed in the welding interconnection area of the PCB, and the bottom of the local recess does not exceed the upper surface of a copper foil layer at the bottommost layer of the PCB; and the FPC at the FPC bonding pad side is embedded into the local recess. According to the invention, the stacking thickness of the soft board and the hard board when the hotbar technology is adopted for interconnection can be reduced.

Description

technical field [0001] The invention relates to the technical field of inter-board interconnection, in particular to a connection structure between a soft board and a hard board and a manufacturing method thereof. Background technique [0002] FPC (Flexible Printed Circuit) is a flexible circuit board, referred to as soft board. PCB (Printed Circuit Board, printed circuit board) is a rigid circuit board, referred to as hard board. [0003] At present, the interconnection between the soft board and the hard board is mainly realized through the fastening of the connector, but the use of the connector to connect will increase the manufacturing cost and occupy the layout space of the single board, especially for the pursuit of high-density miniaturization of electronic products. It will also increase the scale of the product, for example, the height of the whole machine will be increased for ultra-thin mobile terminals. [0004] So the hot bar reflow process (hotbar) appeared....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/00H05K3/36
CPCH05K1/116H05K1/118H05K3/0097H05K3/368
Inventor 梁华锋
Owner DONGGUAN ELF EDUCATIONAL SOFTWARE CO LTD
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