Disclosed herein is a solder self-assembly structure, an IC chip including a solder self-assembly structure, and a method of making the same. The structure includes a release layer disposed on a portion of an upper surface of the substrate, laterally spaced from a via in the substrate. A barrier layer metallization (BLM) is disposed in a first part over a portion of the substrate including a via, and in a second part over the release layer, leaving a surface of the substrate exposed between the first portion and the second portion of the BLM. A solder structure is disposed over the first and second portions of the BLM and the exposed surface of the substrate disposed there between. When the solder structure is reflowed and annealed, surface tension in the solder causes self-assembly of a three-dimensional, compliant solder structure.