126results about How to "Reduce floor area" patented technology

The invention discloses a rice field ditch integrated ecological high-value rice and soft-shelled turtle planting and breeding method which comprises the following steps: 1, ruralizing a rice field and installing fences; 2, plowing the rice field; 3, transplanting rice; 4, putting soft-shelled turtles in the rice field and raising the soft-shelled turtles; 5, conducting field management; and 6, harvesting the rice and the soft-shelled turtles in good time. The method has the advantages that: 1, the foundation works of the rice field is optimized without reducing the area of the rice; 2, the foundation works of a rice ditch is optimized without destroying the structure of the rice field; 3, the landscape of the rice field is optimized to provide a good growth environment for the soft-shelled turtles; 4, a ladder type culture method is adopted to increase the planting and breeding density; and 5, the economic benefit of the rice field in a unit area is greatly increased.

A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer 52 is mounted on a top surface of a circuit board 43, and an acoustic sensor 51 is mounted on the top surface thereof. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52, and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51, the interposer 52 and the like are covered by a cover 42 put on the top surface of the circuit board 43. In the cover 42, a sound introduction hole 48 is opened in a position opposed to the front chamber of the acoustic sensor 51. The interposer 52 is formed with a ventilation notch 71 for acoustically communicating a space below a diaphragm 56 of the acoustic sensor 51 with a space inside the cover 42 and outside the interposer 52.

The invention provides an antenna device and a mobile terminal with the same. The antenna device comprises at least two layers of stacked coils; a second feed point electrically connected to an NFC (Near Field Communication) chip or an RFID (Radio Frequency Identification) chip is respectively arranged on the coils, and a first feed point electrically connected to a WPC (Wireless Power Consortium) chip or an FM (Frequency Modulation) chip is respectively arranged on the two coils of the surface; and the two adjacent layers of coils are isolated by an isolating unit, and the isolating unit is configured to isolate working signals of the NFC chip or the RFID chip. The antenna device realizes superposition of effective area of antennas via multilayer superposed coils, the coils can be connected or isolated to support two different functions, and multiplexing of the antenna device is realized; meanwhile, in the NFC or RFID working mode, the intensity of the radiation electromagnetic field can be improved, and the NFC or RFID communication performance is optimized.

Provided is a heat medium heating apparatus including: a plurality of flat heat exchanger tubes 12; PTC heaters 13 that are respectively incorporated between flat tube parts of the flat heat exchanger tubes 12; a heat exchanger holding member 15 that press-fixes the flat heat exchanger tubes 12 and the PTC heaters 13, from one side of the flat heat exchanger tubes 12 to an inner surface of a casing 11; and a control board 17 that has a surface on which a control circuit 21 is mounted, the control circuit 21 including heat-generating electrical components 20 that control the PTC heaters 13, in which the control board 17 includes heat penetration parts that are formed so as to pass through the control board 17 correspondingly to mounting positions of the heat-generating electrical components 20, and the heat-generating electrical components 20 are mounted so as to be cooled via the heat penetration parts.

A content-adaptive edge and detail enhancement method is described for image/video processing. Both 2D peaking and LTI/CTI are used in sharpening pictures. Image analysis is performed to generate a mask to control the use of the two peaking techniques. The strength or likelihood of edges or transitions is measured and such a strength or likelihood measurement will be transformed into a blending factor controlling the blending of the LTI/CTI and peaking outputs.

It is sought to reduce the planar area on which a continuous paper web duplex inkjet printing unit is installed. To this end, a continuous paper web duplex inkjet printing unit for inkjet printing on both sides of a continuous paper web with an inkjet printing head in an inkjet printer is configured to comprise a plurality of inkjet printers 11a-11h disposed so that they lie vertically in steps and their inkjet printing heads face downwards, and a paper threading path 15 disposed below such an inkjet printer or printers in each steps for permitting the continuous paper web to be passed zigzag from an upper to a lower step successively.

An arc runway on aircraft carrier for the taking off or landing of aircraft is composed of a straight runway segment and a slope runway segment. For the taking off, said slope segment is used for the taxi and beginning acceleration and said straight segment is used for further acceleration. For the landing, said straight segment is used for the landing and deceleration sliding and said slope segment is used for further deceleration.

The present invention discloses a millimeter-wave high-gain and high-radiation-efficiency slot antenna array based on a ridge gap waveguide. The millimeter-wave high-gain high-radiation-efficiency slot antenna array comprises an upper layer structure, a middle layer structure and a lower layer structure, wherein the uppermost layer is an all-metal radiation unit layer manufactured through machining and is composed of 16 inverted trapezoidal slot radiation units at equal intervals; the middle layer is a substrate integrated waveguide high-order mode resonant cavity feed layer processed by a multilayer printed circuit board technology, and the substrate integrated waveguide high-order mode resonant cavity feed layer is composed of an upper planar structure, a middle planar structure and a lower planar structure. A metal printing surface with rectangular gaps is arranged above the substrate integrated waveguide high-order mode resonant cavity feed layer. A dielectric substrate with periodically arranged metal through holes is arranged in the middle, and a metal plate with four rectangular coupling holes is arranged below the dielectric substrate; and the bottommost layer is a machinedridge gap waveguide feed network layer and comprises a metal ridge line, metal pins surrounding the metal ridge line and a metal bottom plate. The whole antenna array is small in size, light in weight and high in integration level, and high gain and high radiation efficiency are realized in a working bandwidth.

A nitride-based semiconductor laser device includes a nitride-based semiconductor layer formed on a main surface of a substrate and having an emission layer, wherein the nitride-based semiconductor layer includes a first side surface formed by a (000-1) plane and a second side surface inclined with respect to the first side surface, and a ridge having an optical waveguide extending perpendicular to a [0001] direction in an in-plane direction of the main surface of the substrate is formed by a region held between the first side surface and the second side surface.

The invention provides a GIS effectively equiped with device and busbar, in order to reduce the area of applying ground and busbar length, and enhance the maintenance of breaker and recovery efficiency. The circuit in-cinnection busbar, eduction busbar, vertical breaker, and circuit among-cinnection main busbar are made by single phase device. The circuit in-cinnection busbar, vertical breaker and circuit among-cinnection main busbar make triphase divided busbar parallelly allocate on the same plane. The circuit in-cinnection busbar and circuit among-cinnection main busbar coincide up and down to make the mian axis of busbar of each phase slightly overlap at the same direction and on the same plane. The eduction busbar is coincident allocated at the direction crossed with the main axis of the circuit in-cinnection busbar and circuit among-cinnection main busbar. The vertical breaker is set beside the circuit in-cinnection busbar and circuit among-cinnection main busbar, and the orientation thereof is paralleled with the main axis of the circuit in-cinnection busbar and circuit among-cinnection main busbar.

The utility model discloses an inclined pulling assembly for a 3D printing device. The inclined pulling assembly comprises a mounting bracket and a hollow support frame movably connected with the mounting bracket through a connecting piece, wherein a resin frame used for accommodating a printing solution is mounted on the support frame; the bottom of the resin frame is a transparent bottom plate; a pull rod is further arranged at the bottom of the side edge, opposite to the connecting piece, of the support frame, and is connected with a driving motor; the support frame is enabled to rotate along the connecting piece through the ascending and descending of the pull rod. By adopting the inclined pulling assembly, a curing layer is completely separated from the bottom of the resin frame by pulling downwards on one side slowly, translation for increasing the plane area of the resin frame is not required, friction generated by translation is avoided, the service life of a thin film on the transparent bottom plate of the resin frame is greatly prolonged, and generally, one resin frame can be used for printing for 400,000-500,000 times.

The invention relates to the technical field of storage and discloses a storage module and storage equipment comprising the storage module. The storage module comprises a substrate, an interface contact group and a circuit component group packaged on an inner side face of the substrate, wherein the interface contact group is electrically connected to the circuit component group; and the circuit component group is hierarchically laminated on the inner side face of the substrate. Compared with the prior art, the circuit component group in the storage module is hierarchically laminated on the substrate, so that a designer can distribute a hierarchical structure according to dimension of a circuit component in the circuit component group, while length of the substrate is only needed to be slightly greater than the longest hierarchical structure; therefore, a plane area of the circuit component occupying the inner side face of the substrate is greatly reduced, and an effect of reducing volume of the storage module is achieved. Moreover, the circuit component group is not needed to be reduced or other lower-capacity circuit component groups are not needed to be replaced, and the problem that the capacity of the storage module is reduced due to the reduced volume of the storage module is solved.

The invention provides a three-dimensional stack structure of a thin-film ceramic circuit. Between two adjacent thin-film ceramic substrates, through ball mounting welding or prefabricated pad welding, stacking of more than three thin-film ceramic circuit substrates is realized. Solid metal through holes are used for realizing electric connection of a random layer. The structure comprises a local electromagnetic self-shielding structure of a chip and/or a passive component. The local electromagnetic self-shielding structure comprises an upper metal layer, a lower metal layer and side surface solid metal through holes. The three-dimensional stack structure can realize stacking of the thin-film ceramic circuit so that an active chip, an RF structure, a high-power structure, a broadband switching structure and the like are integrally integrated in a three-dimensional direction, thereby reducing plan area of a function core by more than 70%, effectively improving product integration level, synchronously realizing hermetic sealing and electromagnetic self-shielding, and improving product adaptability. The three-dimensional stack structure can replace 60-70% of similar products and has advantages of saving cost by more than 60% and improving production efficiency by more than 40%.

The invention provides a three-dimensional microcomputer electric transducer. The three-dimensional microcomputer electric transducer comprises a plurality of movable first electrodes, a plurality of movable second electrodes, a plurality of fixed third electrodes, and a plurality of fixed fourth electrodes, wherein the first electrodes and the adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and the adjacent fourth electrodes form at least one third capacitor. The capacitance of the first capacitor changes displacement of a mass block, the displacement is reflected in a first axis direction, the capacitance of the second capacitor changes displacement of the mass block, the displacement is reflected in a second axis direction, and the capacitance of the third capacitor changes displacement of the mass block, and the displacement is reflected in a third axis direction. The first axis, the second axis and the third axis define a three-dimensional coordinate system.

This memory comprises a bit line, a first word line and a second word line arranged to intersect with the bit line while holding the bit line therebetween and a first ferroelectric film and a second ferroelectric film, having capacitances different from each other, arranged between the bit line and the first word line and between the bit line and the second word line respectively at least on a region where the bit line and the first and second word lines intersect with each other. The bit line, the first word line and the first ferroelectric film constitute a first ferroelectric capacitor while the bit line, the second word line and the second ferroelectric film constitute a second ferroelectric capacitor, and the first ferroelectric capacitor and the second ferroelectric capacitor constitute a memory cell.

The invention provides a manufacturing method of an epitaxial structure of a semiconductor, and relates to the technical field of semiconductors. First, an AlN buffer layer is sputtered on a pre-set patterned substrate, wherein the surface of the patterned substrate comprises a plurality of regular hexagonal structures arranged periodically, the regular hexagonal structures are arranged accordingto preset parameters, the regular hexagonal structures comprise regular hexagonal bottom faces and cones connected to the bottom faces, and the bottom faces are parallel to the c-faces of a substratematerial; a nitride buffer layer then grows on the AlN buffer layer; the nitride buffer layer grows along the c-faces between the cones of every two adjacent regular hexagonal structures; and finally,a nitride merged layer grows on the nitride buffer layer. The manufacturing method of the epitaxial structure of the semiconductor has the effects of improving the flatness of the surface of the semiconductor, reducing the dislocation density of the semiconductor and enabling the quality of crystal lattice to be better.

The invention relates to a folding-leg-supported mobile phone rest station for a college classroom. The folding leg supported-mobile phone rest station, which is provided by the invention, is small in size, is suspended without nails, can be conveniently folded, moved and unfolded, brings convenience for students to charge mobile phones, can rapidly call the roll and is suitable for the college classroom. According to the technical scheme, a mobile phone access point is fixed on a folding frame, folding support legs are articulated to the lower end of the folding frame, a mobile phone fixer is fixed on the front surface and the back surface of a background layer, student numbers and name marks are arranged on the front surface of a mobile phone fixing bag sequentially, and multiple USB mobile phone charging interfaces are arranged on the front surface and the back surface of the background layer respectively.

An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.