Equal-directional array type rectifier bridge stack

Abstract

The invention provides an equal-directional array type rectifier bridge stack which is compact in structure and more reasonable in whole layout, so that the volume and the cost of a product are effectively reduced. The equal-directional array type rectifier bridge stack comprises a chip I, a chip II, a chip III and a chip IV, a framework I, a framework II, a framework III and a framework IV, a jumper wire I, a jumper wire II, a jumper wire III and a jumper wire IV; each one of the framework I, the framework II, the framework III and the framework IV is formed by a respective body and a pin; the four frameworks are in an opposite-side layout; the bodies of the framework I and the framework III are rectangular; an insulating distance is kept between the bodies and the bodies are located at one side of the opposite-side layout; the bodies of the framework II and the framework IV are C-shaped, and the bodies are in an occlusion position relation; an insulating distance is kept between the bodies and the bodies are located at the other side of the opposite-side layout; the chip I is distributed on the front face of the body of the framework I; the chip II and the chip IV are respectively distributed on the front face of the body of the framework IV; the chip III is distributed on the front face of the body of the framework III; and the directions of polarities of the chip I, the chip II, the chip III and the chip IV are the same. According to the equal-directional array type rectifier bridge stack disclosed by the invention, the quality of a product is stable and the cost is greatly reduced.

Description

technical field [0001] The invention relates to the improvement of the single-phase diode rectification bridge stack chip structure. Background technique [0002] Single-phase diode rectifier bridge stack in the prior art such as figure 2 As shown, it has two lead frames. Due to the structural relationship, the P side (small) of chip one 11 and chip four 14 faces downward, and the N side (large side) of chip two 12 and chip three 13 face down. This structure has been used in this field until now. In production, the operator needs to carefully distinguish and place the chips. If there is a mistake in the placement, the finished product will be scrapped, requiring the operator to concentrate on it, which makes the labor intensity of the operator relatively high. Large, low production efficiency. Although the area of ​​the large surface and the small surface is not much different, when in use, the large surface is close to the heat dissipation surface to improve the heat diss...

AI Technical Summary

Problems solved by technology

In order to overcome the problem of needing to distinguish the placement direction of the chip, the structure of the frame was adjusted, but the structural design of the case, firstly, it is necessary to identify whether the corner is a segmented surface or an acute corner plane, so as to complete the welding work of the PN junction ; Second, the overall structure of the frame makes the final product have a large planar area, large volume, loose structure, consumes more resources, and the cost of the product is still at a high level

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