Reflow process welding method

Abstract

A reflow process welding method includes the steps: firstly, printing solder paste on a bottom plate through metal stencil printing; secondly, performing reflow welding for the bottom plate printed with the solder paste, forming an alloy welding layer on the bottom plate, and attaching soldering flux separated out from the solder paste on the surface of the bottom plate; thirdly, cleaning the bottom plate and removing the soldering flux separated out from the solder paste on the surface of the bottom plate; fourthly, coating the surface of the alloy welding layer with the soldering flux, and placing a workpiece to be welded on the alloy welding layer coated with the soldering flux; fifthly, performing reflow welding again. The size of the solder paste is same as that of the workpiece to be welded. The melting-point temperature of the solder paste is reference temperature N DEG C. Compared with the prior art, the process method is more convenient to operate and lower in cost, pollution caused by the soldering flux in the reflow process is avoided, and the method is particularly applicable to surface welding with a large-area contact surface.

Description

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AI Technical Summary

Benefits of technology

This new technology uses both reflux-soluble solvents (referred to also called “reflow agents”) and heat to improve solder quality at low temperatures without causing harm or environmental concerns associated therewith. By removing these materials beforehand after printing it onto the component being joined by this technique, no residue remains that could affect its properties when exposed later under different conditions such as humidity or pressure.

Problems solved by technology

This technical issue addressed during electronic assembly includes finding ways to improve the efficiency and effectiveness of reflux solder techniques while reducing environmental impact associated therewith. Specifically, the current method involves manual application of soluble resin onto the surfaces being joined together before cooling them down quickly. However, these methods have drawbacks like low throughput rates when applied over long distances without sagging out any unwanted residue. Additionally, they require excessive amounts of fluxes to flow properly, leading to waste and potential defect issues. Therefore, new solutions aim towards improving the performance and durability of refrigeration solderings are needed.

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