The invention relates to the technical field of
semiconductor product processing, and discloses a
silicon wafer grinding machine for
semiconductor manufacturing, which comprises a lower fixing piece and an upper fixing piece, a drum; a driving
assembly; and a plurality of groups of
grinding assemblies are mounted in the rotary drum, the
grinding assemblies are located on the outer side of the
silicon wafer, and the drum body drives the grinding assemblies to be close to the edge of the
silicon wafer. By arranging the rotary drum, the driving
assembly and the multiple sets of grinding assemblies, under the action of the rotary
centrifugal force of the rotary drum, gravity balls move outwards in the radial direction to drive the drum body to move downwards, and therefore the multiple grinding tiles are synchronously driven to be fed inwards in the radial direction at equal intervals, and uniform grinding of the edge of a silicon wafer is achieved; when
ovality or local protrusions exist in the silicon wafer, only the protruding part makes contact with the grinding tile and is removed preferentially, so that the edge roundness of the silicon wafer is synchronously corrected in the
grinding process, and the geometric accuracy of the silicon wafer and the alignment reliability of the follow-up process are effectively improved.