328 results about "Storage phosphor" patented technology

The invention belongs to the technical field of nano fluorescent powder, and particularly relates to Ca10 (PO4) 6 (OH) 2: RE < 3 + > nano fluorescent powder as well as a preparation method and application thereof. The preparation method comprises the following steps: mixing Ca (NO3) 2 and RE (NO3) 3 solutions in proportion to prepare a cation solution, dropwise adding a certain amount of H3PO4 to prepare a mixed solution, adjusting the pH value by using a charge compensation agent, uniformly stirring, performing ultrasonic dispersion, performing hydrothermal reaction on the obtained solution, and purifying to obtain the final product Ca10 (PO4) 6 (OH) 2: RE < 3 + > nano fluorescent powder. The charge compensation agent is at least one of KOH and LiOH. By utilizing the methods, the invention provides the Ca10 (PO4) 6 (OH) 2: RE3 + nano fluorescent powder taking K < + > / Li < + > as the charge compensation agent, and the Ca10 (PO4) 6 (OH) 2: RE3 + nano fluorescent powder has the advantages of thermal stability, color stability and high luminescence, and is suitable for temperature sensing, cheilogramma and anti-counterfeiting detection.

Disclosed are a light emitting device and a method for manufacturing a light emitting device. The light emitting device according to the present application may be formed by an epitaxial growth process. In addition, the light emitting device according to the present application includes a first semiconductor layer, a light emitting layer and a second semiconductor layer. Light emitting wavelengths of the first region, the second region and the third region are different by setting composition of the light emitting layer of the top walls of the plurality of protrusions, the side walls of the plurality of protrusions and the recessed region between the plurality of protrusions to be different, therefore, the light-emitting device may emit light of different wavelengths without using phosphors or quantum dots for wavelength conversion, thereby prolonging the lifespan of the light-emitting device and improving the reliability of the light-emitting device.

The invention relates to a blue-green dual-band light-emitting diode epitaxial wafer which comprises a substrate, a buffer layer, an N-type semiconductor layer, a low-temperature stress release layer, a multi-quantum well light-emitting layer, an electron blocking layer and a P-type semiconductor layer which are sequentially stacked in the epitaxial direction. The multi-quantum light-emitting layer comprises a first blue light InGaN layer, a first blue light barrier layer, a first green light barrier layer, a first green light InGaN layer, a second green light barrier layer, a second blue light InGaN layer and a second blue light barrier layer which are sequentially, periodically and alternately grown in the epitaxial direction. The first green light barrier layer comprises a pre-well low-energy-level barrier layer, a pre-well high-energy-level barrier layer and a pre-well polarization compensation barrier layer which are sequentially grown along the epitaxial direction; the second green light barrier layer comprises a post-well polarization compensation barrier layer, a post-well high-energy-level barrier layer and a post-well low-energy-level barrier layer which are sequentially grown along the epitaxial direction; the preparation cost of the backlight source can be effectively reduced, the use of fluorescent powder is reduced, the luminous efficiency is high, and the color rendering performance is good.

A method for manufacturing a radiation-emitting component (100) is specified, comprising the following process steps: - Providing at least one semiconductor chip (10) which, during operation, emits electromagnetic radiation of a first wavelength range from a radiation emission surface (11), - Manufacturing a conversion element (20) on the radiation emission surface (11), wherein manufacturing the conversion element (20) comprises the process steps: - Applying a partially cured matrix material (21) in which phosphor particles are embedded that convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, to a surface, - Compacting the partially hardened matrix material (21) to produce a compact layer (22), - Complete hardening of the compact layer (22), wherein the surface is the radiation emission surface (11) of the semiconductor chip (10) or an auxiliary substrate from which the compact layer (22) is transferred to the radiation emission surface (11) before complete curing. A radiation-emitting device (100) is further specified.

This invention discloses a surface-mount LED chip with near-infrared spectrum, belonging to the field of semiconductor light-emitting device technology, specifically a ceramic substrate. The ceramic substrate has a soldering mounting area where a near-infrared chip is soldered. A spectral optimization structure is disposed on top of the soldering mounting area. A transparent encapsulating layer is disposed on top of the near-infrared chip, and near-infrared transmissive phosphor is disposed within the transparent encapsulating layer. A heat dissipation component is disposed on the outside of the ceramic substrate. This invention, by setting a spectral optimization structure and placing phosphor within the transparent encapsulating layer, can significantly improve the purity of the near-infrared spectrum. Combined with a silicone convex lens and anti-reflection film on the outside of the diffuser, it can further improve the light extraction efficiency of the near-infrared chip, thus effectively improving the efficiency of the near-infrared chip's divergent spectrum.

According to an embodiment of the present disclosure, a display device may comprise a liquid crystal display panel; a backlight configured to output a light to the liquid crystal display panel, wherein the backlight includes a plurality of backlight blocks and a light source driving circuit configured to generate a light source driving signal for controlling a light output of the backlight block, each backlight block has one or more LEDs (Light Emitting Diodes); and each LED is formed of KSF (Potassium fluorosilicate) phosphor; and a controller configured to: obtain a global dimming value and a local dimming value, determine a duty of the light source driving signal as the local dimming value if the global dimming value is less than a certain value, and reduce a constant current applied to the backlight block based on the global dimming value.

A light emitting diode (LED) module is provided. The LED module includes: a substrate including upper pads; a passivation layer on the substrate and defining openings exposing the upper pads; an LED chip on the passivation layer and including electrode pads electrically connected to the upper pads of the substrate; an adhesive layer on the LED chip and extending along a side surface of the LED chip; and a phosphor film covering an external surface of the adhesive layer and including an end portion around the LED chip.

Light-emitting device assembly (100; 102) comprising: a substrate (120; 220); a plurality of light-emitting device chips (110; 210) arranged linearly and spatially separated from one another on the substrate (120; 220); and a plurality of wavelength conversion units (130; 230) on surfaces of the plurality of light-emitting device chips (110; 210), wherein the plurality of wavelength conversion units (130; 230) each have regions extending over regions between the plurality of light-emitting device chips (110; 210), wherein each of the plurality of wavelength conversion units (110; 210) has: a longer side extending in a first direction in which the light-emitting device chips (110; 210) are arranged;and a shorter side that is shorter than the longer side, wherein shorter sides of wavelength conversion units adjacent in the first direction of the plurality of wavelength conversion units (110; 210) are spaced apart from each other, wherein side faces of the shorter sides are exposed, wherein each of the plurality of wavelength conversion units (130; 230) has several phosphor layers (131, 132, 133; 134, 135; 231, 232, 233; 234, 235), and wherein the phosphor layers (131, 132, 133; 134, 135; 231, 232, 233; 234, 235) are stacked sequentially according to the lengths of wavelengths such that a light-emitting phosphor layer with a shorter wavelength is located at one bottom and a Light-emitting phosphor layers with a longer wavelength are arranged on a surface.

A wavelength conversion module includes: a phosphor member; and a light-transmissive substrate that is directly bonded to the phosphor member, wherein a higher thermal conductivity of the light-transmissive substrate is higher than a thermal conductivity of the phosphor member, and the light-transmissive substrate has a thickness in a range from 100 μm to 600 μm.

The invention discloses blue-green fluorescent powder, a fluorescent coating and a preparation method and application thereof. The preparation method of the blue-green fluorescent powder comprises the following steps: 1) providing raw material powder according to the chemical composition of the blue-green fluorescent powder, and mixing the raw material powder with a fluxing agent to obtain mixed powder; wherein the chemical composition of the blue-green fluorescent powder is SrAl2O4: Eu < 2 + >, Dy < 3 + >; the raw material of aluminum is alpha-type nano aluminum oxide; the weight of the fluxing agent is 1-5wt% of the weight of the raw material powder; 2) carrying out primary sintering on the mixed powder in a reducing atmosphere at 1000-1500 DEG C to obtain primary sintered powder; crushing and grinding the primary sintered powder, and then carrying out secondary sintering in a reducing atmosphere at 800-1400 DEG C to obtain secondary sintered powder; and (3) carrying out ball milling on the secondarily sintered powder for 0.5-10 hours to obtain the blue-green fluorescent powder. The blue-green fluorescent powder disclosed by the invention has relatively high initial afterglow intensity.

A light generator (1) comprising: - an optoelectronic device (11) configured to produce a first monochromatic beam (R1) so as to generate light (L1) at a first wavelength (λ1), - a phosphor layer (12) offset from said optoelectronic device (11) and configured to convert all or part of the first monochromatic beam (R1) into a second beam (R2) so as to obtain converted light (L2) at one or more second, higher wavelengths (λ2) and to diffuse it, characterized in that it comprises: - a first dichroic filter (13) configured to transmit the light (L1) emanating from the first monochromatic beam (R1) towards the phosphor layer (12) and to reflect the converted light (L2) by the phosphor layer (12), - a protective layer (15) disposed opposite the phosphor layer (12) on the side opposite the first filter Dichroic (13). Figure for the abstract: figure 1

The invention provides a sky-green light source LED packaging device, and belongs to the technical field of luminescent materials. The azure light source LED packaging device comprises a light-emitting substrate, wherein the light-emitting substrate comprises fluorescent powder; the fluorescent powder comprises blue-green fluorescent powder and green fluorescent powder; the light-emitting peak wavelength of the blue-green fluorescent powder is 490-500 nm, the molecular formula of the blue-green fluorescent powder is (Ba1-x-ySrxEuy) Si2N2O2, and x is greater than or equal to 0.001 and less than or equal to 0.3; 0.001 < = y < = 0.1; the blue-green fluorescent powder is of an orthogonal structure and is crystallized in a space group Pcca. According to the invention, on the basis of realizing azure luminescence, the luminescence performance of the azure luminescence is improved, especially the luminescence intensity of the azure luminescence is improved, and the anti-aging performance of the azure light source LED packaging device is also improved.

A light emitting diode (LED) structure that includes a stent substrate; and a circuit having a plurality of contact pads arranged along a length of the stent substrate. The structure further includes a plurality of light emitting diode (LED) chips, wherein each light emitting diode chip in the plurality of chips is engaged to a set of contact pads along the length of the metal stent substrate. A continuous phosphor layer is present overlying the plurality of light emitting diode (LED) chips, the continuous phosphor layer including first portions that are in direct contact with at least a light transmission surface of the light emitting diode (LED) chips and second portions that bridge across the space separating adjacently positioned light emitting diode. An encapsulant present over the continuous phosphor layer that is covering at least the light emitting diode chips.

This application discloses a high quantum efficiency near-zero thermal quenching far-red light-emitting plant supplement phosphor and its application. It is prepared by a high-temperature solid-state method and has the composition A2CaBi. 2‑x La x (PO4)2(P2O7):20%Eu 3+ , 0≤ x ≤20%, A = Cs, Li, Na, K, or Rb. This series of phosphors uses Eu as the base. 3+ As the light-emitting center, through La 3+ Effective control of the matrix crystal field to optimize Cs2CaBi 2‑x La x (PO4)2(P2O7) crystal structure, enhancing Eu 3+ Far-red light emission performance.

A color conversion sheet according to an embodiment of the present invention comprises: a base layer; and a wavelength conversion layer that is stacked on at least one surface of the base layer and comprises a matrix resin, an organic phosphor, and a wavelength absorbent, and thus the color conversion sheet experiences low color change, has excellent reliability, and can achieve a color gamut DCI of at least 99.5% by adjusting the phosphor emission wavelength. Also provided is a backlight unit comprising the color conversion sheet.

The utility model provides a fluorescent powder recycling device which comprises a grinding box, a first grinding piece used for finely grinding fluorescent powder and driving other parts to move, a rough grinding mechanism comprising a rough grinding cavity, a second grinding piece and a connecting piece, the rough grinding cavity is used for providing a place for rough grinding, the second grinding piece is used for roughly grinding the fluorescent powder, and the connecting piece is used for connecting the first grinding piece and the second grinding piece. And the connecting piece is used for connecting to realize circumferential rotation of the plurality of rough grinding cavities. According to the fluorescent powder recycling device provided by the utility model, the coarse grinding cavity and the second grinding part can rotate through transmission of the first grinding part and the transmission mechanism, so that materials flow into the coarse grinding cavity through the first communicating part and the feeding part to be subjected to coarse grinding; according to the fluorescent powder grinding device, coarse grinding fluorescent powder can be conveyed into the fine grinding cavity through connection of the discharging port and the second communicating piece, the first grinding piece rotates to conduct fine grinding, the device can conduct fine grinding on large fluorescent powder after coarse grinding is conducted on the large fluorescent powder, and therefore the grinding uniformity and the grinding quality are improved.

The utility model discloses a structure for improving packaging strength of a fluorescent-powder-free multi-primary-color LED lamp bead. The structure comprises a support metal body, a first plastic layer, a light-emitting chip, a plastic extension portion and a plastic nail. The first plastic layer is injection-molded on the front edge area of the support metal body, so that a plastic pit is formed in the middle of the first plastic layer; the light-emitting chip is installed in the central area of the front face of the support metal body, and the central area of the front face of the support metal body corresponds to the plastic pit. The plastic extension part is formed in the plastic pit in an injection molding manner and comprises a plastic annular part and a plastic line part which are formed together; the plastic nails are formed in the plastic pits in an injection molding mode and arranged along the plastic line parts at intervals. According to the utility model, the raised plastic nails are arranged on the plastic line part at intervals; and the adhesive force of the transparent glue layer can be improved by the glue nails, so that the transparent glue layer can be effectively prevented from falling off, and the connection reliability of the transparent glue layer is enhanced.

: The invention provides a light generating system (1000) comprising a first light generating device (110), a second light generating device (120), a luminescent material (200), a diffuser assembly (700), optical elements (500) comprising a first redirection optical element (1510), and a light exit (1090), wherein; (A) the first light generating device (110) is configured to generate first device light (111); the second light generating device (120) is 5 configured to generate second device light (121); (B) the luminescent material (200) is configured to convert at least part of the first device light (111) and at least part of the second device light (121) into luminescent material light (201); (C) the diffuser assembly (700) comprises a diffuser (710); wherein the diffuser (710) is configured to diffuse at least part of the first device light (111) and at least part of the second device light (121) into diffused 10 device light (711); (D) the optical elements (500) comprise one or more redirection optical elements (1500), at least comprising the first redirection optical element (1510); wherein the first redirection optical element (1510) is configured in a light-receiving relationship with the first light generating device (110) and the second light generating device (120); wherein the first redirection optical element (1510) is at least partially transmissive for first device light 15 (111) and second device light (121) and at least partially reflective for first device light (111) and second device light (121); wherein the first redirection optical element (1510) is configured to (i) direct in a first operational mode of the light generating system (1000) a first part of device light (101a), comprising at least part of the first device light (111) and at least part of the second device light (121), in an optical path to the luminescent material (200), and 20 to (ii) direct in the first operational mode of the light generating system (1000) a second part of device light (101b), comprising at least another part of the first device light (111) and at least another part of the second device light (121), in an optical path to the diffuser assembly (700); and (E) the light generating system (1000) is configured to generate in the first operational mode of the light generating system (1000) system light (1001) comprising at 25 least part of the luminescent material light (201) and at least part of the diffused device light (711).

The present invention discloses a red light NaGd2Ga2InTi2O 3+ :Sm 3+ phosphor and its preparation method. A red light NaGd2Ga2InTi2O 12 :Sm 3+ phosphor, whose chemical composition expression formula is: NaGd 2(1‑x) Ga2InTi2O 12 :2xSm 3+ , where: 0 < x ≤ 0.10. The present invention provides a red light NaGd2Ga2InTi2O 12 :Sm 3+ phosphor and its preparation method. This red light NaGd2Ga2InTi2O 12 :Sm 3+ phosphor can be efficiently excited by 400 - 410 nm near-ultraviolet light and 455 - 475 nm blue light, emits red light with the strongest main peak at 616 nm, and at the same time is accompanied by multi-peak narrow-band luminescence in the orange to deep red light region of 565 - 660 nm. The color coordinates are located at (0.59, 0.41), and the fluorescence lifetime is on the order of 1 millisecond.

This invention relates to the field of lighting control technology, specifically disclosing an environment-adaptive LED constant current energy-saving control method. The method includes: arranging a dielectric-photoelastic sensing array, a magnetostrictive-leakage flux detection coil, and a broadband impedance spectrum detection unit on the phosphor encapsulation layer, the inductor core, and the output bus, respectively; simultaneously acquiring three types of timing signals; extracting dielectric-magnetic-electric coupling degradation feature vectors; inputting the feature vectors into an energy-saving-lifetime co-optimization model; correcting the target luminous flux based on the dielectric relaxation offset; constructing a core loss-efficiency mapping surface to solve for the minimum energy consumption operating point; generating a constant current target value offset sequence and a PWM chopper phase-frequency co-transfer strategy; and simultaneously adjusting the duty cycle, switching frequency, and gate impedance through a feedforward-feedback composite adjustment network, and feeding back the current ripple spectrum and dielectric relaxation offset to update the feature vector weights. This invention achieves multi-physics field co-sensing and energy-saving-lifetime co-optimization.

The application provides a kind of iron ion Fe 3+ Doped spinel structure fluorogallate near-infrared fluorescent powder and its preparation method and medical flaw detection application.The iron ion Fe 3+ Doped spinel structure fluorogallate near-infrared fluorescent powder has the chemical formula MgGa2O4:xFe 3+ , yF ‑ ; wherein, 0.00025≤x≤0.016, 0.05≤y≤1.2. Respectively, the compound containing magnesium ion Mg 2+ , the compound containing gallium ion Ga 3+ , the compound containing fluorine ion F ‑ And the compound containing iron ion Fe 3+ As raw materials, the product is obtained by calcination treatment. The Fe 3+ Doped spinel structure fluorogallate near-infrared fluorescent powder can be applied in biomedical non-destructive flaw detection.

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure, an LED backlight module and a preparation method of the LED backlight module. The LED packaging structure comprises an LED chip, a fluorescent adhesive film and a protective adhesive film, the fluorescent adhesive film wraps the side face and the upper surface of the LED chip, the protective adhesive film wraps the side face and the upper surface of the fluorescent adhesive film, and the fluorescent adhesive film is obtained by mixing and curing a silica gel base material and fluorescent powder; and the protective adhesive film is obtained by curing a silica gel base material of the fluorescent adhesive film. By implementing the LED packaging structure, the light emitting brightness of the LED packaging structure can be improved, the light emitting angle of the LED chip can be expanded, moisture can be prevented from being in contact with the LED chip, and the concentration ratio and the light emitting uniformity of the LED backlight module can be improved, so that the light emitting uniformity and the reliability of the LED packaging structure and the backlight module can be improved.

The invention discloses a light-emitting device and a manufacturing method of the light-emitting device. The light-emitting device comprises a substrate, a light-emitting chip, a fluorescent sheet and a packaging layer, and the light-emitting chip is arranged on the upper surface of the substrate; the fluorescent sheet is a light-transmitting sheet doped with fluorescent powder, and the fluorescent sheet is adhered to the upper surface of the light-emitting chip; the packaging layer is arranged on the upper surface of the substrate, and the packaging layer wraps the light-emitting chip and covers the side face of the fluorescent piece. The manufacturing method of the light-emitting device comprises the step of carrying out eutectic effect detection on a light-emitting device finished product. According to the light-emitting device and the manufacturing method thereof, the light emitting performance of the light-emitting device is effectively improved, and the safety and reliability of the light-emitting device are enhanced.

A light emitting diode (LED) structure that includes a stent substrate; and a circuit having a plurality of contact pads arranged along a length of the stent substrate. The structure further includes a plurality of light emitting diode (LED) chips, wherein each light emitting diode chip in the plurality of chips is engaged to a set of contact pads along the length of the metal stent substrate. A continuous phosphor layer is present overlying the plurality of light emitting diode (LED) chips, the continuous phosphor layer including first portions that are in direct contact with at least a light transmission surface of the light emitting diode (LED) chips and second portions that bridge across the space separating adjacently positioned light emitting diode. An encapsulant present over the continuous phosphor layer that is covering at least the light emitting diode chips.

The invention relates to a lighting device for illuminating stages, film and photo shoots, or for light shows, comprising a substrate and a plurality of LEDs mounted on the substrate, wherein the device has LEDs with at least four different peak wavelengths. According to the invention, the plurality of LEDs comprises one type of phosphor-converted yellow LED (PC Yellow), wherein the peak wavelength of the phosphor-converted yellow LED (PC Yellow) is in the range between 560 and 590 nm, and comprises at least two types of blue LEDs, wherein the peak wavelengths of the two blue LED types are in the range between 390 nm and 510 nm and wherein the peak wavelengths of the two blue LED types differ by at least 10 nm.

To provide a material capable of forming a phosphor layer by a simple process without using a coating material.SOLUTION: A phosphor sheet comprising a thermosetting resin composition in a B-stage state, the thermosetting resin composition comprising phosphor particles and a curable resin component, wherein the phosphor sheet has a thickness of 20 to 150 μm. The lighting device includes a fluorescent layer which is a cured product of the phosphor sheet, and a light-emitting element installed on a surface of the fluorescent layer opposite to the insulating substrate.SELECTED DRAWING: Figure 5

This method for manufacturing a phosphor substrate (30) on which at least one light emitting element (20) is mounted comprises: a circuit pattern layer forming step for forming, on one surface of an insulating layer (31), a circuit pattern layer (34) joined to the at least one light emitting element (20); a phosphor layer forming step for forming, on one surface side of the insulating layer (31), a phosphor layer (36) containing a phosphor the emission peak wavelength of which is in the visible light region when using the light emitted by the at least one light emitting element (20) as the excitation light; and a support layer forming step for forming, between the insulating layer (31) and the phosphor layer (36), a support layer (35) that does not contain a phosphor and that supports the phosphor layer (36), wherein, in the support layer forming step, the support layer (35) is laminated on the circuit pattern layer (34) in a region provided with the circuit pattern layer (34).

The present invention provides an endoscopic system that prevents misidentification of results when recognition processing is performed and when recognition processing is not performed. [Solution] The light source device includes a light source section containing at least a phosphor that emits light when irradiated with excitation light. The processor acquires an endoscopic image obtained by photographing a subject illuminated by illumination light from the light source device with an endoscope. The endoscopic image is input to a trained model that performs recognition processing on parts of the endoscopic image that have specific features. The results of the recognition processing are obtained from the trained model. The recognition processing is set to enable or disable based on the action performed on the subject. The results of the recognition processing are information indicating a lesion included in the endoscopic image, or information indicating the type or progression of the lesion, and information indicating that the recognition processing is enabled or disabled is output to the monitor.

This invention relates to a mixed solvent-induced highly fluorescent silver nanoclusters, its preparation method, and its application in LEDs. These highly fluorescent silver nanoclusters are formed by the self-assembly of Ag6 in a mixed solvent of water and NMP through non-covalent interactions such as hydrogen bonding and π-π / π* interactions. Due to the restriction of ligand rotation and vibration, the silver nanoclusters exhibit significant fluorescence properties, with fluorescence intensity reaching 10⁻⁶. 7 The fluorescence lifetime is 11.77 μs and the quantum yield is 17.57%. The method for preparing high-fluorescence silver nanoclusters of the present invention is simple and inexpensive; when mixed with commercial phosphors, it can modulate white LEDs and can be used as a light conversion material for environmentally friendly WLEDs.

The application belongs to the technical field of red fluorescent powder materials for display, and particularly relates to Mn 4+ A surface treatment method of activated fluoride fluorescent powder, modified fluorescent powder and application. The method is to mix the activated fluoride fluorescent powder with an aqueous solution of aminotri (methylenephosphonic acid), stir and react, centrifugally collect the precipitate, wash with boiling water, dry to obtain a fluoride fluorescent powder precursor product; mix the precursor product with ethanol, stir, centrifugally collect the precipitate, wash and dry to obtain the surface-treated fluoride fluorescent powder. 4+ The activated fluoride fluorescent powder is mixed with an aqueous solution of aminotri (methylenephosphonic acid), stirred and reacted, centrifugally collected, washed with boiling water, dried to obtain a fluoride fluorescent powder precursor product; the precursor product is mixed with ethanol, stirred, centrifugally collected, washed and dried to obtain the surface-treated fluoride fluorescent powder. 4+ The activated fluoride fluorescent powder is mixed with an aqueous solution of aminotri (methylenephosphonic acid), stirred and reacted, centrifugally collected, washed with boiling water, dried to obtain a fluoride fluorescent powder precursor product; the precursor product is mixed with ethanol, stirred, centrifugally collected, washed and dried to obtain the surface-treated fluoride fluorescent powder. 2+ The activated fluoride fluorescent powder is mixed with an aqueous solution of aminotri (methylenephosphonic acid), stirred and reacted, centrifugally collected, washed with boiling water, dried to obtain a fluoride fluorescent powder precursor product; the precursor product is mixed with ethanol, stirred, centrifugally collected, washed and dried to obtain the surface-treated fluoride fluorescent powder. The KSFM fluorescent powder prepared in the application has good water resistance and light emitting characteristics, and has a wide application prospect.