The invention provides a machining method of a target assembly. The method comprises the steps that the sputtering target assembly is provided and comprises a target backboard, and aluminum is contained in target materials; and after the surface of the target backboard is subjected to the turning process, the surface, obtained after the turning process, of the target backboard is subjected to the polishing process at least two times. By means of the polishing process, pores in the surface of the target backboard are closed, the target backboard has the antioxidation function under the natural condition, and therefore the problem that the electric conductivity of the target backboard is reduced due to oxidation of the target backboard is avoided, then the phenomenon of abnormal discharge or outage of a sputtering target in the sputtering process is avoided, and the quality of the sputtering target is guaranteed.