The invention discloses a low-cost in-vitro brain-computer interface
chip batch preparation method and a low-cost in-vitro brain-computer interface
chip batch preparation device, and belongs to the technical field of
biosensor and micro-
nano manufacturing. The method comprises the following steps: cleaning, photoetching,
sputtering a
metal layer, stripping, depositing an insulating layer,
overlay,
etching and exposing an
electrode site and a bonding pad on a glass or
silicon insulating substrate in sequence, preparing a 3D
electrode by combining secondary
overlay with electrochemical deposition, and finally separating a plurality of independent
microelectrode arrays through scribing or
laser cutting. The
microelectrode bonding pad and the adapter plate are connected by adopting an aluminum wire pressure
welding technology, and an aluminum wire is embedded by high-temperature-resistant insulating glue and adheres to the
cell culture ring. According to the method, the
microelectrode arrays of various specifications are prepared on a single substrate in batches, the process compatibility is high, the cost is low, the efficiency is high,
microscopic observation and 3D
electrode integration are facilitated, and the method is suitable for in-vitro
neuron network detection and
organoid electrophysiology and electrochemical research.