The invention discloses a multi-stage HDI circuit board and a manufacturing method thereof. The circuit board comprises a first core board, a second core board and a porous filling layer. The first core plate is composed of a porous material base layer and first conductive pattern
layers on the upper and lower sides; the second core plate is arranged on the outer layer of the first core plate and comprises an inner side PP layer and a second conductive pattern layer covering the inner side PP layer, the PP layer is provided with conducting holes and heat dissipation holes, the conducting holes are filled with conductive
metal materials to achieve conduction, the heat dissipation holes are blind holes, the bottoms of the heat dissipation holes directly penetrate through the base layer, and the heat dissipation holes are filled with porous materials to enhance heat dissipation. The manufacturing method comprises the steps of
cutting, pressing,
etching, drilling, conductive material filling,
polishing, secondary
etching, secondary drilling, porous material hole filling, plate
cutting and the like. Through the cooperation of the porous material base layer and the porous filling
layers in the heat dissipation holes, the heat dissipation performance of the HDI circuit board is significantly improved, the conduction structure is optimized, the structural strength is enhanced, the manufacturing flexibility is improved, the cost is reduced, and the HDI circuit board is suitable for various application scenes of high-density
interconnection circuit boards.