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High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive

A printed circuit board, rigid-flex combination technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problems of high fluidity of the adhesive film, thick adhesive film, unfavorable environmental protection, etc., and achieve good flexibility , Improve cross-linking density, high heat resistance

Active Publication Date: 2015-01-07
华烁电子材料(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of glass fiber cloth, the adhesive film is generally thicker (>0.05mm); due to the greater fluidity of epoxy resin, the fluidity of the adhesive film is greater (≥5); at the same time, its adhesives are basically solvent-based , which is unfavorable to environmental protection; and its heat resistance can basically only reach the ordinary level (≤288°C)

Method used

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  • High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive
  • High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive
  • High heat-resistant low-fluidity adhesive for rigid-flexible printed circuit board, adhesive film and preparation method of high heat-resistant low-fluidity adhesive

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example A1

[0039]In the reactor, add emulsifying agent 2kg sodium lauryl sulfate, 1kg op-10, deionized water 150kg, initiator potassium persulfate 0.25kg, acrylate comonomer methyl methacrylate 10kg, styrene 15kg, 10kg of butyl acrylate, 15kg of isooctyl acrylate, and 2.5kg of carboxyl monomer acrylic acid, under the protection of nitrogen, slowly stir and raise the temperature to initiate the reaction. Seed emulsion; then at 75°C to 80°C, slowly drop the remaining acrylate comonomer methyl methacrylate 10kg, styrene 15kg, butyl acrylate 10kg, acrylate isooctyl 15kg, carboxyl monomer acrylic acid 2.5 kg of the mixture was dripped in about 2-4 hours, and then 0.25 kg of the remaining initiator potassium persulfate was added, kept at 80°C for 1-3 hours, cooled and discharged to obtain the polyacrylate emulsion A1.

Synthetic example A2～A5

[0040] Synthesis example A2~A5, B1~B5

[0041] The synthesis methods and conditions of Synthesis Examples A2~A5, B1~B5 are the same as those of Synthesis Example A1, except that the type and quality of each raw material are different. In the synthesis of B1~B5, the carboxyl-active monomers are replaced with corresponding shrinkage resins in the following table. Glycerin active monomer.

[0042] Table 1 shows the raw materials of Synthesis Examples A2 to B5.

[0043] The raw material list of table 1 synthesis example A1~B5

[0044]

[0045]

[0046] Preparation of adhesive and preparation of high heat-resistant low-fluidity adhesive film for rigid-flexible printed circuit boards:

Embodiment 1

[0049] Add 100kg of polyacrylate emulsion A1, 60kg of polyacrylate emulsion B1, and 35kg of ultrafine aluminum silicate in the ball mill barrel, and grind and disperse in the ball mill for 12 to 72 hours; dissolve 0.5kg of BPEF in 50kg of absolute ethanol, and add to Stir evenly into the above latex solution; finally add 0.6kg HEC to adjust the viscosity to 1500-2000cps, filter through a 300-mesh filter and set aside for use.

[0050] Coat the above prepared glue solution on the polyester release film through a coating machine, control the thickness of the dry glue after drying to 10-25 μm, and then compound the polyester release film to prepare rigid-flexible printing High heat resistance and low fluidity adhesive film for circuit boards.

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Abstract

The invention provides a high heat-resistant low-fluidity adhesive for a rigid-flexible printed circuit board, an adhesive film and a preparation method of the high heat-resistant low-fluidity adhesive. The high heat-resistant low-fluidity adhesive comprises the following components in parts by weight: 100 parts of a polyacrylate emulsion A, 50-150 parts of a polyacrylate emulsion B, 0.5-5 parts of a fluorene curing catalyst, 0.2-5 parts of a thickener and 30-60 parts of packing; the polyacrylate emulsion A is a multicomponent copolymerized polyacrylate emulsion which is prepared from an acrylate copolymerization monomer, a carboxyl active monomer, deionized water and an initiator by copolymerization; the polyacrylate emulsion B is a multicomponent copolymerized polyacrylate emulsion which is prepared from an acrylate copolymerization monomer, a glycidyl active monomer, deionized water and a initiator by copolymerization; and the adhesive forms the adhesive film. The adhesive film has good flexibility and excellent heat resistance, and simultaneously has relatively low fluidity, relatively high peel strength, and good electrical property and chemical resistance.

Description

technical field [0001] The invention belongs to the application field of polymer materials, and in particular relates to a high heat-resistant and low fluidity adhesive for a rigid-flexible printed circuit board, an adhesive film and a preparation method thereof. Background technique [0002] Rigid-flex printed circuit board is a combination of soft board and hard board. It is a circuit board formed by combining thin-layer flexible printed circuit boards and rigid printed circuit boards and laminating them into a single component. Rigid-flex printed circuit board, as a special interconnection technology, is a new type of printed circuit board with both the durability of rigid printed circuit boards and the adaptability of flexible printed circuit boards, which can reduce the cost of electronic products. Assembly size, weight, avoid connection errors, realize three-dimensional assembly under different assembly conditions, and have strong resistance to harsh environment applic...

Claims

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Application Information

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IPC IPC(8): C09J125/14C09J133/20C09J133/08C09J11/06C09J11/04C09J11/08C09J7/00C08F212/08C08F220/14C08F220/18C08F220/44
Inventor 范和平严辉李桢林张雪平杨蓓石玉界李静刘莎莎陈伟韩志慧
Owner 华烁电子材料(武汉)有限公司
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