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Polyimide film, preparation method thereof and graphite film

A polyimide film and polyimide technology, applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of reducing the heat dissipation effect, improve appearance, facilitate gas dissipation, free body base big effect

Active Publication Date: 2022-05-06
广东鸿翔瑞材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, graphite film and thermally conductive materials are prone to problems such as thermal interface, which reduces the heat dissipation effect

Method used

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  • Polyimide film, preparation method thereof and graphite film
  • Polyimide film, preparation method thereof and graphite film

Examples

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preparation example Construction

[0022] One embodiment of the present application also provides a method for preparing a polyimide film, which includes the following steps:

[0023] Adding the diamine monomer, the dianhydride monomer and the catalyst into an organic solvent, stirring and reacting under a nitrogen atmosphere to obtain a polyamic acid solution;

[0024] Carrying out imidization treatment to the polyamic acid solution to obtain a polyimide solution;

[0025] Coating the polyimide solution on a support plate to obtain a polyimide coating film;

[0026] The polyimide film is baked and cured to obtain the polyimide film.

[0027] The polyimide solution includes the polyimide polymer and the organic solvent, and the polyimide polymer is dissolved in the organic solvent. In some embodiments, the organic solvent accounts for 80-85% by weight of the polyimide solution, in other words, the polyimide solution has a solid content of 15-20%.

[0028] It can be understood that the polyamic acid solution ...

Embodiment 1

[0036] Add diamine ENPSDA (0.1mol, 44.22g), catalyst (0.015g), dianhydride ODPA (0.1mole, 31.02g) and solvent NMP (300.97g) into a 500ml reaction flask to obtain a mixture with a solid content of 15-20%. The solution was stirred for 5 hours under a nitrogen atmosphere, then 60.2 g of xylene (Xylene) was added, and the temperature was raised to 190-200° C. and stirred for 15 hours under a nitrogen atmosphere to carry out dehydration and cyclization to obtain a polyimide solution.

Embodiment 2

[0038]Add diamine ENPSDA (0.09mol, 39.80g), diamine ODA (0.01mol, 2.0g), catalyst (0.015g), dianhydride ODPA (0.1mole, 31.02g) and solvent NMP (291.30g) into a 500ml reaction flask ) to obtain a mixed solution with a solid content of 15 to 20%, stirred for 5 hours under a nitrogen atmosphere, then added 58.30 g of xylene (Xylene), and heated up to 190 to 200° C. and stirred for 15 hours under a nitrogen atmosphere to carry out a water removal ring to obtain a polyimide solution.

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Abstract

The present application provides a polyimide film comprising a polyimide polymer. The polyimide polymer comprises a reaction product of a diamine monomer and a dianhydride monomer, and the diamine monomer comprises N, N-bis (4-aminophenyl)-N, N-diphenyl-1, 4-phenylenediamine. The polyimide film provided by the invention can be used for preparing a thick graphite film. The invention also provides a graphite film prepared from the polyimide film and a preparation method of the polyimide film.

Description

technical field [0001] The present application relates to the field of heat dissipation materials, in particular to a polyimide film, a graphite film using the polyimide film and a preparation method of the polyimide film. Background technique [0002] Artificial graphite film has become a commonly used heat dissipation material for electronic products because of its high heat dissipation coefficient and low density. Artificial graphite film is usually made of polyimide film after carbonization, graphitization and calendering. The carbon content of the commonly used polyimide film after graphitization is low, and the thickness will be greatly reduced when rolling, so that the thickness of the prepared graphite film is low. The graphite film needs to be used together with a thermally conductive material as a heat dissipation material for electronic products. However, graphite films and thermally conductive materials are prone to problems such as thermal interfaces, which re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C01B32/205
CPCC08J5/18C08G73/1071C08G73/1067C08G73/1028C01B32/205C08J2379/08Y02E60/10
Inventor 李冠纬苏赐祥
Owner 广东鸿翔瑞材料科技有限公司
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