Adhesive for flexible electronic substrate as well as preparation method and application thereof

A technology for electronic substrates and adhesives, applied in the direction of adhesives, modified epoxy resin adhesives, adhesive types, etc., can solve the problems of adhesive residue and high bonding strength, and achieve less residual adhesive and heat resistance Good, high bonding strength effect

Active Publication Date: 2017-11-24
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the problem is that the realization of low peel strength is based on the premise of sacrificing the bonding strength, so it can only be applied to occasions with low bonding strength requirements
When the temperature is lower than the melting point of the crystalline material, the crystalline material is in a crystalline state, and the bonding strength is high. When the temperature is higher than the melting point of the crystalline material, the crystalline material is in a molten state, and the fluidity becomes better, making the adhesive easy to peel off, but this type of adhesive Severe adhesive residue after peeling off

Method used

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  • Adhesive for flexible electronic substrate as well as preparation method and application thereof
  • Adhesive for flexible electronic substrate as well as preparation method and application thereof
  • Adhesive for flexible electronic substrate as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Mix 100 parts of bisphenol A epoxy-modified acrylate resin (Wenzhou Hengli Printing Materials Co., Ltd., HL-160) with 20 parts of epoxy resin (Bluestar Nantong Xingchen Synthetic Materials Co., Ltd., WSR618), and add 18 1 part of glycidyl methacrylate and 3.6 parts of 1-hydroxycyclohexyl phenyl ketone (Zhejiang Yangfan New Material Co., Ltd., PI008), under dark conditions, use mechanical stirring to mix evenly to obtain component A, and use 2 parts of two Ethylene triamine is component B, which is the two-component BDB adhesive for flexible electronic substrates.

[0074] Add component B to component A and stir evenly, place in a vacuum oven to remove air bubbles, and use an applicator to evenly coat the adhesive on the cleaned hard glass substrate (the thickness of the adhesive layer is 0.1mm). Then the polyimide film (Shanghai Synthetic Resin Research Institute, H film) is pasted on the hard glass substrate coated with adhesive, cured at room temperature for 30min, an...

Embodiment 2～4

[0077] The method of Example 1 is adopted to prepare the adhesive for two-component BDB flexible electronic substrates, the difference is only in changing the amount of diethylenetriamine, its adhesive strength, peel strength and T onset See Table 1 for the values.

[0078] Table 1

[0079]

Embodiment 5～7

[0081] The method of Example 1 was used to prepare the adhesive for two-component BDB flexible electronic substrates. onset See Table 2 for the values.

[0082] Table 2

[0083]

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PUM

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Abstract

The invention discloses an adhesive for a flexible electronic substrate and a preparation method thereof. The adhesive is prepared by mixing the following components in parts by weight: 100 parts of modified acrylate resin, 10-100 parts of epoxy resin, 1-10 parts of a photoinitiator, 8-15 parts of a reactive diluent and 1-15 parts of a thermal initiator. The invention also discloses application of the adhesive in manufacturing procedure of the flexible electronic substrate. The BDB (Bonding and Debonding) adhesive prepared by the invention combines the advantages of the epoxy resin and the acrylate resin, solves the problem that an ordinary adhesive cannot be stripped or greatly remains after being stripped, has the characteristics of being firm in combination with glass and flexible plastic electronic substrates, liable to strip, small in adhesive residual amount and convenient in construction, being safe and environment friendly and the like, can replace the traditional unpeelable type adhesive and is used for preparation of flexible display screens of electronic equipment such as tablet personal computers, mobile phones, kindle.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an adhesive for flexible electronic substrates, a preparation method thereof, and an application in the processing of flexible electronic substrates. Background technique [0002] With the global energy crisis and the rapid development of science and technology, various intelligent electronic information products that are ultra-thin, low-energy-consuming, ergonomic and environmentally friendly are sprouting and appearing on the market. If the flexible electronic substrate used for this type of product uses traditional LCD assembly equipment and technology, it will be deformed due to heat. If new equipment and technology are developed, the cost will increase. Therefore, the flexible substrate is temporarily fixed on the hard substrate (carrier) The above method to reduce the bending deformation of the flexible substrate during TFT and other processes. [0003] Among the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J175/14H01L21/683
Inventor 张文清申屠宝卿
Owner ZHEJIANG UNIV
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