97results about "Electron multiplier details" patented technology

The invention discloses a photomultiplier installation protection structure. The structure has the following beneficial effects: a rubber clamp sleeve is sleeved on a tail tube of a photomultiplier, and a metal shell is added to the outside the rubber clamp sleeve to apply certain pre-tightening force to the rubber clamp sleeve, so that the photomultiplier can be tightly wrapped up and can not radially drift; a clamp slot is arranged in the rubber clamp sleeve and a ceramic substrate of the photomultiplier is clamped in the clamp slot, thus solving the problem of axial drifting of the photomultiplier; therefore, the photomultiplier is hard to damage due to vibration; besides, the whole photomultiplier is hermetically put in the metal shell, thus avoiding the possible impact of hard light irradiation on the photomultiplier; in terms of installation, a through slot is arranged at one side of the rubber clamp sleeve and a slot with middle parts connected is arranged at the opposite side of the rubber clamp sleeve, so that the two parts of the clamp sleeve are incompletely disconnected, when the photomultiplier is put in the clamp sleeve, the two parts of the clamp sleeve are disconnected along the through slot and the tail tube of the photomultiplier is put in the inner cavity of the clamp sleeve, and the operations are very convenient; and the structure is simple and packaging process is simple and convenient, effects are good.

An image intensifier tube includes a collimator having multiple channels for receiving electrons from a photocathode layer, and a microchannel plate (MCP) having multiple channels for receiving electrons from the collimator. An ion barrier film (IBF) is disposed on top of an input side of the MCP, in which the IBF includes a small amount of conductive material. The IBF may include alumina doped with chromium oxide, or manganese oxide, or any other conductive material. The small amount of conductive material includes 1% to 5% of conductive material in a layer of non-conductive material.

The invention discloses an open type micro channel plate assembly used for space environment. All components are split into single bodies, thereby facilitating processing; then micro channel plates can be accommodated and clamped through design of a frame with seam allowances, so that assembling is convenient and stability of a product can be guaranteed; polyimide frames are adopted to clamp the micro channel plates and electrodes; polyimide has the characteristics of strong insulativity, high mechanical strength, good processing manufacturability, low air escape rate and the like, is suitable for working requirements of the micro channel plate assembly, and is also suitable for application to space environment; and a conductive foil is added between the micro channel plates, the conductive foil can form an appropriate gap between the micro channel plates, electrons can move freely in the gap, the probability of incidence to the second micro channel plate is increased, and a gain of the micro channel plate assembly is improved. A traditional micro channel plate assembly does not use the conductive foil.