Open type micro channel plate assembly used for space environment

A technology of micro-channel plate and space environment, which is applied in the field of mechatronics, can solve the problems that the product cannot meet the requirements of processing and manufacturing, and the process is complicated, so as to achieve the effects of improving reliability, good processing technology, and strong insulation

Active Publication Date: 2017-03-22
SHANDONG INST OF AEROSPACE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

In this patented method described in detail, it allows for easier handling and manufacturing of small electronic devices such as microsystems (MEMS). These MEMS have tiny channels called pumps where different chemical reactions happen inside them. Each channel contains two parts - one part being filled with liquid molecules and another part containing atoms like oxygen gas. When these liquids react chemically they create new particles on top of other ones. To prevent leakages from cracks caused during operation, there must be some way to securely hold all those chambers together without leaving any gaps. Additionally, adding multiple layers of materials helps reduce heat generation and maintain stable performance over time should temperature changes affect its properties. Overall, this process simplifies production processes and improves overall quality control efficiency.

Problems solved by technology

This patented technology describes how electronic devices can multiply more efficiently when they use microscope plates instead of traditional methods like film techniques such as CCD cameras that require expensive equipment. However, there currently exist challenges related to producing these types of plates due to their complexity and costly processes involved during fabrication.

Method used

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  • Open type micro channel plate assembly used for space environment
  • Open type micro channel plate assembly used for space environment
  • Open type micro channel plate assembly used for space environment

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Embodiment Construction

[0027] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0028] Such as figure 1 As shown, the microchannel plate assembly of the present invention includes an upper outer support frame 12, an upper support frame 41, an MPO (microporous optical device) plate 1, a first electrode 6, a middle support frame 5, and a second electrode 7 from top to bottom. , the first MCP board 2, the conductive foil 11, the second MCP board 3, the third electrode 8, the lower support frame 42 and the lower end outer support frame 13; the MPO board 1, the first MCP board 2 and the second MCP board 3 are all The rectangular structure with an aspect ratio of 2:1 can be easily spliced, and can be spliced ​​into a rectangle or a square, suitable for an array structure.

[0029] The outer support frame 12 at the upper end, the upper support frame 41, the middle support frame 5, the lower support frame 42 and the outer support frame 13 at...

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Abstract

The invention discloses an open type micro channel plate assembly used for space environment. All components are split into single bodies, thereby facilitating processing; then micro channel plates can be accommodated and clamped through design of a frame with seam allowances, so that assembling is convenient and stability of a product can be guaranteed; polyimide frames are adopted to clamp the micro channel plates and electrodes; polyimide has the characteristics of strong insulativity, high mechanical strength, good processing manufacturability, low air escape rate and the like, is suitable for working requirements of the micro channel plate assembly, and is also suitable for application to space environment; and a conductive foil is added between the micro channel plates, the conductive foil can form an appropriate gap between the micro channel plates, electrons can move freely in the gap, the probability of incidence to the second micro channel plate is increased, and a gain of the micro channel plate assembly is improved. A traditional micro channel plate assembly does not use the conductive foil.

Description

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Claims

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Application Information

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Owner SHANDONG INST OF AEROSPACE ELECTRONICS TECH
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