Buffer layer of secondary electron emission film and preparation method thereof
A technology for secondary electron emission and buffer layer, which is applied in electron multiplier details, coating, sputtering and other directions, and can solve the problems of reducing the grain size of magnesium oxide and reducing the secondary electron emission performance of composite films. , to achieve the effect of promoting growth and improving the performance of secondary electron emission
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] refer to figure 1 , indicating a secondary electron emission source structure of a magnesium oxide composite thin film doped with metal materials. The secondary electron emission source is composed of a metal base 1 , a nickel oxide buffer layer 2 fabricated on the metal base 1 , and a magnesium oxide layer 3 doped with metal materials fabricated on the nickel oxide buffer layer 2 . The preparation of nickel oxide buffer layer 2 comprises the following steps:
[0026] The metal substrate 1 is cleaned. First, before depositing the nickel oxide buffer layer 2 on the metal substrate 1, the metal substrate 1 is cleaned, the metal substrate 1 is put into a container, acetone is poured into the container to soak the metal substrate 1, and the container is put into ultrasonic cleaning The metal base 1 was ultrasonically cleaned in the machine for 15 minutes, and then the acetone in the container was replaced with ethanol and pure water in turn, and the metal base 1 was ultra...
Embodiment 2
[0029] refer to figure 1 , indicating a secondary electron emission source structure of a magnesium oxide composite thin film doped with metal materials. The secondary electron emission source is composed of a metal base 1 , a nickel oxide buffer layer 2 fabricated on the metal base 1 , and a magnesium oxide layer 3 doped with metal materials fabricated on the nickel oxide buffer layer 2 . The preparation of nickel oxide buffer layer 2 comprises the following steps:
[0030] The metal substrate 1 is cleaned. First, before depositing the nickel oxide buffer layer 2 on the metal substrate 1, the metal substrate 1 is cleaned, the metal substrate 1 is put into a container, acetone is poured into the container to soak the metal substrate 1, and the container is put into ultrasonic cleaning The metal base 1 was ultrasonically cleaned in the machine for 15 minutes, and then the acetone in the container was replaced with ethanol and pure water in turn, and the metal base 1 was ultra...
Embodiment 3
[0033] refer to figure 1 , indicating a secondary electron emission source structure of a magnesium oxide composite thin film doped with metal materials. The secondary electron emission source is composed of a metal base 1 , a nickel oxide buffer layer 2 fabricated on the metal base 1 , and a magnesium oxide layer 3 doped with metal materials fabricated on the nickel oxide buffer layer 2 . The preparation of nickel oxide buffer layer 2 comprises the following steps:
[0034]The metal substrate 1 is cleaned. First, before depositing the nickel oxide buffer layer 2 on the metal substrate 1, the metal substrate 1 is cleaned, the metal substrate 1 is put into a container, acetone is poured into the container to soak the metal substrate 1, and the container is put into ultrasonic cleaning The metal base 1 was ultrasonically cleaned in the machine for 15 minutes, and then the acetone in the container was replaced with ethanol and pure water in turn, and the metal base 1 was ultras...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
size | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com