Block-by-block seamless laser processing method for circuit boards for thick gas electron multipliers

Abstract

The invention discloses a block-by-block seamless laser processing method for a circuit board used in a thick gas electron multiplier, which comprises the following steps: 1) Cutting the material according to the design requirements to obtain the original board; 2) Drilling the original board obtained in the step 1) cutting Positioning holes; 3) Cover the dry film layer with the original plate treated in step 1), and expose and develop the dry film layer; 4) Carry out copper window etching on the original plate treated in step 3) and remove the dry film; 5) In step 4) Laser drilling on the treated original board; 6) preparing the outer circuit on the treated original board in step 5), and acid etching; 7) electroplating gold on the surface of the original board after step 6). The invention provides a block-by-block seamless laser processing method for a thick gas electron multiplier circuit board that improves product quality, improves compatibility of processing methods, and reduces processing difficulty.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board for a thick gas electron multiplier, in particular to a segmented block seamless laser processing method for a circuit board for a thick gas electron multiplier. Background technique [0002] Thick GEM, Thick gaseous electron multiplier (Thick gaseous electron multiplier, THGEM) is a new structure gas detector developed on the basis of traditional GEM. The basic structure of the GEM detector is: an array of tiny holes is made on an insulating plate covered with a thin conductive metal layer on the upper and lower surfaces. Due to the existence of the microporous structure, when a certain voltage difference is applied to the electrodes on the upper and lower planes, a strong electric field can be formed in the hole. When the microporous structure is in a specific working gas, if ionized electrons appear around the pores, the electron avalanche multiplication process can occur in the wo...

AI Technical Summary

Problems solved by technology

This process needs to be combined with a laser lithography system with high positioning accuracy, the cost is high, and its rim can also reach 100μm

The fourth such as figure 1 As shown in middle d, no protective film is covered, and the entire plate is directly etched after mechanical drilling, so that the thickness of the copper layer will decrease with the increase of the rim size, and the control is relatively difficult

Too thin board or too soft board will have large board size expansion and contraction, and the precision is difficult to control, especially after multiple processes, the concentricity of the insulating ring and the through hole will drop significantly

However, if the plate is too thick, the laser processing energy needs to be increased. For the double positioning processing mode, if the laser energy is too large, the insulating ring will not be etched clean, and even the hole wall will be severely carbonized, which will affect the yield of the product.

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