A multi-
chip package includes: an
interposer; a first IC
chip over the
interposer, wherein the first IC
chip is configured to be programmed to perform a logic operation, comprising a NVM
cell configured to store a resulting value of a look-up table, a
sense amplifier having an input data associated with the resulting value from the NVM
cell and an output data associated with the first input data of the
sense amplifier, and a logic circuit comprising a
SRAM cell configured to store data associated with the output data of the
sense amplifier, and a
multiplexer comprising a first set of input points for a first input
data set for the logic operation and a second set of input points for a second input
data set having data associated with the data stored in the
SRAM cell, wherein the
multiplexer is configured to select, in accordance with the first input
data set, an input data from the second input data set as an output data for the logic operation; and a second IC chip over the
interposer, wherein the first IC chip is configured to pass data associated with the output data for the logic operation to the second IC chip through the interposer.