The invention discloses a segmented
polycrystalline silicon deep groove
silicon carbide MOSFET, and belongs to the technical field of
semiconductor power devices. According to the device, a P +
polycrystalline silicon section connected with a source
electrode, a lightly doped Npolycrystalline
silicon section and an N +
polycrystalline silicon section connected with a grid
electrode are sequentially arranged in a deep groove in the
depth direction, and the P + polycrystalline
silicon section, the lightly doped Npolycrystalline silicon section and the N + polycrystalline silicon section jointly form a polycrystalline silicon
diode structure similar to a PIN. The P + polycrystalline silicon section at the bottom of the groove is used for shielding an
electric field, the gate-drain
coupling capacitance (Cgd) is effectively reduced, and the switching characteristic of the device is improved; meanwhile, by utilizing the characteristic that the
reverse leakage current of the PIN structure is obviously increased under the short-circuit temperature rise, the self-adaptive reduction of the gate-source
voltage (Vgs) is realized through gate loop resistance
voltage division, so that the short-circuit current is inhibited. While
voltage resistance and conduction performance of the device are ensured, short-circuit endurance capability and safe turn-off reliability of the device are remarkably improved.