The invention discloses an
indium phosphide wafer substrate cleaning control method and
system based on
fluid pressure, and relates to the technical field of
semiconductor material
processing. The method comprises the following steps: acquiring reference lattice response rates,
recovery rates and
distortion reversible range thresholds in different
crystal directions; measuring the fluid
impact pressure and the
lattice strain value of each area in real time in the cleaning process, and generating a real-time lattice response rate; the real-time lattice
recovery rate is measured through intermittent
voltage reduction; comparing the real-
time rate with the
reference rate to generate a response deviation and a
recovery deviation, and identifying a lattice damage
risk area according to the response deviation and the recovery deviation; the
lattice strain value of the
risk area is subjected to deviation correction and then is compared with a threshold value, the non-
risk area is directly compared, and critical reversible pressure of each area is generated; and
dynamic pressure regulation and control references facing different
crystal orientations are output according to the critical pressure of each region. According to the invention, real-time monitoring and damage
risk identification of the lattice state in the
wafer cleaning process are realized, and an accurate reference is provided for
differential pressure regulation and control.