Multi-wire array-laser three-dimensional scanning system and multi-wire array-laser three-dimensional scanning method
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- BEIJING TENYOUN 3D TECH CO LTD
- Publication Date
- 2016-01-06
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to the technical field of three-dimensional scanning of object surface geometry, in particular to a multi-line array laser three-dimensional scanning system and a multi-line array laser three-dimensional scanning method. Background technique
[0002] In recent years, 3D scanning, as a fast 3D digital technology, has been increasingly used in various fields, including reverse engineering, industrial inspection, computer vision, CG production, etc., especially in the current rapidly developing 3D printing and intelligent manufacturing. In the field of 3D scanning, as a front-end 3D digitization and 3D visual sensing technology, it has become an important part of the industry chain; at the same time, various applications have raised the bar in many aspects such as the cost, practicability, accuracy and reliability of 3D scanning equipment. higher requirement.
[0003] Optical 3D scanning is the most common modern technical means in ...