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343 results about "Piezoelectric membrane" patented technology

Piezoelectric ultrasonic transducer and manufacturing method thereof

The invention provides a piezoelectric ultrasonic transducer and a manufacturing method thereof. The piezoelectric ultrasonic transducer comprises a base, a vibrating membrane, a first electrode, a piezoelectric membrane and a second electrode, wherein the center of the base is provided with a cavity; the vibrating membrane is fixed to the base; the first electrode, the piezoelectric membrane and the second electrode are sequentially deposited on the vibrating membrane along a direction from the base to the vibrating membrane; the piezoelectric ultrasonic transducer is characterized in that the vibrating membrane comprises a first vibrating membrane and a second vibrating membrane, wherein the first vibrating membrane is positioned at the center; the second vibrating membrane is positioned at the outer side of the first vibrating membrane; the first vibrating membrane and the second vibrating membrane are arranged in a spaced manner and are connected with each other through an elastic structure layer; and the piezoelectric ultrasonic transducer is also provided with a through hole at a position corresponding to the elastic structure layer, wherein the through hole penetrates through the second electrode, the piezoelectric membrane and the first electrode. The piezoelectric ultrasonic transducer provided by the invention can improve output of sound pressure.
Owner:AAC TECH PTE LTD

Transparent piezoelectric sheet with frame containing transparent piezoelectric sheet, touch panel containing transparent piezoelectric sheet, and electronic device

Disclosed is a transparent piezoelectric sheet with a frame, which has a wider effective area, is capable of more accurate touch pressure recognition, and has low manufacturing cost and a pleasing appearance. The piezoelectric sheet with a frame comprises one transparent piezoelectric membrane containing an organic polymer, one first transparent flat-plate electrode disposed to a first principal surface of the transparent piezoelectric membrane, and one second transparent flat-plate electrode disposed to a second principal surface of the transparent piezoelectric membrane. The first transparent flat-plate electrode includes a first transparent flat-plate electrode section, and the second transparent flat-plate electrode includes a second transparent flat-plate electrode section. The outline of the second transparent electrode section includes a transparent piezoelectric sheet, which when seen in plan view is positioned inside the outline of the first transparent flat-plate electrode section, and a frame covering the periphery of the transparent piezoelectric sheet. The outline of the first transparent flat-plate electrode section when seen in plan view overlaps the whole of the frame, and the outline of the second transparent flat-plate electrode section does not overlap the frame at all.
Owner:DAIKIN IND LTD +1

Soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip and prepration method thereof

The invention relates to a soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip which comprises a silicon substrate with a square conical hole which is small at the top andbig at the bottom in the center; a silicon layer and a first oxidation layer are sequentially covered on the front surface of the silicon substrate, and a second oxidation layer is covered on the backsurface; the corresponding silicon layer and the first oxidation layer above the square hole of the front surface of the silicon substrate constitute a square vibration membrane, one pair of oppositesides of the square vibration membrane respectively etch a vertical narrow slot, and the vertical projection of each narrow slot is positioned on the inner side of the hole edge above the front surface of the silicon substrate; a lower electrode, a piezoelectric membrane and an upper electrode are sequentially deposited on the square vibration membrane; a polyimide membrane is deposited on various parts on the front surface of the silicon substrate; and the square vibration membrane which is etched with the vertical narrow slots and the polyimide membrane commonly constitute a soft support anti-sound leakage bridge type vibration membrane. The anti-sound leakage bridge type structure is used on the vibration membrane of the transducer; in order to avoid sound leakage through the narrow slots, the soft polyimide membrane is deposited on the narrow slots, which has little effect on vibration of the vibration membrane and can still keep high sensitivity.
Owner:INST OF ACOUSTICS CHINESE ACAD OF SCI

High-frequency closely-spaced piezoelectric film hydrophone array and production method thereof

The invention relates to the technical field of underwater sound transducers, in particular to a high-frequency hydrophone array applicable to underwater phased array camera and a production method thereof, and solves the technical problems that a large cardinal number of high-frequency hydrophone array elements need to be accurately located and disposed in a limited array area and charge sensed by efficient coupling array elements is required to pick up and receive high-frequency weak underwater sound signals. A piezoelectric device PVDF (polyvinylidene fluoride) film, a rigid backing and PCBs (printed circuit board) are jointed; the high-frequency PVDF hydrophone backing is made of copper to increase sensitivity; multiple layers of PCBs are used as a substrate; a large number of array element backings are integrally pre-processed; the array element backing clusters are positioned and fitted to the PCB substrate; the backing units are separated by secondary processing; decoupling bars are added among the separated units; the piezoelectric film is adhered to form an array; finally, watertight sealing is performed to form the high-frequency piezoelectric film hydrophone array. The high-frequency hydrophone array is applicable to high-frequency sonar receiving arrays for imaging sonar, multi-beam sonar, side-scan sonar and the like.
Owner:THE 715TH RES INST OF CHINA SHIPBUILDING IND CORP

High-frequency acoustic wave resonator and preparation method thereof

The invention provides a high-frequency acoustic wave resonator and a preparation method thereof. The high-frequency acoustic wave resonator comprises a high-acoustic-velocity support substrate, an insulating dielectric layer which is located on the upper surface of the high-sound-velocity supporting substrate, a piezoelectric film which is located on the upper surface of the insulating dielectriclayer, and an interdigital electrode which is located on the upper surface of the piezoelectric film. By arranging the high-sound-velocity supporting substrate below the piezoelectric film, the soundvelocity of target elastic waves excited and propagated in the piezoelectric film can be increased, propagation of the target elastic waves can be effectively restrained, and the resonant frequency of the high-frequency sound wave resonator is improved; the insulating dielectric layer is arranged between the piezoelectric film and the high-sound-velocity supporting substrate, the leakage of electric field energy in the piezoelectric film can be effectively reduced, and the electromechanical coupling coefficient of the high-frequency sound wave resonator can be enhanced; by selecting the appropriate insulating dielectric layer, temperature compensation can be carried out on the high-frequency acoustic wave resonator, temperature drift of the high-frequency acoustic wave resonator is reduced, and temperature stability of the high-frequency acoustic wave resonator is improved.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Soft support bridge type silicon micro-piezoelectric microphone chip and prepration method thereof

The invention relates to a soft support bridge type silicon micro-piezoelectric microphone chip which comprises a silicon substrate with a square conical hole which is small at the top and big at thebottom, a square compound vibration membrane which consists of a first silicon nitride membrane layer, a silicon dioxide membrane layer and a second silicon nitride membrane layer is covered on the front surface of the silicon substrate, and a third silicon nitride membrane layer and a fourth silicon nitride membrane layer are sequentially covered on the back surface of the silicon substrate; thethird and the fourth silicon nitride membrane layers both have central square holes; one pair of opposite sides of the vibration membrane respectively etch a vertical narrow slot penetrating the vibration membrane, and the vertical projection of each narrow slot is positioned on the inner side of the edge of the square hole in the front surface of the silicon substrate; a lower electrode, a piezoelectric membrane and an upper electrode are sequentially deposited on the vibration membrane; a polyimide membrane is deposited on various parts on the front surface of the silicon substrate; the compound vibration membrane which is etched with the vertical narrow slots and the polyimide membrane commonly constitute a soft support anti-sound leakage bridge type vibration membrane; two sides of thevibration membrane are fixedly supported, and strain can be produced during the vibration process; in order to prevent the microphone from producing sound leakage through the narrow slots, the soft polyimide membrane is deposited on the narrow slots, thereby being capable of effectively preventing sound leakage phenomenon.
Owner:INST OF ACOUSTICS CHINESE ACAD OF SCI

Production method for novel piezoelectric thin-film resonator

The invention relates to the technical field of micro-electronics technique and a device thereof, in particular to a preparation method of a novel piezoelectric membrane resonator. The invention is characterized in that an SOI wafer is adopted to etch a plurality of etch baths or etch pits on a top layer of silicon; then hydrofluoric acid is used for etching an insulating layer in the surrounded range among the baths or pits; a suspended silicon layer is formed on the top layer of the wafer; next, a bottom electrode material, a piezoelectric membrane material and a top electrode material are deposited on the suspended top layer of silicon in sequence so as to form the piezoelectric membrane resonator. The invention has the beneficial effects that the SOI wafer is adopted to manufacture a cavity-typed piezoelectric membrane resonator; wherein, an oxide layer between two layers of silicon is used as a sacrificial layer, thus saving the step of depositing the sacrificial layer and simplifying the technique; besides, the sacrificial layer is compatible with the silicon technique, therefore, a resonator array and an external circuit are integrated so as to lead the circuit to has the advantages of high speed, low voltage, low power consumption, high sensitivity, fast response speed and multiple channels and simultaneously lead the device to have higher degree of micromation and integration.
Owner:SHANGHAI UNIV OF ENG SCI

Polyvinylidene fluoride fiber array piezoelectric membrane and preparation method thereof

The invention relates to a polyvinylidene fluoride fiber array piezoelectric membrane and a preparation method of the polyvinylidene fluoride fiber array piezoelectric membrane, and belongs to preparation technologies of piezoelectric materials. The polyvinylidene fluoride fiber array piezoelectric membrane is formed by equal-length fibers which are closely arranged in an orientation mode, the diameter of each fiber is 30nm-500nm, and the thickness of the polyvinylidene fluoride fiber array piezoelectric membrane is 50microns-1000microns. The preparation method of the polyvinylidene fluoride fiber array piezoelectric membrane comprises the steps of preparing fiber bundles of highly-oriented arrangement through an electrostatic spinning polyvinylidene fluoride solution, manufacturing the fiber bundles into compact fiber bundle sticks, slicing the fiber bundle sticks, and obtaining the polyvinylidene fluoride fiber array piezoelectric membrane. The polyvinylidene fluoride fiber array piezoelectric membrane and the preparation method of the polyvinylidene fluoride fiber array piezoelectric membrane aim at overcoming the defect that high beta crystal phase transition and beta crystal phase orderly orientation arrangement cannot be achieved in an existing polyvinylidene fluoride piezoelectric membrane preparation technology. The preparation method of the polyvinylidene fluoride fiber array piezoelectric membrane is simple in operation, and achieves synchronous conduct of the high beta crystal phase transition and the beta crystal phase orderly orientation arrangement of polyvinylidene fluoride, the prepared polyvinylidene fluoride fiber array piezoelectric membrane has a high piezoelectric constant and an energy conversion coefficient, and each fiber is a piezoelectric generator.
Owner:WUHAN TEXTILE UNIV
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