The invention belongs to the technical field of
semiconductor manufacturing, and provides a POI substrate, a manufacturing process thereof and a
surface acoustic wave filter.The manufacturing process comprises the steps that a piezoelectric material film layer with a first bonding face is provided,
ion implantation is carried out from the first bonding face, then gluing,
exposure, developing and
etching are sequentially carried out on the first bonding face, and the POI substrate is obtained. Forming an opening in the piezoelectric material film layer; and the piezoelectric material film layer with the holes is bonded with a target substrate, then heat treatment is carried out, the injection surface is subjected to interface separation, a piezoelectric layer is reserved and formed on the target substrate, and the POI substrate is obtained. By means of combining photoetching and
etching, a hole is formed in one side of a bonding surface of a piezoelectric material film layer, and the hole penetrates into an injection surface of
ion injection, so that the hole can provide a release window for thermal stress generated in the subsequent heat treatment process, the quality of the transferred piezoelectric film layer is effectively improved, the uniformity and the integrity are improved, and the service life of the transferred piezoelectric film layer is prolonged. And the yield and the efficiency can be improved, and the cost can be reduced.