68results about How to "Prevent sound leakage" patented technology

Respiratory-based biofeedback devices, systems, and methods are provided. A respiratory biofeedback method includes producing a respiratory signal in response to a user's respiratory activity, generating an audio output signal that includes a modified version of the respiratory signal, and converting the audio output signal into sound waves output to the user to provide biofeedback. The sound waves can be output to the user in real time response to the user's respiratory activity. A microphone can be used to generate the respiratory signal. The generated audio output signal can includes the respiratory signal modified to increase a volume level of a portion of the respiratory signal where the volume level exceeds a specified volume level.

Problem: To provide a bone conduction speaker unit which can sufficiently prevent generation of sound leakage at the time of non-calling, and can be easily incorporated in a main body casing of mobile phones, and the like.

Solution: A bone conduction speaker unit, being configured by incorporating a bone conduction speaker main body 2 in a housing 1, wherein an elastic plate 21 is fixed on a top face of a plate yoke 17 of the bone conduction speaker main body 2; an elastic base 22 is disposed on a rear face of a yoke 11; and an elastic cover 3 for holding a contact 5 which, upon a pressing force having been applied thereto in use, is abutted against the plate yoke 17 through the elastic plate 21 is loaded on the housing 1 with a gap “a” being held between a bottom face of the contact 5 and a top face of the elastic plate 21.

It is aimed to provide a bone-conduction speaker device which makes no leakage of sound annoying the other and does not restrict posture and rolling-over motion of the user when lying on a bed or sitting on a sofa, and which makes highly reliable and excellent transmission and receiving of sound signal as to enable enjoying of music or the like with almost no locational restrictions. The speaker device comprises: a transmitter converting the inputted sound signal into output of infrared signal and then transmitting it; a receiver demodulating the inputted infrared signal into the sound signal; a bone-conduction speaker amplifying the sound signal and outputting it as sound vibration; and a pad-shaped elastic cushioning body holding on its surface the bone-conduction speaker, thereby forming a pad embedded with the bone-conduction speaker(s). Photo-acceptors for the receiver are arranged on fringe of the cushioning body as spaced apart to each other.

A volume adjusting apparatus includes a sound collecting unit configured to collect noise data of a surrounding environment, an analyzing unit configured to extract a feature value indicating a feature of the noise data collected by the sound collecting unit and a feature value indicating a feature of supplied musical tune data, and a control unit configured to generate volume adjustment information for adjusting playback volume of the musical tune data based on the feature value of the noise data and the feature value of the musical tune data and adjusts the playback volume of the musical tune data based on the volume adjustment information.

The invention relates to a soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip which comprises a silicon substrate with a square conical hole which is small at the top andbig at the bottom in the center; a silicon layer and a first oxidation layer are sequentially covered on the front surface of the silicon substrate, and a second oxidation layer is covered on the backsurface; the corresponding silicon layer and the first oxidation layer above the square hole of the front surface of the silicon substrate constitute a square vibration membrane, one pair of oppositesides of the square vibration membrane respectively etch a vertical narrow slot, and the vertical projection of each narrow slot is positioned on the inner side of the hole edge above the front surface of the silicon substrate; a lower electrode, a piezoelectric membrane and an upper electrode are sequentially deposited on the square vibration membrane; a polyimide membrane is deposited on various parts on the front surface of the silicon substrate; and the square vibration membrane which is etched with the vertical narrow slots and the polyimide membrane commonly constitute a soft support anti-sound leakage bridge type vibration membrane. The anti-sound leakage bridge type structure is used on the vibration membrane of the transducer; in order to avoid sound leakage through the narrow slots, the soft polyimide membrane is deposited on the narrow slots, which has little effect on vibration of the vibration membrane and can still keep high sensitivity.

A stethoscope amplifier headset for receiving, isolating and transferring sound received from a stethoscope to a user's ears, the stethoscope sound isolation headset including left and right ear assemblies connected by an adjustable length headband, ear receiving cavities, stethoscope receiving apertures, and acoustic insulators. Each of the left and right ear assemblies may also include an amplifier assembly including an adjustable volume control.

Provided is a method and shield for shielding a behind-the-ear hearing aid. A Mu metal shielding material is bonded to the external or internal surface of the behind-the-ear hearing aid, the shielding providing effective shielding of electromagnetic radiation in the frequency range of 20 Hz to MHz and effective sound shielding in the audio frequency range of 20 Hz to 20,000 Hz. A hearing canal mold comprised of a rubber-like compound, shaped to encompass and seal an outer portion of a hearing tube of a hearing aid and a user's hearing canal entrance is also provided.

The object is to provide a bone-conduction handset, which has its main body (1) sufficiently isolated from a bone-conduction speaker unit (3) so that: the chances that howling and sound leaking may occur are reduced; and, the handset is improved in easiness in use. In the handset, the speaker unit (3) is mounted on the main body (1) through a speaker mounting member (2) made of a vibration-proof material. The mounting member (2) is characterized by comprising a connection portion (6), which is disposed perpendicularly to both the handset body (1) and the speaker unit (3) in a manner such that the main body (1) and the speaker unit (3) have their opposed inner surfaces disposed adjacent to opposite sides of the connection portion (6), whereby the main body (1) is isolated from the speaker unit (3).

The invention relates to a new-structure railway sound barrier which is mainly formed by combining a plurality of new-structure railway sound barrier unit plates (1). Each new-structure railway sound barrier unit plate (1) is composed of an aluminum alloy housing and a light sound absorbing plate (6), wherein the aluminum alloy housing consists of a bottom aluminum section bar (4), a top aluminum section bar (3), end aluminum section bars (5) at the two ends and a U-shaped panel (2). The two sides of each U-shaped panel (2) are restrained in insertion slots of the aluminum section bars (5) at the two ends; each bottom aluminum section bar (4) and each top aluminum section bar (3) are respectively fixed to the top and the bottom of each U-shaped panel (2) through rivets. Each light sound absorbing plate (6) is fixedly arranged in the aluminum alloy housing through upper and lower aluminum section bar clamping slots; each light sound absorbing plate is made of a light sound absorbing material with high strength, good weather resistance and good sound absorption; and a light receiving surface of each light sound absorbing plate (6) is provided with concave and convex slots (22) with special dimension so as to achieve a better noise reduction effect.

The invention relates to a soft support cantilever beam type silicon micro-piezoelectric microphone chip which comprises a silicon substrate with a square conical hole which is small at the top and big at the bottom in the center, a square compound vibration membrane which consists of a thermal oxidation membrane layer, a first silicon nitride membrane layer, a silicon dioxide membrane layer and asecond silicon nitride membrane layer is covered on the front surface of the silicon substrate, and a first silicon nitride mask layer and a second silicon nitride mask layer with square holes in thecenters thereof are sequentially covered on the back surface; three of four sides of the square compound vibration membrane respectively are etched to form a vertical narrow slot penetrating the square compound vibration membrane, and the vertical projection of each vertical narrow slot is positioned on the inner side of the edge of the square hole in the front surface of the silicon substrate; alower electrode, a piezoelectric membrane and an upper electrode are sequentially deposited on the square compound vibration membrane; one side of the upper electrode is coincided with or near to theside without the narrow slot of the square vibration membrane; and a polyimide membrane which is patterned is deposited on various parts positioned on the front surface of the silicon substrate. Thecantilever beam structure can prevent sound leakage phenomenon and has the advantages of high sensitivity, anti-sound leakage and the like.

A microphone package is constituted of a cover and a mold substrate that is formed in accordance with the resin mold technology so as to form a cavity for embracing a microphone chip. The mold substrate is constituted of a stage having conductivity and a rectangular shape for mounting a microphone chip thereon, a plurality of lead terminals having conductivity and electrically connected to the microphone chip, and a resin mold for electrically insulating the stage from the lead terminals. A sound hole is formed in the mold substrate by use of a cylindrical projection which projects from the backside of the stage and whose distal surface is exposed from the backside of the mold substrate. When the microphone package is mounted on the mounting surface of an external substrate, it is possible to prevent sound from being leaked via gaps therebetween.

The invention discloses a bone conduction sound production device and wearable equipment, wherein the bone conduction sound production device comprises an external packaging structure, the external packaging structure is internally provided with a hollow cavity, and the hollow cavity is internally provided with: a hollow elastic sheet; an exciter, which comprises an upper magnetic piece and a lower magnetic piece, wherein the upper magnetic piece and the lower magnetic piece are oppositely arranged in parallel in the Z-axis direction, and a gap exists between the upper magnetic piece and the lower magnetic piece to form an isolation area; a space low-frequency adjusting plate, which is arranged between the hollowed-out elastic piece and the exciter, wherein the space low-frequency adjusting plate is used for adjusting the framework stacking of the hollowed-out elastic piece and the exciter in the Z-axis direction and adjusting the gap of the isolation area; the hollowed-out elastic piece is matched with the space low-frequency adjusting plate to adjust the effective vibration area of the hollowed-out elastic piece so as to adjust the resonant frequency point of the device. The wearable equipment provided with the bone conduction sound production device can transmit low-frequency signals, wherein the transmission amplitude is moderate, the whole sound frequency band is balanced, the good acoustic effect is achieved, and the user experience and the product sound quality are remarkably improved.

It is an object of the present invention to provide a variable directional capacitor microphone in which two capacitor elements are combined. Each of the capacitor elements includes a vibrating plate and a fixed electrode, and an acoustic resistance can be adjusted in the state that the microphone has been assembled.

As shown in FIG. 2, a variable directional capacitor microphone of this invention includes capacitor elements 10a, 10b. In each of the capacitor elements 10a, 10b, each of vibrating plate supporting members 12a, 12b, each of spacer rings 13a, 13b, each of fixed electrodes 14a, 14b having through holes 141 and each of insulating pedestals 15a, 15b having a through hole in each center of the pedestals are integratedly assembled in this order, respectively, in each of ring-shape cases 16a, 16b. Each of vibrating plates 11a, 11b is strained and fixed on each of vibrating plate supporting members 12a, 12b, respectively. The capacitor elements 10a, 10b are combined through a connecting ring 22 having female screw threads 221 with the insulating pedestal 15a, 15b facing back-to-back. An elastic acoustic resisting member 31 is disposed between the insulating pedestals 15a, 15b. The acoustic resistance of the acoustic resisting member 31 can be adjusted with the lengths of thread engagement of the insulating pedestals 15a, 15b with the connecting ring 22.