This invention discloses a method for optical
interconnection of
silicon photonic chips based on
meniscus-guided additive manufacturing, belonging to the field of
silicon photonic chips. The method includes: in a controlled gas environment, using a printing
material system containing polymers and organic solvents, stretching a liquid bridge between the optical interfaces of two
silicon photonic chips using microneedles, and guiding the movement of the
meniscus to form a
polymer filament connecting the two ends. Subsequently, the
solvent evaporates and solidifies, ultimately forming a free-space
polymer optical
waveguide spanning the chips. This method does not rely on high-energy lasers or
adhesive application and washing processes, and is simple, low-cost, and highly efficient. The fabricated waveguides can achieve controllable spans from hundreds of nanometers to hundreds of micrometers in
diameter and tens of micrometers to millimeters in length. The end faces can be optimized into controllable transition structures, effectively improving
mode matching and
coupling efficiency. It features low
insertion loss, high alignment tolerance, and good
mechanical stability, making it suitable for high-density silicon photonic packaging and heterogeneous integration.