Method for manufacturing thin-film substrate

Abstract

The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. The method for manufacturing the thin-film substrate includes: stacking the thin-film substrate, a tackiness / adhesive agent for temporary fixing and a hard substrate in this order; fixing the thin-film substrate on the hard substrate through the tackiness / adhesive agent; then forming the pattern; and subsequently peeling the thin-film substrate at an interface between the thin-film substrate and the tackiness / adhesive agent.

Description

technical field [0001] The present invention relates to a pattern forming method on a film substrate, more specifically, to a flexible circuit board (FPC), a base substrate of an organic EL panel, or an electronic paper, a driving circuit of a flexible display, a passive matrix or a filter. Fabrication of circuit boards for color devices and touch panels, pattern formation methods on film substrates in film formation processes for solar cells, and adhesives used in these methods. Background technique [0002] Conventionally, substrates such as circuit boards, organic EL panel base substrates, and color filters have rigidity due to their thickness. Therefore, when pattern formation is performed on these substrates, the substrate can be fixed at an accurate position without troublesome handling such as fixing and moving. Pattern formation is performed on these substrates. Actually, the circuit boards of driver circuits, color filters, and touch panels are generally formed on ...

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Problems solved by technology

[0004] In this case, the driving circuit, passive matrix, color filter, touch panel circuit board, etc. need to be patterned on a so-called heat-resistant metal foil or plastic substrate instead of a conventional glass substrate. These metal foils, Since the plastic substrate is a thin film, it is difficult to accurately fix and transport problems.

[0005] In particular, when patterning is performed, positional shifts occur due to slight strain on the substrate, resulting in a significant decrease in yield

In addition, even if the substrate is fixed by an adsorption plate using a porous plate, the position is shifted due to the minute depression of the adsorption part, resulting in problems such as a decrease in yield.

[0006] Therefore, in order to develop the α-Si TFT-EPD display, Philips Corporation (Philips Corporation) proposed the method that the polyimide substrate is separated from the glass by transfer printing technology after polyimide is coated on the glass, and this In some cases, laser annealing is required to remove the glass substrate, and as a result, there are problems in that new equipment is required, and an inexpensive thin-film substrate cannot be used from the viewpoint of heat resistance.

[0007] Furthermore, recently, a roll-to-roll (Roll to Roll) manufacturing process has been tried. In this case, because it is not a conventional batch process, existing TFT equipment cannot be used and new equipment is required.

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