Scribing wheel and method for scribing brittle material substrate

Abstract

Provided is a scribing wheel, which has a long service life with less wearing of a blade edge and can generate a deeper vertical crack as needed, and furthermore, has less blade edge wearing even when a relatively hard substrate, such as a ceramic substrate, is scribed, and generates a vertical crack of a prescribed depth. A plurality of grooves (13) are formed at prescribed intervals on a blade edge (12), i.e., the ridge line of a wheel having an outer diameter within the range of 1 mm-5 mm. The depth (D) of the groove (13) is 25 [mu]m or more, and the length (L) of a ridge line (14) between the grooves is 25 [mu]m or more. The pitch (P) of the groove (13) is preferably within the range of 50 [mu]m-200 [mu]m.

Description

technical field [0001] The present invention relates to a scribing wheel suitable for forming scribing lines on the surface of brittle material substrates and a scribing method for forming scribing lines on the surface of brittle material substrates, in particular to a scribing wheel suitable for use on ceramic substrates (high-temperature fired ceramic multi- Scribing lines are formed on the surface of brittle materials (hard and brittle materials) such as sapphire and silicon that are harder than glass (hard and brittle materials) wheel and marking method. Background technique [0002] In recent years, LTCC substrates have attracted attention as a way to achieve higher density and miniaturization of modules. Especially for high-frequency modules of communication equipment, LTCC substrates are considered to be the best. In its manufacturing process, it is required that the productivity in the cutting process be improved and the cutting cost be reduced. [0003] The method...

AI Technical Summary

Problems solved by technology

(1) Since the general processing speed is very slow at 5-10mm / s, it takes a long time and the productivity is extremely low

(2) Since the thickness of the dicing saw will become chips, the loss of material (cutting loss) cannot be avoided

(3) It is easy to have a gap on the cut surface

(4) Since cooling and washing water must be used, it is not only unable to cope with the environment-friendly MQL (Minimum Quantity Lubrication), but also the substrate cannot be used after mounting

(6) The quality of the cut surface is greatly affected by the diamond grains

(7) The life of the knife is short and the operating cost is high

However, even if the high-permeability scribing wheel used for glass substrates is directly used for cutting hard and brittle materials, the leading edge 12 will be worn in a short time and is not practical.

Also, although the scribing wheel described in Patent Document 2 can prevent sliding to a certain extent, it cannot make vertical cracks extend deeply in the thickness direction of the substrate.

The scribing wheel described in Patent Document 3 is hardly sufficient in terms of the extension of the vertical crack or the lifespan.

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