102results about How to "Lower elastic modulus" patented technology

A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).

Traditional orthodontic treatment often involves the use of basic repositioning devices, such as braces, and the use of supplementary devices, components or accessories to achieve desired end results. Such components may be mounted on fixed, non-removable devices or they may be part of a removable appliance typically worn prior to the application of the fixed devices. As with traditional treatment, it may be desired to utilize similar components when repositioning teeth with removable elastic repositioning appliances. Due to the nature of elastic appliances, such components may take a variety of forms ranging from readily available traditional accessories to specially created devices. Thus, traditional components may be mounted on or embedded in an elastic appliance, or the appliance may be formed to provide similar components. Likewise, the appliance may be modified to provide additional features for specific orthodontic treatments.

A unit load device constructed from fiber reinforced polymer matrix composite materials is described. Individual panels of the unit load device may be customized with composite materials and patterns. The joints are adapted to receive the ends of the panels of the unit load device and may further be customized with fiber reinforced composite materials to strengthen the joint. Some embodiments provide for construction of a unit load device from a variety of fiber reinforcing materials utilizing a matrix of thermoplastic polymers with similar softening temperatures. Each component part within the container was designed and / or created to address the specific needs of the particular part. The unit load devices described herein provide for all composite containers with a significant weight savings from conventional unit load devices.

The present disclosure in one aspect provides a surgical implant comprising an upper bone contacting surface comprising a plurality of irregularly shaped pores having an average pore size, where the pores are formed by a plurality of struts, a lower bone contacting surface comprising a plurality of irregularly shaped pores having an average pore size, wherein the pores are formed by a plurality of struts; and a central body comprising a plurality of irregularly shaped pores having an average pore size, wherein the pores are formed by a plurality of struts, wherein the average pore size on the upper and lower bone contacting surfaces is different than the average pore size on the central body.

A variable stator vane assembly for use in a compressor section of a turbine engine having a plurality of movable metallic stator vanes and a method for making a variable stator vane assembly. The variable stator vane assembly includes a metallic stator casing supporting the vanes and a bushing system positioned between the stator vanes and the stator casings. The bushing system includes a bushing fabricated from a material selected from the group consisting of metal, ceramic or combinations thereof. The variable stator vane further including a titanium nitride wear coating disposed on a surface of the vanes in contact with the bushing system.

A material comprising two or more fibers, wherein each of the fibers has a mechanical modulus, and the mechanical modulus of at least one fiber is higher than the mechanical modulus of another fiber. The higher modulus fiber has a longer length than the lower modulus fiber. In various embodiments, the higher modulus fiber is collagen mimetic and the lower modulus fiber is elastin mimetic. A suture is also described, comprising two or more fibers. At least one of the fibers is elastin-like and has a lower elastic modulus than another fiber that is collagen-like and has a higher elastic modulus. The higher modulus collagen-like fiber is longer than the lower modulus elastin-like fiber.

A fiber-reinforced composite material comprised of reinforcing fibers and a matrix resin, wherein at least some of the reinforcing fibers have their ends in the matrix resin, characterizes in that a second resin having an elastic modulus less than that of the matrix resin is present in contact with fiber ends of at least some of reinforcing fibers having above-mentioned ends and only in the neighborhood thereof.

An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

A method of forming a bonded structure comprises the steps of: mounting a semiconductor device having an electrode; a convexity protruding higher than the electrode and formed of a resin; and a conductive unit electrically coupled to the electrode and extending over the surface of the convexity, onto a specific substrate with an intermediary of a bonding material; and mounting the semiconductor device by hot pressing within a temperature range including the glass transition temperature of the resin.

Disclosed is a method for production of a laminate polishing pad which comprises a reduced number of steps and is excellent in productivity rate, and which causes no detachment between a polishing layer and a cushion layer and can prevent the groove clogging caused by a slurry or the like. Also disclosed is a laminate polishing pad produced by the method. A method for production of a laminate polishing pad, comprising the steps of: preparing a cell-dispersed urethane composition by a mechanical frothing process; ejecting the cell-dispersed urethane composition onto a cushion layer continuously while feeding the cushion layer; curing the cell-dispersed urethane composition while controlling the thickness of the composition evenly to form a polishing layer made of a polyurethane foam, thereby producing a long laminate sheet; and cutting the long laminate sheet.

A low CTE metal-ceramic composite material featuring carbon fibers reinforcing a matrix featuring silicon metal or silicon alloy. The fibers have a low coefficient of thermal expansion (CTE) in the axial direction, and preferably negative. The principles of making Si / SiC composites can be adapted to produce the instant Si matrix composites. The CTE of the composite body depends not only upon the relative CTE's of the fibers and matrix, and their relative amounts (e.g., loadings), but also upon the relative elastic moduli of the fibers and matrix. Thus, Si / SiC matrices produced by a reaction-bonding process inherently possess low CTE, but the instant inventors prefer to make such composites having relatively large fractions of unreacted silicon, thereby driving composite CTE lower still. Here, the carbon fibers are protected from reaction with the silicon infiltrant with one or more materials disposed between the fibers and the infiltrant. Providing at least a degree of toughness or impact resistance can also be realized in these composites. Laminates produce Isotropic or quasi-isotropic properties in the composite body can be realized by, for example, providing the fibers in the form of cross-plied laminates featuring the fibers in parallel or woven arrays.

A surface-protecting pressure-sensitive adhesive sheet includes: a substrate; and a pressure-sensitive adhesive layer that is provided on at least one side of the substrate and made from a polyester-based pressure-sensitive adhesive composition containing a crosslinking agent and a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit. The dibasic acid unit includes a dimer acid, the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of −70 to −20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C. / minute, the polyester-based pressure-sensitive adhesive composition has a hydroxyl value of 20 to 60 mgKOH / g, and the pressure-sensitive adhesive layer has a gel fraction of 85 to 99% by weight.

Provided is a high-performance pneumatic radial tire for passenger cars which uses a hybrid cord composed of an aramid cord and a Nylon 66 cord having different twist counts for the first twist and different twist counts for the second twist, as a reinforcing belt, and thereby has improved high speed durability and steering stability.

A polyolefin base resin composition (A) comprising [I] a 1-butene base polymer in an amount of 1 to 99% by weight, [II] a propylene base resin in an amount of 99 to 1% by weight and a nucleus-forming agent in an amount of 10 ppm or more, wherein [I] the 1-butene base polymer satisfies the requirements of a melting point, a stereospecific index, a molecular weight distribution and a weight average molecular weight. The polyolefin base resin composition (A) provides a film which is excellent in a flexibility and an impact resistance and which rises in a crystal stabilizing rate, and the multilayer laminate in which at least one of outermost layers is constituted from a polyolefin resin composition (B) provides a multilayer film which is improved in a low temperature heat sealing property and a hot tacking property making the best use of an excellent characteristic of crystalline polyolefin.

To have acceptable moisture permeability and enable prevention of deformation due to swelling, the film base material for an adhesive skin patch includes an ether-based urethane resin obtained from at least one member selected from the group consisting of polyoxytetramethylene glycol, butanediol, polyethylene glycol, and polypropylene glycol as a diol component, and methylene diphenyl-diisocyanate as an isocyanate component. The film base material for an adhesive skin patch has a moisture permeability of preferably 800 to 4,000 g / m2·24 hrs. The adhesive skin patch can be produced by forming a pressure-sensitive adhesive layer on one side of the film base material for an adhesive skin patch.

A sealing element comprises two distinct materials of different melting points. An outer shell material has a higher melting point than an inner core material. The core material can be a relatively low melting point metal, plastic or polymer. The seal is positioned in the wellbore and, in response to heating to a selected temperature, such as a bottom hole static temperature, the core material melts or softens. Upon melting or softening of the inner material, the outer shell's elastic modulus decreases, allowing longitudinal compression and radial expansion of the sealing element. The inner material can also thermally expand and thereby assist or cause radial expansion of the outer shell. The sealing element can provide a metal-to-metal seal with a casing or tubing. The cross-sectional shape of the outer shell can take various shapes to promote controlled compression, expansion and sealing.

A curable resin composition comprises: (I) 100 parts by-weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 μm, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

A razor blade and support assembly is provided which flexes in response to shaving forces near slots in the blade support. A razor cartridge includes one or more of the aforementioned razor blade and support assemblies positioned in a housing. The razor cartridge may be permanently or removably coupled to a handle to provide a shaving razor.

A wetsuit is composed multiple panels sewn together in edge-to-edge relationship, each panel comprising a highly stretchable base fabric sandwiched between an outer and inner layer of synthetic rubber, the outer synthetic rubber layer is dense and tough, providing protection against damage by abrasion, while the inner synthetic rubber layer is thicker and less dense, providing the material with a good insulating ability. The outer layer is thinner than the inner layer to compensate for the higher elastic modulus of the denser outer layer, so that the layers stretch uniformly. A thin, colored, chloroprene adhesive coating is provided on the outside of the outer layer, and the outer layer is embossed with a mesh pattern. The seams are blind-stitched through the base fabric from the outside. Because the stretchable fabric is on the inside of the wetsuit material, the wetsuit dries rapidly.

A thermally shock resistant ceramic body, such as a porous ceramic honeycomb structure for a wall flow diesel engine exhaust filter or a flow-through ceramic catalyst support, is formed of a composite ceramic material comprising a major first ceramic phase exhibiting good thermal shock resistance and a minor second phase material that substantially reduces the elastic modulus of the composite ceramic material at elevated temperatures.

A wetsuit is composed multiple panels sewn together in edge-to-edge relationship, each panel comprising a highly stretchable base fabric sandwiched between an outer and inner layer of synthetic rubber, the outer synthetic rubber layer is dense and tough, providing protection against damage by abrasion, while the inner synthetic rubber layer is thicker and less dense, providing the material with a good insulating ability. The outer layer is thinner than the inner layer to compensate for the higher elastic modulus of the denser outer layer, so that the layers stretch uniformly. A thin, colored, chloroprene adhesive coating is provided on the outside of the outer layer, and the outer layer is embossed with a mesh pattern The seams are blind-stitched through the base fabric from the outside. Because the stretchable fabric is on the inside of the wetsuit material, the wetsuit dries rapidly.

A method of fabricating a reactor composed of a coil, a core, and a container, capable of suppressing the core to break when a current flows in the coil to generate magnetic flux. In the method, the coil is formed by spirally winding a conductive wire. The coil is immersed in an insulating film in liquid with electrical insulation. The coil is placed in a furnace. Annealing for the coil and thermosetting for the insulating film are performed at a temperature within 250 to 320° C. for a period of time within 30 minutes to one hour before forming the core in the container. The coil is then disposed in the container. Inside and outside areas of the coil in the container is filled with a resin mixture composed of magnetic powder and resin. The resin mixture in the container is hardened to form the core.

A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 v, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in a range exceeding 3 wt % and In. The inventors have demonstrated that voids decrease at the boundary between the joint material and the electronic component as well as at the boundary between the joint material and the heat conductive member as the content of Ag increases in the overall weight of the joint material. The joint material is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material allows the heat conductive member to efficiently receive heat from the electronic component.

An adhesive film for protecting the surface of a semiconductor wafer wherein the adhesive layer is formed on one surface of a substrate film, the substrate film comprising at least one layer which satisfies the following requisites (A) and at least one of (B) or (C):requisite (A): high elastic modulus properties in which the storage modulus is 1×109 Pa to 1×1010 Pa under the total temperature range of from 18 to 50° C.requisite (B): high elastic modulus properties in which the storage modulus within at least part of the temperature range of from 50 to 90° C. is not more than 1×108 Pa.requisite (C): high elastic modulus properties with expansibility by water absorption in which the size-changing ratio by absorbing water for four hours is 0.05 to 0.5% at 23° C. and 90% RH.

A pressure-sensitive adhesive of the invention includes a (meth)acryl-based polymer obtained by polymerization of a monomer component including: an alkyl(meth)acrylate (a1) having a branched alkyl group of 8 to 24 carbon atoms at an ester end; and an alkyl(meth)acrylate (a2) having a linear alkyl group of 8 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive can has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.

A double sided pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer made from a polyester-based pressure-sensitive adhesive composition containing a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit, a tackifier resin, and a crosslinking agent. The dibasic acid unit includes a dimer acid, the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of −70 to −20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C. / minute, the polyester has a hydroxyl value of 1 to 60 mgKOH / g, the adhesive composition contains 10 to 70 parts by weight of the tackifier resin based on 100 parts by weight of the polyester, and the pressure-sensitive adhesive layer has a gel fraction of 50 to 90% by weight.