1results about How to "Improve joint reliability" patented technology

A semiconductor light-emitting device is provided that improves the bonding reliability of the substrate and the cover, and has high hermetic reliability. A first bonding pattern (6) made of metal is formed on the substrate (1) in a manner surrounding the semiconductor light-emitting element, and a second bonding pattern (5) with a shape corresponding to the first bonding pattern (6) is provided on the base (4c) and flange (4b) of the dome-shaped transparent body. The first and second bonding patterns (5, 6) are bonded together by solder to seal the space inside the convex cover (4a). When viewed from the top surface, the first and second bonding patterns (5, 6) are rectangular rings surrounding the semiconductor light-emitting element. The edges of the corners (51, 61) of the first and second bonding patterns (5, 6) are located on the outer side of the annular base (4c) of the convex cover (4a). The edges of the straight sections (52, 62) sandwiched by the corners (51, 61) of the first and second bonding patterns (5, 6) are located on the semiconductor light-emitting element side of the annular base (4c) of the convex cover (4a).