7results about How to "Improve joint reliability" patented technology

The invention solves the problem of improving the joining reliability. The interposer (1) comprises a dielectric substrate (2), a feedthrough conductor (3), a pad electrode (4), and a protective layer (5). The feedthrough conductor (3) penetrates the dielectric substrate (2). The pad electrode (4) is arranged across a first main face (21) of the dielectric substrate (2) and the feedthrough conductor (3). The pad electrode (4) is connected to the feedthrough conductor (3). The protective layer (5) is provided on the first main face (21) of the dielectric substrate (2). The pad electrode (4) comprises a first portion (41) provided in contact with the first main face (21) of the dielectric substrate (2) and a second portion (42) superposed on the first portion (41). An outer edge of the first portion (41) of the pad electrode (4) is located inside an outer edge of the second portion (42) of the pad electrode (4). A portion of the protective layer (5) is interposed between the first main face (21) of the dielectric substrate (2) and the second portion (42) of the pad electrode (4).

A semiconductor light-emitting device is provided that improves the bonding reliability of the substrate and the cover, and has high hermetic reliability. A first bonding pattern (6) made of metal is formed on the substrate (1) in a manner surrounding the semiconductor light-emitting element, and a second bonding pattern (5) with a shape corresponding to the first bonding pattern (6) is provided on the base (4c) and flange (4b) of the dome-shaped transparent body. The first and second bonding patterns (5, 6) are bonded together by solder to seal the space inside the convex cover (4a). When viewed from the top surface, the first and second bonding patterns (5, 6) are rectangular rings surrounding the semiconductor light-emitting element. The edges of the corners (51, 61) of the first and second bonding patterns (5, 6) are located on the outer side of the annular base (4c) of the convex cover (4a). The edges of the straight sections (52, 62) sandwiched by the corners (51, 61) of the first and second bonding patterns (5, 6) are located on the semiconductor light-emitting element side of the annular base (4c) of the convex cover (4a).

Provided is a semiconductor device having high bonding properties and high air tightness, as well as high reliability and high environmental resistance. The semiconductor light-emitting device comprises: a semiconductor light-emitting element; a substrate on which the semiconductor light-emitting element is mounted and which has a substrate bonding surface covered by a substrate metal layer; and a light-transmitting cap having a window portion for transmitting radiated light from the semiconductor light-emitting element and a flange having a flange bonding surface with a circular inner edge, the light-transmitting cap having a space for accommodating the semiconductor light-emitting element and being sealed and bonded to the substrate, the surface of the flange bonding surface being a metal layer, the flange bonding surface having a flat portion and a pressing ring, the pressing ring being an annular convex portion protruding from the flat portion and concentric with the circular inner edge, and the substrate metal layer and the flange metal layer, the substrate metal layer and the top of the pressing ring are bonded together by a bonding component at a certain interval.

The present invention provides a photovoltaic welding strip and a photovoltaic module, wherein the photovoltaic welding strip comprises a substrate and a coating coated on the outer surface of the substrate, the photovoltaic welding strip is a periodic welding strip segment, and a single period welding strip segment comprises: a first segment body, used to be joined to the front grid line of a photovoltaic cell, wherein the substrate of the first segment body has a square cross section or a square cross section with rounded corners; and a second segment body, used to connect and join adjacent photovoltaic cells. The photovoltaic module comprises at least two photovoltaic cells and the photovoltaic welding strip as described above, wherein the at least two photovoltaic cells are sequentially arranged adjacent to each other through the photovoltaic welding strip.

The present application relates to a display device and an electronic device including the same. The display device of the present application includes a display panel including a first pad, a packaging substrate facing the display panel, and a closed linear shape anisotropic conductive adhesive layer. The packaging substrate includes a glass substrate, at least one insulating layer disposed on one surface of the glass substrate, a signal line disposed on the one surface of the glass substrate, and a second pad electrically connected to the signal line and corresponding to the first pad. The closed linear shape anisotropic conductive adhesive layer is disposed between the display panel and the packaging substrate, bonds the display panel and the packaging substrate, and electrically connects the first pad and the second pad. The display panel includes a semiconductor substrate, a wiring layer disposed on the semiconductor substrate and including the first pad, and a light emitting element disposed on the wiring layer.

This utility model discloses a rotary engine cylinder block with a sleeve, comprising a rotary engine cylinder block and a wear-resistant cast iron cylinder liner. The rotary engine cylinder block has a circular mounting hole; the wear-resistant cast iron cylinder liner is detachably press-fitted into the mounting hole, and the wear-resistant cast iron cylinder liner has a cylinder bore with an inner surface shaped like the number "8". This utility model, through the detachable press-fit method of interference fit between the rotary engine cylinder block and the wear-resistant cast iron cylinder liner, not only ensures structural stability and prevents vibration displacement, but also enhances heat conduction through tight metal bonding, allowing heat from the cylinder liner to be quickly transferred to the cylinder block, thus comprehensively optimizing the basic performance of the cylinder block.

The power supply member is provided with: a bonding member having a bonding surface that can be bonded to the piezoelectric element; at least one contact part provided on the bonding member and electrically connectable to an electrode of the piezoelectric element; and a wiring portion drawn out from the bonding member. When viewed in a first direction intersecting the bonding surface, a connection portion where the bonding member and the wiring portion are connected and the contact portion are located at positions shifted from each other.