The invention provides lead-free tin-based solder for a solar photovoltaic module. The lead-free tin-based solder comprises, by mass, stibium 0.05 percent-0.15 percent, silver 0.01 percent-0.05 percent, copper 0.1 percent-0.4 percent, indium 0.01 percent-0.05 percent, bismuth 0.2 percent-0.5 percent, gallium 0.06 percent-0.10 percent, phosphorus 0.02 percent-0.09 percent and the balance tin and inevitable impurities. The invention further provides a manufacturing method of the lead-free tin-based solder. The manufacturing method comprises the step that stibium, silver, copper, indium, bismuth, gallium, tin and phosphorus are placed into a smelting furnace according to the mass percentage and are smelted in an inert atmosphere or a vacuum condition, and the lead-free tin-based solder for the solar photovoltaic module is obtained. According to the lead-free tin-based solder for the solar photovoltaic module, melting temperature is low, surface gloss is good, surface oxidation resistance is high, wetting performance is good, and welding quality is superior. Besides, the lead-free tin-based solder is economical, environmentally friendly and free of threat to human health, thereby being applicable to large-scale industrial production.