Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method

A technology of touch panel and manufacturing method, applied in the direction of printed circuit manufacturing, input/output process of data processing, conductive layer on insulating carrier, etc., to achieve the effect of simplifying procedures and reagents, and reducing wiring short circuit

Inactive Publication Date: 2013-12-04
TMAY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In order to solve such problems, it is an object of the present invention to provide a method for producing a backing plate for a touch panel that suppresses the phenomenon of residues caused by poor etching of the metal layer.

Method used

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  • Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method
  • Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method
  • Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method

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Embodiment Construction

[0044]Embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily implement. However, the present invention can be embodied in various forms, and is not limited to the embodiments described here. In addition, in the drawings, parts irrelevant to the description are omitted in order to clarify the present invention, and similar reference numerals are assigned to similar parts throughout the specification.

[0045] Throughout the specification, when it is stated that a certain part "includes" a certain technical feature, unless there is no specific contrary statement, this does not mean excluding other technical features, but means that other technical features can be further included.

[0046] image 3 is a cross-sectional view showing step by step a method of manufacturing a backing plate for a touch panel according to an embodiment of the...

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Abstract

PURPOSE: A manufacturing method of a touch panel pad is provided to prevent residue phenomenon due to etching defect of a metal layer. CONSTITUTION: A transparent electrode pattern(331) is formed in a window region of a touch panel on a transparent insulating layer. The transparent electrode pattern is formed in a transparent conductive layer. A line electrode pattern(321) is formed in a region except for a window area of the touch panel on the transparent conductive layer. The line electrode pattern is formed in a metal layer. A transparent conductive layer(330) is formed on the line electrode pattern.

Description

technical field [0001] This invention relates to the manufacturing method of the backing board for touch panels, and the backing board for touch panels manufactured by this manufacturing method. In particular, it relates to a method of manufacturing a backing plate for a touch panel and a backing plate for a touch panel, which can suppress residue phenomena caused by poor etching of a metal layer, etc., and can perform annealing treatment for improving the properties of a transparent conductive layer of the backing plate for a touch panel. backing plate. Background technique [0002] Touch panels widely used as input devices such as video display devices are manufactured using a laminated substrate in which an insulating layer such as glass or insulating resin is coated with a transparent conductive layer such as ITO. [0003] A conventional backing plate for a touch panel is coated with a silver paste for electrical connection to the outside. However, in the case of formi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041H05K3/02
CPCG06F3/041G06F2203/04103H01B5/14H05K3/02
Inventor 朴凖永郑州铉文炯泰卢守牮
Owner TMAY
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