Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., capable of solving problems such as easy deformation, damage to the semiconductor chip 103, and inability of the wiring layer 108 to fully absorb stress, etc.
CN1877824AInactive Publication Date: 2006-12-13SHARP KK
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHARP KK
Publication Date
2006-12-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a semiconductor device, a stacked semiconductor device, and a manufacturing method for semiconductor device. A semiconductor device includes: a base substrate; a semiconductor chip formed on the base substrate in such a manner that an adhesive layer is interposed between the semiconductor chip and the base substrate; a resin layer covering at least a portion of the semiconductor chip; and an external connection terminal electrically connected to the base substrate via a wiring layer. The external connection terminal is in the same plane as the surface of the resin layer, and is exposed from the resin layer. With this configuration, it is possible to provide a semiconductor device of a lower stage, and a stacked semiconductor device, each of which is high in connection reliability in a case of stacking plural semiconductor devices, no matter if a connection terminal of a semiconductor device stacked on an upper stage is low.
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Description

technical field

[0001] The present invention relates to a semiconductor device on which a semiconductor chip is mounted, a stacked semiconductor device configured by stacking a plurality of semiconductor devices, and a method of manufacturing the semiconductor device. Background technique

[0002] In recent years, as electronic equipment tends to be smaller, lighter, and multifunctional, it is required to be able to achieve high-density mounting of semiconductor devices. In order to comply with this requirement, for example, in Japanese Patent Application Publication No. Hei 10-135267 (publication: May 22, 1998), Japanese Patent Application Publication No. 2004-172157 (publication date: 2004 June 17), proposed a method to achieve high-density mounting of semiconductor devices by stacking semiconductor devices.

[0003] According to the prior art structure, when semiconductor devices are stacked, the relationship between the height of the connection terminals of the upper se...

Claims

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