32results about How to "Improve delamination" patented technology

Fiber composite materials using thin plies with a thickness of less than 0.08 mm provide improved delamination resistance and thinner minimum gauge for laminates. Thin plies may be hybridized with conventional plies, interlaced for strength, and used with adhesives as reinforcement in bonding.

According to typical inventive practice, a first metallic material is poured into a mold including a bottom inside surface having regularly arrayed rises (truncated spherical convexities). The molten first metallic material cools and solidifies to include a surface correspondingly having regularly arrayed dents (truncated spherical concavities). The resultant “inner casting” is removed from and repositioned in the mold so that the inner casting's dent-laden surface faces upward. Ceramic spheres are placed in the dents. A second metallic material (having a higher melting point than the first metallic material) is poured into the mold with the inner casting and spheres in place. The molten second metallic material cools and solidifies as an “outer casting” surrounding the inner casting and the spheres. The resultant integral armor structure includes the inner casting, the outer casting, and the spheres, each sphere embedded partially in the inner casting and partially in the outer casting.

A fiber reinforced polymer material having an improved combination of characteristics. The polymer material generally comprises a fiber reinforced polymer resin containing reinforcing fibers and having a porosity between about 0% to about 95% by volume of the polymer material. The fiber reinforced polymer material may form a panel or substrate material that helps resist impact and/or environmental loading. Typically, such a material includes a fiber reinforced thermoplastic or thermoset support layer that has a skin layer on one or both sides, which are joined to one another to form the substrate or panel material. The exterior skin layer typically includes a polymer resin that may also include a support structure, such as reinforcing fibers. The resulting material is typically lightweight and has a reduced basis weight, particularly as compared to current commercial products, in addition to a low thermal expansion such that it provides improved resistance to delamination, improved dimensional stability and flexibility, and decreased water absorption and retention.

A very thin, small outline, thermally enhanced semiconductor package includes a leadframe that is coined to form locking features on an exposed die pad and on a plurality of extremely narrow, closely spaced leads. The coined features improve the mechanical locking between the leadframe and the plastic body of the package to increase their resistance to delamination and subsequent penetration by moisture, and enable reliable wire bonds to be made to the otherwise extremely narrow leads.

Multi-layer films that are suitable for packaging and having improved sealing properties are disclosed. Some embodiments may also provide a lower minimum sealing temperature. A soft polymer is blended in a core layer and a tie layer comprising the soft polymer and, optionally, another polymer. A sealable layer is provided on the side of the tie layer opposite the core layer. The multi-layer films may be transparent, contain a cavitating agent, or are pigmented to form an opaque film. Also, the multi-layer film may be metallized or coated with a barrier coating.

The invention is designed for use in a wafer to define a circuit and a contact window required by next bumping process. The re-wiring layer is located on a wafer's active side and has a line construction mainly comprising a first metal layer, a second metal layer and a conducting layer. Wherein, said conducting layer is mad of aluminum material, and said first and second metal layer are respectively overlapped on each of two side of said conducting layer. The connectivity between the first and second metal layers and a high polymer is higher than the one between said conducting layer and said high polymer. Said first and second metal layer can notably avoid the delaminating between a circuit layer and dielectric layer, and improve the reliability of wafer package.

A method for milling long fibre reinforced composite plastics having at least one unidirectional top layer using a rotating milling tool, wherein work piece and tool are moved in an advancing movement parallel to the work piece cutting face relative to each other, and wherein

• • there is an edge fibre separation angle on the work piece of 0°≦θ_edge≦90°, and
  • the blade of the tool mills the component edge in synchronization.

The invention provides silicon carbide ceramic and a preparation method thereof. The preparation method includes: subjecting a ceramic main raw material, a binder accounting for 2.5-3% of weight of the ceramic main raw material and a dispersant accounting for 1.5-2.5% of the weight of the ceramic main raw material to cold isostatic pressing and liquid phase sintering. Generally, dry pressing is adopted for forming a ceramic material; during dry pressing, various performances of a material are influenced by nonuniform density distribution inside a blank caused by nonuniform pressure distribution; compared with dry pressing, cold isostatic pressing is uniform in pressurizing, pressures received by the material in all directions are identical, and sintering density, bending strength and rupture strength of the material are improved.

The invention relates to a solvent-free epoxy self-leveling floor coating process, which comprises 88.2-95.6 percent of mass of bisphenol type A epoxy resin, 0.4-3.8 percent by mass of fatty amine, 1.5-3.5 percent by mass of n-butyl glycidyl ether, 1.2-3.2 percent by mass of titanium pigment, 0.8-1.2 percent by mass of baryta powder, 0.3-1.5 percent by mass of wetting dispersant, 0.2-1.7 percent by mass of leveling agent, 0.5-1.5 percent by mass of defoaming agent, 0.5-3.8 percent by mass of colored paint and 0.9-3.8 percent by mass of curing agent. Due to the adoption of the solvent-free epoxy self-leveling floor coating process, the phenomena of interlayer stripping, pinholes and the like caused by careless construction improvements can be avoided, and the cement base course binding power of a material is enhanced.

A circuit structure and a manufacturing method thereof are provided. The circuit structure comprises a substrate, a circuit layer forming on the surface of the substrate and a second dielectric layer forming on a first dielectric layer. The circuit layer comprises a first surface and a second surface which are opposite and side surfaces connecting the first surface and the second surface. The circuit layer is in contact with the substrate via the second surface. A reflective index of the second dielectric layer is smaller than the reflective index of the first dielectric layer. An adhesive force between the second dielectric layer and the circuit layer is enhanced by the first dielectric layer, thereby raising the yield rate of the whole circuit structure.

The invention discloses a warning adhesive tape and a preparation method thereof, and belongs to the technical field of industrial adhesive tapes. The warning adhesive tape comprises a transparent PVCfilm, a printing layer, a PVC base material, a bridging agent layer and a glue layer, which are laminated from top to bottom. The preparation method includes stpes of: laminating the PVC base material layer with the printing layer, and then carrying out hot compress lamination on the PVC base material layer and the transparent PVC film; then preparing glue, brushing the top of a PVC base materialwith a printing layer, carrying out hot compress lamination on the PVC base material and a transparent PVC film, coating the bottom of the PVC base material with a layer of bridging agent, coating the bottom of the PVC base material with a layer of glue, and aging, cooling, cutting, and rolling the laminate into an adhesive tape roll to obtain the finished product. The warning adhesive tape prepared by the invention has excellent anti-falling and anti-delaminating effects, high firmness, aging resistance, good weather resistance and edge warping and fading prevention effects, is reliable anddurable, and is suitable for popularization and application.

The invention discloses a method for designing the triangular rubber core structure of a tire. Analysis parameters such as the minimum value of the maximum main strain, the maximum value of the minimum main strain and a strain energy density change cloud chart of a tire triangular rubber core area are taken as the basis. On the basis of finite element analysis, a boundary line of an upper triangular rubber core and a lower triangular rubber core of the tire is obtained according to an equidistant median line method. A preliminary scheme is obtained, then the preliminary scheme is verified andanalyzed according to interpolation and iterative optimization ideas, and an optimal triangular rubber core structure design scheme is obtained. The mechanical property of the triangular rubber core of the radial tire designed on the basis of the method in the scheme is remarkably improved. The durability of the tire can be effectively improved, and the strain energy of the tire and the temperature in a driving process are reduced. The delaminating phenomenon of the triangular rubber core of the tire due to heat generation is effectively prevented. The design method is reliable in principle and convenient to implement and popularize. The structural design efficiency of designers can be effectively improved. A large number of manpower and material resources are saved. The method has important guiding significance for improving the structural performance of the tire.

The invention relates to a strip or lap comprising loops, in the form of a laminate with printed patterns. The laminate for forming a loop strip or lap, in particular the landing zone of nappies, includes at least one nonwoven layer having a lower face and an upper face opposite the lower face; at least one layer of ink applied to the upper face of at least the nonwoven layer; and at least one external textile layer from which loops project externally in order to engage with hooks of a self-fastening hook and loop device, at least one textile layer being secured to the upper face of at least the nonwoven layer.

The invention discloses a mechanical stripping method for preparing high-concentration graphene slurry from graphite and application of the method in preparation of a pole plate material, graphite powder is used as a raw material, lithium generated by in-situ micro-reaction is mechanically sheared, extruded and inserted into atomic interlamellar spacing of the graphite powder, so that the graphite interlamellar spacing is increased, the acting force is reduced, and the high-concentration graphene slurry is prepared. And then separating layers of graphite by multiple actions of medium zirconium bead shearing force increase, graphite surface dynamic bonding, solvation and polymer adsorption to form concentrated graphene slurry with the graphene content of 10-22wt%. The graphene slurry and the carbon fibers are compounded to prepare the polar plate material, and the polar plate material is formed through the procedures of graphene-assisted carbon fiber dividing and fixing, overlapping, heat treatment, mold pressing and the like. The graphene-carbon fiber-based polar plate material prepared by the method has the characteristics of thinness, lightness, corrosion resistance and the like, and is expected to be used for bipolar plates of fuel cells and flow batteries.