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64results about How to "Reduce basis weight" patented technology

Methods of manufacturing a stretched mechanical fastening web laminate

The present invention relates to a method of manufacturing a stretched mechanical fastening web laminate (1) comprising a thermoplastic web layer (13) having two major surfaces, one of the major surfaces bearing a multitude of male fastening elements (14) suitable for engagement with a corresponding female fastening material, and on its other major surface a fibrous web layer (11), said method comprising the steps of(i) providing the fibrous web layer (11) having an initial basis weight,(ii) passing the fibrous web layer (11) through a nip formed by two rolls (101), (103), one of them having cavities (120) that are the negatives of a plurality of male fastening elements (14), introducing a molten thermoplastic resin into the cavities (120) in excess of an amount that would fill the cavities (120) which excess forms the thermoplastic web layer (13), allowing the resin to at least partially solidify and stripping of a precursor web laminate (10) thus formed comprising the fibrous web layer (11) and the thermoplastic web layer (13) bearing a plurality of male fastening elements (14), from the cylindrical roll (103) having cavities (120) whereby the thermoplastic web layer (13) has an initial thickness and an initial hook density, and(iii) stretching the precursor web laminate (10) monoaxially or biaxially thereby decreasing the basis weight of the fibrous web layer (11) and the thickness of the thermoplastic web layer (13) from their respective initial values to provide a stretched mechanical fastening laminate (1) having a basis weight of less than 100 g·m−2.
Owner:3M INNOVATIVE PROPERTIES CO

Lightweight glass fiber reinforced thermoplastic material

InactiveUS20090011210A1Improve flexural and tensile strength and modulus propertyReduce basis weightLamination ancillary operationsLayered product treatmentFlexural strengthFiber
A glass fiber reinforced thermoplastic sheet material is provided in which certain properties, or combinations of properties, are improved relative to similar comparative sheet materials. The sheet material generally comprises a glass mat or glass fabric fiber reinforced thermoplastic resin in which the thermoplastic resin at least partially impregnates the glass mat or fabric. The thermoplastic sheet material contains about 15 wt. % to about 65 wt. % of the glass mat or fabric based on the weight of the thermoplastic sheet material and has a thickness in the range of about 0.4 mm to about 3.0 mm. By including glass mat or fabric and maintaining the sheet thickness in the aforementioned range, the present invention thermoplastic sheet material exhibits improved flexural and/or tensile strength and modulus properties at reduced basis weight compared to a comparative thermoplastic sheet materials. A method of providing the glass fiber reinforced thermoplastic sheet material having an improved combination of flexural strength and modulus and/or tensile strength and modulus properties is also described, in which a first layer of a first thermoplastic resin, a second layer of a second thermoplastic resin, and a layer of glass mat or glass fabric are provided; the first thermoplastic resin layer, the second thermoplastic resin layer and the glass mat or glass fabric layer are arranged such that the glass mat or glass fabric layer is interposed between the first and second thermoplastic resin layers; and heat and pressure are applied to substantially melt and compress the first thermoplastic resin and/or the second thermoplastic resin and to at least partially impregnate the glass mat or glass fabric layer with the molten first thermoplastic resin and/or the molten second thermoplastic resin.
Owner:AZDEL INC

Opening intensive type printed circuit board covering film

Disclosed in the invention is an opening intensive type printed circuit board covering film comprising a polyimide film, an adhesion layer, and a piece of release paper. The release paper is formed by a release agent layer, a first PE layer, a body paper layer and a second PE layer successively. The thickness of the release agent layer is less than 1 micrometer, the thickness of the first PE layer is 10 to 20 micrometers, the thickness of the body paper layer is 40 to 60 micrometers, the thickens of the second PE layer is 10 to 30 micrometers, and the thickness of the release paper is 90 to 100 micrometers; and the basis weight of the release paper is 40 to 60g/m<2> and the release force of the release paper is 2 to 8g/5cm. Because the release paper with low basis weight, low thickness and low release force is used, the covering film has performance of low basis weight and low hygroscopicity and the excellent curling-resistant performance, so that the covering film is especially suitable for the high-density small hole opening and half-cutting printed circuit board. Therefore, the environment protection requirement is met; the environment pollution is reduced; the paperless trend of the covering film in the industry is followed; and the sustainable development demand can be satisfied.
Owner:KUSN APLUS TEC CORP
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