Heat radiation backboard for photovoltaic assembly

A photovoltaic module and heat dissipation backplane technology, applied in photovoltaic power generation, electrical components, semiconductor devices, etc., can solve the problems of inapplicability to large-scale applications, reduced component transportation, and unfavorable metal layers, and achieve high electrical insulation strength and reduced layers. Number, the effect of ensuring work efficiency

Active Publication Date: 2015-12-09
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Too thick metal layer is not conducive to component transportation and cost reduction; and other improvement methods such as coating one or more layers of thermal conductive coating on the surface of traditional PET substrates (CN103383974A, CN103441171A, CN202434552U), due to its

Method used

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  • Heat radiation backboard for photovoltaic assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Preparation of insulating adhesive layer paint: In a container with a stirring device, add 100 parts of polyacrylic resin-propylene tertiary carbonate (parts by mass, the same below), 5 parts of isocyanate, 0.1 part of dibutyltin dilaurate, and the particle size is 1000 mesh 8 parts of glass fiber powder, 5 parts of solvent toluene, stir evenly, make adhesive layer coating liquid, set aside;

[0034] Preparation of weather-resistant layer coating: In a container with a stirring device, add 100 parts of vinylidene chloride resin, 15 parts of hexamethylene diisocyanate trimer, 5 parts of tetrabutyl titanate, 30 parts of alumina powder, and 30 parts of solvent toluene part, stir evenly to prepare a weather-resistant layer coating liquid, and set aside;

[0035] For an aluminum foil with a thickness of 80um, use a wire rod to evenly coat the above-mentioned insulating adhesive layer coating solution on one side, and then dry it in a drying oven at 120°C to form a film, and ...

Embodiment 2

[0037] Preparation of insulating bonding layer paint: In a container with a stirring device, add 100 parts of polyacrylic resin-propylene tertiary carbonate, 20 parts of amino resin, 5 parts of monobutyltin oxide, 30 parts of glass fiber powder with a particle size of 600 mesh, solvent two 30 parts of toluene, stirred evenly, made the bonding layer coating liquid, for subsequent use;

[0038] Preparation of weather-resistant coating: In a container with a stirring device, add 100 parts of vinyl fluoride-vinyl ether copolymer, 5 parts of hexamethylene diisocyanate prepolymer, 0.5 parts of cobalt isooctanoate, and 1 part of boron nitride powder, 5 parts of solvent xylene, stir evenly, make the bonding layer coating liquid, set aside;

[0039] Copper foil with a thickness of 100um, use a wire rod to evenly coat the above-mentioned insulating adhesive layer coating solution on one side, and then dry it in a 120°C drying oven to form a film, and control the thickness of the adhesiv...

Embodiment 3

[0041] Preparation of insulating adhesive layer paint: In a container with a stirring device, add 100 parts of polyacrylic resin-propylene tertiary carbonate, 12 parts of blocked isocyanate, 1 part of monobutyltin triisooctanoate, and glass fiber powder with a particle size of 400 mesh 15 parts, and 15 parts of ethyl acetate as a solvent, and stir evenly to prepare a bonding layer coating liquid, which is set aside.

[0042]Preparation of weather-resistant layer coating: In a container with a stirring device, add 100 parts of vinyl fluoride-vinyl ester copolymer, 13 parts of isophorone diisocyanate trimer, 4 parts of zinc naphthenate, 25 parts of magnesium oxide powder, Solvent ethyl acetate 25 parts, stir evenly, make weather-resistant layer coating liquid, set aside;

[0043] For a tin foil with a thickness of 200um, use a wire rod to evenly coat the above-mentioned insulating adhesive layer coating solution on one side, and then dry it in a 120°C drying oven to form a film,...

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Abstract

The invention relates to a heat radiation backboard for a photovoltaic assembly. The backboard is composed of a metal heat conduction layer, an insulated bonding layer at one side of the metal heat conduction layer and a weather resistant layer at the other side of the metal heat conduction layer, wherein the insulated bonding layer is added with an alkali-free glass fiber powder filling material, the thickness of the bonding layer is 20-50 micrometer, the thickness of the metal heat conduction layer is 50-200 micrometer, and the thickness of the weather resistant coating layer is 8-20 micrometer. Addition of alkali-free glass fiber powder enables high electrical insulation performance of the bonding layer, and when the bonding layer is combined with the metal layer, requirements for insulation performance of the backboard material can be satisfied, and the problem that a traditional resin backboard is low in heat radiation performance is sovled. Compared with a present metal backboard, a common method, in which an insulated high molecular film layer is pasted, is replaced, and the interface thermal resistance is effectively reduced. Compared with the prior art, the whole temperature of the assembly is effectively reduced, and the power generating efficiency of the assembly is improved.

Description

technical field [0001] The invention relates to a photovoltaic module backboard with good heat dissipation performance, belonging to the field of solar cell backboards. Background technique [0002] With the continuous consumption of global fossil energy and the resulting huge energy and environmental problems, the photovoltaic industry, which can convert sunlight into electrical energy, is in the ascendant. During the actual use of photovoltaic modules, they generally need to withstand the damage and erosion of high temperature, ultraviolet radiation, and water vapor. The backsheet is mainly used for the packaging of photovoltaic modules. It has the characteristics of resistance to breakdown, weather resistance, and corrosion resistance, and can play a good role in protecting the modules. [0003] Existing backplane materials are generally composed of several polymer materials, such as TPT, TPE, FPE and other structures, but because the thermal conductivity of polymer mate...

Claims

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Application Information

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IPC IPC(8): H01L31/049H01L31/052
CPCY02E10/50H01L31/0481H01L31/052
Inventor 靳加彬林维红周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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