Method for testing contact thermal resistance among thin-layer materials based on 3-omega method

Abstract

The invention provides a method for testing contact thermal resistance among thin-layer materials based on a 3-omega method. According to the method, the total thermal resistances of a to-be-measured sample pair and a contrast sample are respectively measured by virtue of the 3-omega method, and then the contact thermal resistance is calculated by virtue of a subtraction manner. The method comprises the following steps: overlapping a first to-be-measured sample and a third to-be-measured sample, so as to form the contact-thermal-resistance to-be-measured sample pair; taking a second to-be-measured sample as a contrast object; regulating the size of contact pressure between the first to-be-measured sample and the third to-be-measured sample by virtue of a pressure loading device; connecting a voltage testing unit with heating temperature-measuring metal wires on the surfaces of to-be-measured samples, measuring the total thermal resistances of the to-be-measured sample pair and the second to-be-measured sample, and finally carrying out subtraction so as to obtain the contact thermal resistance. The method has the advantages that the contact thermal resistance among the thin-layer materials can be rapidly measured, and a measurement principle is relatively simpler than the measurement principles of other transient methods.

Description

technical field [0001] The invention belongs to the technical field of contact thermal resistance measurement, in particular to a method for testing the contact thermal resistance between thin-layer materials based on the 3ω method. Background technique [0002] With the rapid development of the electronics industry, the packaging density of electronic devices is getting higher and higher, and the smaller and smaller packaging volumes make the heat dissipation problem of electronic equipment more and more prominent. Studies have pointed out that temperature is one of the main factors affecting the stability and reliability of electronic equipment in electronic systems, and 55% of failures are caused by unreasonable operating temperatures of devices. The contact thermal resistance is an important factor affecting the heat dissipation capability of electronic devices. The existence of contact thermal resistance will definitely hinder the transfer of heat flow on the contact in...

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Problems solved by technology

[0003] In the experimental measurement method of thermal contact resistance, the traditional steady-state method is mainly used, but the steady-state method needs to insert a thermocouple into the upper and lower two samples to be tested during the measurement process. In order to obtain the axial temperature gradient of the sample, it is necessary Multiple temperature measurement points are arranged, so there are high requirements for the geometric dimensions of the sample, and it is diff

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