9 results about "Method test" patented technology

The application discloses a CS101 testing device and method suitable for GJB151 standards, and relates to the technical field of testing devices, and specifically discloses a testing device, which comprises a control module, a waveform generating module, an analog-digital conversion module and a high-speed multiplier module, wherein the control module is connected to the waveform generating module, the analog-digital conversion module and the high-speed multiplier module; the waveform generating module and the analog-digital conversion module are respectively connected to the high-speed multiplier module, and the high-speed multiplier module is used for outputting ripple. The testing device and the testing method of the application replace the complicated manual control of the measuring range and other parameters of an oscilloscope or a receiver by a tester, save a large amount of manpower and time cost, do not need to replace different filters according to different testing frequencies, reduce cost and save time, avoid measurement errors caused by replacement of different filters, reduce the cost of purchasing a signal source, and do not need manual operation, so that complete automatic control of signals is realized.

The utility model relates to the technical field of hydrogen sulfide A method tests, in particular to a hydrogen sulfide A method test timing device which comprises a base, a timing mechanism and a clamping mechanism, the timing mechanism is fixedly installed on the base and used for recording the fracture time in the sample testing process, and the clamping mechanism is detachably installed on the timing mechanism and used for clamping the sample. The clamping mechanism is used for fixing the timing mechanism, the clamping mechanism comprises a mounting plate, an extrusion plate and a limiting mechanism, the mounting plate is detachably mounted on the timing mechanism, the extrusion plate is slidably mounted on the mounting plate, and the limiting mechanism is fixedly mounted on the mounting plate. According to the hydrogen sulfide A method test timing device, through the clamping mechanism and the limiting mechanism, a strain gauge can be clamped and fixedly mounted on a sample, and the strain gauge can be conveniently dismounted, so that the mounting position of the strain gauge on a test can be changed in the test process, and the test efficiency is improved. Therefore, the using effect and the working efficiency of the timing device are improved.

The invention provides a method and device for converting a mind map test case into a meditation case and a medium. The method comprises the following steps: analyzing a mind map test case to obtain test case data, and generating test case sub-data corresponding to each piece of test data in the test case data according to the test case data; and after determining a target product identifier, a case title corresponding to each piece of test data and a target module identifier in combination with the corresponding relationship between the meditation product information, the product identifier, the module name and the module identifier, and the product name in the test case data, calling a new meditation case interface according to the combination of the target test priority, and generating a meditation case. According to the scheme, the mind map test case is analyzed to obtain the case title, the target test priority, the target module identifier and the product identifier, and then the new Zen case interface is called to generate the Zen case, so that the conversion efficiency is improved.

The embodiment of the utility model provides a gas method test device of a penetration piece, the gas method test device adopts an integrated structure design, all devices are integrated in a box body, and each device comprises an inlet, an outlet, an inlet valve, an outlet valve, a flow measurement loop and a bypass loop. During test, the inlet valve and the outlet valve are opened, test gas enters the box body through the inlet, rapid stamping is performed through the bypass loop at the moment, then the flow of the test gas is measured through the flow measurement loop, and then the test gas is input into the penetration piece to be tested through the outlet for test. Flow measurement of test gas in the test process can be achieved by operating the box body in the whole process, operation is easy, and measurement is more accurate.

The application provides a MOS device testing system and a testing method. In the testing system, a multi-gate testing structure comprises a first injection well and a plurality of main gates above the first injection well, a first source-drain contact hole is formed above the substrate on both sides of each main gate, an auxiliary testing structure comprises a second injection well and a plurality of auxiliary gates above the second injection well, a second source-drain contact hole is formed above the substrate on both sides of each auxiliary gate, the auxiliary gates correspond to the main gates one by one, and the number of the source-drain contact holes formed on both sides of the corresponding auxiliary gate and main gate is different. The testing system can extract the relationship between the parasitic capacitance from the gate to the source-drain contact hole and the number of the source-drain contact hole, and the structure of the testing system is simple, which is beneficial to saving the layout area. The testing method tests the parasitic capacitance from the gate to the source-drain contact hole of the MOS device by using the above testing system.

The utility model relates to RC component test technical field especially a kind of fixture for supermicro RC component kelvin four-wire test, including test seat, upper cover and floating pressing plate, the test seat includes base, support seat and four probes, the support seat is fixed on base, and the top of support seat is equipped with test cavity, the bottom wall of test cavity is equipped with test groove and four longitudinal installation grooves, the installation groove is distributed in the four corners of test groove and with test groove partially coincides;Four probes are respectively arranged in installation groove, and the upper end of probe is supported the top wall of installation groove and extends into test groove, and the lower end of probe extends to the outside of base;The depth of test groove is greater than RC component thickness, and the distance between the upper end of probe and the bottom wall of test cavity is less than RC component thickness;The floating pressing plate is movably arranged on the upper cover to hold RC component with probe, and the utility model can realize the safe, stable and accurate kelvin four-wire method test of supermicro RC component.

The utility model discloses an audio monitor testing device. The audio monitor testing device comprises a testing box, a connecting cable and a connector. The test box is connected with the tested audio monitor through the connector connected with one end of the cable, and various function tests can be carried out on a product only by operating the corresponding change-over switch on the test tool panel, so that the problems that a conventional test method is disordered in test site, and the test efficiency is low are solved. The wire clamp is easy to wind, the signal type is difficult to distinguish, the test time is long, the efficiency is low, and the operation error is caused by repeatedly taking the wire clamp. According to the audio monitor testing device, the audio monitor can be rapidly and reliably tested, the problems that manual testing is time-consuming, poor in contact and prone to damage of audio monitor connector pins are solved, the working efficiency is improved, and the testing reliability and safety are improved.

Test systems and methods testing semiconductor package structures including an improved contact blade design that provides improved testing reliability and minimizes damage to the package structure. The contact blade includes a “die pusher” having a lower surface that contacts an upper surface of the package structure in a region including one or more dies and an encapsulant material. The lower surface of the die pusher includes a non-planar contoured shape, such as a convex or concave shape, that is complementary to the non-planar shape of the upper surface of the package substrate. The lower surface of the die pusher includes a trench that corresponds to the location of a gap between adjacent dies of the package structure when the die pusher contacts the upper surface of the package structure. The contact blade may apply pressure more evenly to the package structure to improve test reliability while minimizing damage.