The present invention relates to a method and
system for rapid prediction of PCB insulation life based on accelerated degradation tests. The prediction method includes the following steps: step S1, conducting
bias stress accelerated degradation tests on multiple PCBs under high temperature and
high humidity conditions, collecting various The surface
insulation resistance value of the PCB; step S2, fitting the surface
insulation resistance value of the PCB to obtain a performance degradation trajectory model, and calculating the pseudo-failure life of each PCB according to the performance degradation trajectory model; step S3, constructing a
bias stress acceleration model , calculate the estimated parameters of the
bias stress acceleration model according to the pseudo-failure life, and then obtain the insulation life of the PCB under different bias stresses under high temperature and
high humidity conditions according to the bias stress acceleration model; step S4, construct the high temperature and
high humidity conditions and insulation life A
relational model of life, according to the
relational model, the insulation life of the PCB at
room temperature is obtained. The invention solves the problem of quickly predicting the life of PCB insulation within a limited time by building an acceleration model, and is especially suitable for the technical field of PCB reliability.