Accelerated degradation test based method and system for rapid prediction of PCB insulation life

An accelerated degradation test, insulation life technology, applied in printed circuit testing, electronic circuit testing, etc., can solve a large number of problems, reliability evaluation, and improve forecast costs

Inactive Publication Date: 2016-09-21
YANTAI UNIV
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Problems solved by technology

[0006] In the existing evaluation technology, when evaluating the reliability of long-life products, a large amount of test time is required to collect failure data, which in turn increases

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  • Accelerated degradation test based method and system for rapid prediction of PCB insulation life
  • Accelerated degradation test based method and system for rapid prediction of PCB insulation life
  • Accelerated degradation test based method and system for rapid prediction of PCB insulation life

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[0072] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0073] The following are explanations of terms involved in the present invention and test preconditions.

[0074] Performance degradation refers to a complex physical / chemical process in which the performance of a product changes regularly over time under the combined effects of its internal mechanism and the external environment. When this change reaches the failure threshold, it will cause the product to fail. For some long-life products whose performance degradation process is very slow, the accelerated degradation test method is generally used to obtain performance degradation data. That is, increasing certain stress levels on the premise of ensuring that the failure mechanism of the product remains unchanged, ...

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Abstract

The present invention relates to a method and system for rapid prediction of PCB insulation life based on accelerated degradation tests. The prediction method includes the following steps: step S1, conducting bias stress accelerated degradation tests on multiple PCBs under high temperature and high humidity conditions, collecting various The surface insulation resistance value of the PCB; step S2, fitting the surface insulation resistance value of the PCB to obtain a performance degradation trajectory model, and calculating the pseudo-failure life of each PCB according to the performance degradation trajectory model; step S3, constructing a bias stress acceleration model , calculate the estimated parameters of the bias stress acceleration model according to the pseudo-failure life, and then obtain the insulation life of the PCB under different bias stresses under high temperature and high humidity conditions according to the bias stress acceleration model; step S4, construct the high temperature and high humidity conditions and insulation life A relational model of life, according to the relational model, the insulation life of the PCB at room temperature is obtained. The invention solves the problem of quickly predicting the life of PCB insulation within a limited time by building an acceleration model, and is especially suitable for the technical field of PCB reliability.

Description

technical field [0001] The invention relates to the technical field of PCB insulation life, in particular to a method and system for rapidly predicting PCB insulation life based on accelerated degradation tests. Background technique [0002] As the basic components of electronic equipment, printed circuit boards (PCB) skillfully realize the combination of circuit conduction and substrate insulation. They are widely used in the fields of computers, numerical control, and electronic instruments, and their status is very important. Among them, insulation reliability is one of the two major reliability of PCB, and its reliability level has become an important factor affecting the completion of established tasks of electronic equipment. The insulation properties of PCB are firstly related to the type of substrate. FR-4 epoxy glass cloth copper clad laminate, because of its good mechanical properties and dielectric properties, good heat resistance, and moderate cost, is used in pr...

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2803
Inventor 解传宁应华
Owner YANTAI UNIV
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