The invention relates to the technical field of
data processing, and provides a dynamic load test method and device for a chiplet, and the method comprises the steps: collecting transient
heat flux data generated by the chiplet in a multi-frequency load switching process to generate a thermal dynamic behavior map, calculating a
thermal coupling interference index map according to the thermal dynamic behavior map, and carrying out the testing of the dynamic load of the chiplet according to the
thermal coupling interference index map. And inputting the
thermal coupling interference index diagram into a preset
thermal stability mapping matrix, and generating a small
chip dynamic load behavior evaluation parameter group. By inputting the transient
heat flux data into the preset
thermal stability mapping matrix to generate the small
chip dynamic load behavior evaluation parameter group, the
thermal stability and the overall performance of the small
chip are improved, and the problem that in practical application, the prior art depends on single
thermal monitoring data, and thus the reliability of the small chip is improved is solved. And when the load
switching frequency is relatively high or the load disturbance is relatively large, the potential thermal
coupling interference and the influence of the potential thermal
coupling interference on the
system performance cannot be accurately identified.