Interface thermal resistance measuring method in dissimilar metal compound molding process

A dissimilar metal and process interface technology, which is applied in the heating field of plastic processing of metal materials, can solve problems such as damage, inability to apply dissimilar metal forming interface thermal resistance measurement, contact thermocouple loosening, etc., and achieve the effect of avoiding contact loosening

Inactive Publication Date: 2015-02-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for measuring interface thermal resistance during composite forming of dissimilar metals, so as to solve the problem that the existing interface thermal resistance measurement method cannot be applied because the contact thermocouple is prone to loosening or even damage due to the deformation of the material under heavy load. The problem of interfacial thermal resistance measurement in dissimilar metal forming

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  • Interface thermal resistance measuring method in dissimilar metal compound molding process

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specific Embodiment approach 1

[0014] Specific implementation mode one: combine figure 1 Describe this embodiment, the method of this embodiment includes the following steps: step 1, mark a number of equidistant holes along the longitudinal direction on the dissimilar metal blank, and then fix it between the punch and die of the press, wherein the dissimilar metal blank is formed by the first blank 8 and the second blank 10 are connected together, the contact surface of the first blank 8 and the second blank 10 is an interface and the two are metals with different materials, the dissimilar metal blanks are clamped on the Instron electronic universal material testing machine 6, and the A certain pre-pressure makes the mold clamp the dissimilar metal blank; it ensures the stability of the heat source on both sides of the dissimilar material.

[0015] Step 2. Heat the punch 7 and the die 12 respectively: set the predetermined heating temperature of the punch 7 and the die 12 through the intelligent temperature...

specific Embodiment approach 2

[0020] Specific implementation mode two: combination figure 1 Describe this embodiment. In step 1 of this embodiment, mark a number of equidistant holes along the axial direction on the dissimilar metal blank, and use a vernier caliper to accurately measure and divide the surface of the dissimilar metal blank to mark and punch holes. The distribution of the measuring points of the two materials is guaranteed to be consistent. . Other implementation manners are the same as the specific implementation manner 1.

specific Embodiment approach 3

[0021] Specific implementation mode three: combination figure 1 To illustrate this embodiment, the heating temperature of the male mold in step 2 of this embodiment is 300°C-350°C, and the heating temperature of the concave mold is 200°C-250°C. Other implementation manners are the same as the specific implementation manner 1.

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Abstract

The invention provides an interface thermal resistance measuring method in a dissimilar metal compound molding process, relates to the technical field of heating in metal material plastic processing, and aims to solve the problems that a contact thermocouple is easily loosened, even broken and cannot applied to interface thermal resistance measurement in dissimilar metal formation by adopting an existing interface thermal resistance measuring method because a material is deformed under large load. According to the scheme, the method comprises the following steps: firstly, establishing a temperature field molded by compounding of a dissimilar material; secondly, measuring and collecting information of the temperature field; thirdly, plastically deforming the dissimilar metal material; fourthly, dissolving the interface thermal resistance. The method is used for measuring the interface thermal resistance in the dissimilar metal compound molding process.

Description

technical field [0001] The invention relates to the technical field of heating in plastic processing of metal materials, and more specifically relates to a method for measuring the thermal resistance of metal interfaces in the composite forming process of dissimilar metals. Background technique [0002] With the increasing demand for dissimilar metal composite plates, pipes or components in petrochemical, marine development, nuclear energy utilization, household appliances and national defense industries, higher requirements are placed on the bonding quality of dissimilar metals. For this reason, dissimilar metals It is an effective method to apply a certain temperature, pressure and deformation to make good mechanical and metallurgical compounding at the interface. For example, solid-state hot-pressing methods such as solid-state forging, extrusion and spinning of dissimilar metals can Such processing is possible. When dissimilar metals are hot-compressed in solid state, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 徐文臣单德彬张治朋杨川王悦陈宇
Owner HARBIN INST OF TECH
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