Method for preparing high conductivity diamond/aluminum composite material

An aluminum composite material and diamond technology, applied in the field of high thermal conductivity metal matrix composite materials, can solve the problems of short sintering time, limited size, low vacuum degree, etc., and achieve the effect of long sintering time

Active Publication Date: 2012-07-04
SHANGHAI JIAO TONG UNIV
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the main problems of rapid sintering technologies such as SPS are: (1) fast heating rate, short sintering time, low vacuum degree, insufficient interdiffusion and interface reaction between diamond and aluminum, resulting in poor interface bonding and poor thermal conductivity of materials. (2) The rapid sintering equipment is expensive, and the cost of material preparation is high; (3) The size of the working area of ​​the rapid sintering equipment is small, and the size of the prepared material is limited

Method used

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  • Method for preparing high conductivity diamond/aluminum composite material
  • Method for preparing high conductivity diamond/aluminum composite material
  • Method for preparing high conductivity diamond/aluminum composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0025] First, the diamond with a volume fraction of 20% and 80% aluminum powder are evenly mixed, then cold-pressed into a billet, and then vacuum hot-pressed and sintered. The sintering temperature is 640 ° C, the external pressure is 30 MPa, and the holding time is 60 minutes. The thermal conductivity of the obtained diamond / aluminum composite material is 328W / mK, and the thickness of the atomic diffusion layer produced at the diamond / aluminum interface is 0.8 microns.

Embodiment 2

[0027] First, evenly mix diamond with a volume fraction of 40% and aluminum powder with a volume fraction of 60%, then cold press it into a billet, and then carry out vacuum hot pressing sintering, the sintering temperature is 640°C, the external pressure is 150MPa, the holding time is 60 minutes, and after cooling in the furnace The thermal conductivity of the obtained diamond / aluminum composite material is 486 W / mK, and the thickness of the atomic diffusion layer produced at the diamond / aluminum interface is 0.75 microns.

Embodiment 3

[0029] First, evenly mix diamond with a volume fraction of 70% and 30% aluminum powder, then cold press it into a billet, and then carry out vacuum hot pressing sintering. The sintering temperature is 640°C, the applied pressure is 200MPa, and the holding time is 60 minutes. The thermal conductivity of the obtained diamond / aluminum composite material is 689 W / mK, and the thickness of the atomic diffusion layer produced at the diamond / aluminum interface is 0.82 microns.

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Abstract

The invention discloses a method for preparing a high conductivity diamond / aluminum composite material. The method comprises the following steps of: uniformly mixing diamond and aluminum powder to obtain diamond / aluminum composite powder; performing cold pressing or cold isostatic pressing to obtain a diamond / aluminum powder compact; performing vacuum hot pressed sintering on the compact, and ensuring that an atomic diffusion layer with proper thickness is generated at a diamond / aluminum interface by controlling the sintering temperature and time; and cooling to obtain the high conductivity diamond / aluminum composite material. The atomic diffusion layer with the thickness of 0.01-5.0 micrometers is formed at the diamond / aluminum interface by controlling the temperature and time of the vacuum hot pressed sintering, so that good interface bond can be achieved, low interface thermal resistance can be achieved, and the high conductivity composite material is obtained. The method is simple and feasible, low in production cost and suitable for preparing large-size composite materials.

Description

technical field [0001] The invention relates to a high thermal conductivity metal matrix composite material, in particular to a powder metallurgy preparation method of a high thermal conductivity diamond / aluminum composite material. Background technique [0002] With the continuous development of electronic technology, the power density of electronic components continues to increase, and more and more heat is generated. At the same time, the requirements for lightweight materials are becoming increasingly urgent. Commonly used heat-conducting materials can no longer meet the current rapid development of electronic technology. needs. The development of new high thermal conductivity materials with higher thermal conductivity to dissipate the heat generated by semiconductors in a timely manner and ensure the normal operating temperature of power components has become the key to the development of the electronics industry. The diamond / aluminum composite material not only has th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C26/00C22C1/05
Inventor 李志强谭占秋范根莲张荻
Owner SHANGHAI JIAO TONG UNIV
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