Phase change alloy thermal interface composite material and preparation method thereof

A technology of thermal interface material and phase change alloy, applied in the field of material science and engineering, can solve the problems that thermal interface materials cannot meet the requirements, the service life of electronic devices is shortened, and high temperature curing is required, so as to achieve high productivity and reduce interface heat. Resistant, easy-to-operate effect

Inactive Publication Date: 2016-08-10
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large snap-in force is required to achieve a thinner thickness and finally achieve low thermal resistance; and problems of overflow and phase separation are prone to occur during use
Although the thermal conductive adhesive will not overflow, it needs to be cured at high temperature during use.
With the gradual development of electronic device...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Weigh 4.3gBi, 2.1gSn, 4.9gIn respectively, after uniform mixing, under the protection of nitrogen, heat to 300°C, the mixed powder melts, after stirring uniformly for 1 hour, cool to room temperature, and solidify to obtain a low melting point alloy ingot, the low melting point Transfer the alloy ingot to a beaker and heat it in a water bath at 80°C to obtain a low-melting point alloy; then add 2g of diamond powder to the low-melting point alloy, stir at 400rpm for 30 minutes, and after solidification at room temperature, use a double-barrel roller press to form a 0.2mm thermal conductivity alloy foil.

Embodiment 2

[0031] Weigh 5.8gBi and 4.2gSn respectively, after uniform mixing, heat to 400°C under the protection of nitrogen, the mixed powder melts, after uniform stirring for 1 hour, cool to room temperature, solidify to obtain low melting point alloy ingot, transfer the low melting point alloy ingot Put it into a beaker and heat it in a water bath at 80°C to obtain a low-melting point alloy; then add 6g of BN powder to the low-melting point alloy, stir at 400rpm for 30 minutes, and after curing at room temperature, press it into a 0.2mm heat-conducting alloy foil with a double-barrel roller press .

Embodiment 3

[0033] Weigh 0.35gBi, 8.65gSn, 4.5gIn, 5.5gZn respectively, after uniform mixing, under the protection of nitrogen, heat to 700°C, the mixed powder melts, after uniform stirring for 1 hour, cool to room temperature, and solidify to obtain a low melting point alloy ingot, Transfer the low-melting point alloy ingot to a beaker and heat it in a water bath at 80°C to obtain a low-melting point alloy; add 6g of Al to the low-melting point alloy 2 o 3 The powder was stirred at 400rpm for 30 minutes, and after being solidified at room temperature, it was pressed into a 0.2mm heat-conducting alloy foil with a double-barrel roller press.

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PUM

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Abstract

The invention relates to a phase change alloy thermal interface composite material. Raw materials used for preparing the phase change alloy thermal interface composite material include low-melting point alloy and a heat conduction filler, and the heat conduction filler accounts for 5-85% of the total mass of the low-melting point alloy; and the low-melting point alloy includes two or above meltable metals. The low-melting point phase change alloy thermal interface composite material is in a molten state after a low melting point is reached, has extremely lower viscosity and better fluidity than heat conduction pastes, further fills gaps in the interface, greatly reduces the interface thermal resistance, and is an extremely good thermal interface material; and the low-melting point alloy is used as a dispersant, and the high conduction filler is added to the low-melting point alloy, so the composite material has dual characteristics of high heat conductivity and low interface thermal resistance.

Description

technical field [0001] The invention relates to a thermal interface composite material, in particular to a phase change alloy thermal interface composite material; the invention also relates to a preparation method of a phase change alloy thermal interface material, which belongs to the field of material science and engineering. Background technique [0002] There are very fine uneven gaps between the surface of the electronic heat source device and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the base area of ​​the heat sink, and the rest are air gaps. Because the thermal conductivity of air is only 0.024W / (m·K), it is a poor conductor of heat, which leads to a very large contact thermal resistance between the electronic components and the heat sink, which seriously hinders the conduction of heat, and finally causes the performance of the heat sink to be low. . By filling the gap with a thermal interface materi...

Claims

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Application Information

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IPC IPC(8): C09K5/06C22C26/00C22C30/04C22C32/00C22C30/06
CPCC09K5/063C22C12/00C22C13/00C22C26/00C22C28/00C22C30/04C22C30/06C22C32/0042C22C32/0068
Inventor 温淏然纪亚强符显珠孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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