Boron nitride-silver/cellulose composite material and preparation method thereof

Abstract

The invention discloses a boron nitride-silver / cellulose composite material, which is prepared from boron nitride nanosheets, cellulose and silver nanoparticles, wherein the silver nanoparticles are bridged with the at least two boron nitride nanosheets along the horizontal directions of the boron nitride nanosheets, so that boron nitride-silver hybrid filler is formed; the cellulose isolates the two adjacent layers of stacked boron nitride-silver hybrid filler. The invention also discloses a preparation method of the boron nitride-silver / cellulose composite material. According to the boron nitride-silver / cellulose composite material provided by the invention, the interface thermal resistance in boron nitride is effectively reduced by means of the bridging action of the silver nanoparticles, so that high heat-conducting property is realized; furthermore, the boron nitride-silver / cellulose composite material also has excellent flexibility, thus having a better application effect in the fields such as micro-electronics, electrical machinery and electric appliances.

Description

technical field [0001] The invention belongs to the technical field of functional materials, and in particular relates to a boron nitride-silver / cellulose composite material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration and assembly technology, the volume of electronic components and logic circuits has been reduced exponentially, and the operating frequency has increased sharply, resulting in the rapid accumulation of heat generated by electronic equipment and the increase in the operating temperature of electronic components. Therefore, the life of the equipment is also reduced; in order to solve this problem, corresponding measures must be taken to dissipate the heat generated by the electronic components in time. [0003] Polymer materials are widely used as substrates and packaging materials for electronic components and logic circuits due to their excellent mechanical strength, but generally po...

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Problems solved by technology

[0005] At the same time, Ag, as one of the traditional thermal conductive materials, also has excellent thermal conductivity, but for technical fields such as electronic packaging, the high conductivity of Ag is the biggest obstacle to the selection of fillers.

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