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Pump-driven two-phase circuit device for heat dissipation of high heat flux electronic device

A technology of electronic devices and circuits, used in instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of local temperature exceeding its working temperature, large scale of water cooling system, etc., to reduce fluid resistance and enhance heat transfer. effect, the effect of improving the heat transfer effect

Active Publication Date: 2017-12-08
BEIJING INST OF SPACECRAFT SYST ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the computing speed of the computer is further accelerated, the heat consumption of a single chassis of the next-generation supercomputer can reach 600KW, and the local heat flux density can reach 30W / cm 2 ,The heat consumption of the entire supercomputer reaches 30MW. If the water cooling system is still used at this time, on the one hand, the local temperature of the CPU will exceed its operating temperature.

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  • Pump-driven two-phase circuit device for heat dissipation of high heat flux electronic device
  • Pump-driven two-phase circuit device for heat dissipation of high heat flux electronic device
  • Pump-driven two-phase circuit device for heat dissipation of high heat flux electronic device

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Embodiment Construction

[0041] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0042] Such as figure 1As shown, it is a schematic flow diagram of a pump-driven two-phase circuit for heat dissipation of high heat flow electronic devices in the present invention, including a liquid reservoir 1, an evaporator 9, a condenser 10 and a fluid pipeline 11, and the working medium comes out from the evaporator 9 through the fluid After the pipeline 11 enters the condenser 10, it returns from the condenser 11 to the evaporator 9, and the lower end of the liquid receiver 1 communicates with the fluid pipeline 11 and exchanges the working medium; the working medium in the evaporator 9 is in the condenser Condensation in 10, the heat is dissipated from the pump-driven two-phase fluid circuit to the external environment; the fluid pipeline 11 is used to form a circuit in which the fluid can flow;

[0043] Such as figure 2 As shown, it is a schem...

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Abstract

The invention provides a pump-driven two-phase circuit device for heat dissipation of a high heat flux electronic device. Heat is collected and transported by using an endothermic process in evaporation and an exothermic process in condensation during a circulation flow process of a working medium. An evaporator for the circuit device comprises micro-channels and fins. In an area of high heat flux, the micro-channels are used to dissipate heat and increase a heat transfer coefficient of a partial area, while in an area of low heat flux, the fins are used. Due to great area difference between the micro-channel area and the fin area in the evaporator, when the working medium in the micro-channels enters the fin area, volume quickly expands and temperature of the working medium reduces, so as to help heat dissipation of the device in the fin area. By using different structures and with little resources, heat dissipation problems of devices with different powers are solved. The pump-driven two-phase circuit device for heat dissipation of the high heat flux electronic device can adapt to heat dissipation of electronic devices with different heat flux densities and can satisfy working requirements of electronic devices with a heat flux density of 50 W / cm<2> or above.

Description

technical field [0001] The invention belongs to the technical field of heat control, and in particular relates to a pump-driven two-phase circuit device for heat dissipation of high heat flow electronic devices. Background technique [0002] With the development of the Internet and information technology, the demand for large-scale data storage and data processing is increasing, which puts forward higher requirements for the computing speed and performance of electronic devices, and temperature control has become a key factor restricting its development. [0003] Take server cabinets that integrate a large number of electronic devices as an example. The first generation of cabinets uses air cooling, and the power of a single cabinet is generally 3 to 4 kilowatts. The second generation uses a combination of water cooling and air cooling, and the power of the cabinet can reach Dozens or even hundreds of kW. A typical application is a supercomputer. A large number of high-heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
Inventor 于新刚徐侃苗建印满广龙陈灵王德伟
Owner BEIJING INST OF SPACECRAFT SYST ENG
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