Pump-driven two-phase circuit device for heat dissipation of high heat flux electronic device

Abstract

The invention provides a pump-driven two-phase circuit device for heat dissipation of a high heat flux electronic device. Heat is collected and transported by using an endothermic process in evaporation and an exothermic process in condensation during a circulation flow process of a working medium. An evaporator for the circuit device comprises micro-channels and fins. In an area of high heat flux, the micro-channels are used to dissipate heat and increase a heat transfer coefficient of a partial area, while in an area of low heat flux, the fins are used. Due to great area difference between the micro-channel area and the fin area in the evaporator, when the working medium in the micro-channels enters the fin area, volume quickly expands and temperature of the working medium reduces, so as to help heat dissipation of the device in the fin area. By using different structures and with little resources, heat dissipation problems of devices with different powers are solved. The pump-driven two-phase circuit device for heat dissipation of the high heat flux electronic device can adapt to heat dissipation of electronic devices with different heat flux densities and can satisfy working requirements of electronic devices with a heat flux density of 50 W/cm<2> or above.

Description

technical field [0001] The invention belongs to the technical field of heat control, and in particular relates to a pump-driven two-phase circuit device for heat dissipation of high heat flow electronic devices. Background technique [0002] With the development of the Internet and information technology, the demand for large-scale data storage and data processing is increasing, which puts forward higher requirements for the computing speed and performance of electronic devices, and temperature control has become a key factor restricting its development. [0003] Take server cabinets that integrate a large number of electronic devices as an example. The first generation of cabinets uses air cooling, and the power of a single cabinet is generally 3 to 4 kilowatts. The second generation uses a combination of water cooling and air cooling, and the power of the cabinet can reach Dozens or even hundreds of kW. A typical application is a supercomputer. A large number of high-heat...

AI Technical Summary

Problems solved by technology

When the computing speed of the computer is further accelerated, the heat consumption of a single chassis of the next-generation supercomputer can reach 600KW, and the local heat flux density can reach 30W / cm 2 ,The heat consumption of the entire supercomputer reaches 30MW. If the water cooling system is still used at this time, on the one hand, the local temperature of the CPU will exceed its operating temperature.

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